|
|
NXP |
FET RF 65V 1.88GHZ NI780
- Transistor Type: LDMOS
- Frequency: 1.88GHz
- Gain: 17dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.1A
- Power - Output: 125W
- Voltage - Rated: 65V
- Package / Case: NI-780
- Supplier Device Package: NI-780
|
Package: NI-780 |
Stock5,200 |
|
|
|
NXP |
TRANS RF NPN 2GHZ 8V SOT143
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 8V
- Frequency - Transition: 1.9GHz
- Noise Figure (dB Typ @ f): -
- Gain: 7dB
- Power - Max: 400mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 50mA, 5V
- Current - Collector (Ic) (Max): 250mA
- Operating Temperature: 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-253-4, TO-253AA
- Supplier Device Package: SOT-143B
|
Package: TO-253-4, TO-253AA |
Stock2,064 |
|
|
|
NXP |
IC REG LIN 2.85V/2.85V 6WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 2
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.85V, 2.85V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.4V @ 300mA, 0.4V @ 300mA
- Current - Output: 300mA, 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 75µA
- PSRR: 80dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Soft Start
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 6-XFBGA, WLCSP
- Supplier Device Package: 6-WLCSP (1.2x0.80)
|
Package: 6-XFBGA, WLCSP |
Stock7,872 |
|
|
|
NXP |
IC SWITCH HIGH SIDE QUAD 24QFN
- Switch Type: General Purpose
- Number of Outputs: 4
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 6 V ~ 20 V
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Current - Output (Max): -
- Rds On (Typ): 10 mOhm, 12 mOhm
- Input Type: -
- Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 24-PowerQFN
- Supplier Device Package: 24-PQFN (12x12)
|
Package: 24-PowerQFN |
Stock5,424 |
|
|
|
NXP |
IC SMPS CTLR W/PWR SWITCH 7-SOIC
- Output Isolation: -
- Internal Switch(s): Yes
- Voltage - Breakdown: 700V
- Topology: Flyback
- Voltage - Start Up: 17V
- Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V
- Duty Cycle: 75%
- Frequency - Switching: 22.5kHz ~ 50.5kHz
- Power (Watts): 5W
- Fault Protection: Over Temperature, Over Voltage, Short Circuit
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
- Supplier Device Package: 7-SO
- Mounting Type: Surface Mount
|
Package: 8-SOIC (0.154", 3.90mm Width) 7 leads |
Stock2,736 |
|
|
|
NXP |
IC D-TYPE POS TRG DUAL 56SSOP
- Function: Master Reset
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 2
- Number of Bits per Element: 9
- Clock Frequency: 190MHz
- Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 1mA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-BSSOP (0.295", 7.50mm Width)
|
Package: 56-BSSOP (0.295", 7.50mm Width) |
Stock2,208 |
|
|
|
NXP |
IC I/O EXPANDER 16BIT 24UFBGA
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.65 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-UFBGA
- Supplier Device Package: 24-UFBGA (2x2)
|
Package: 24-UFBGA |
Stock3,952 |
|
|
|
NXP |
IC CAN TRANSCEIVER 5V HS 8-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 150mV
- Data Rate: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,960 |
|
|
|
NXP |
IC ANALOG SWITCH SPDT 10XQFN
- Applications: Audio
- Multiplexer/Demultiplexer Circuit: 2:1
- Switch Circuit: SPDT
- Number of Channels: 2
- On-State Resistance (Max): 1.3 Ohm
- Voltage - Supply, Single (V+): 1.8 V ~ 5 V
- Voltage - Supply, Dual (V±): -
- -3db Bandwidth: 100MHz
- Features: Break-Before-Make
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 10-XFQFN
- Supplier Device Package: 10-XQFN (1.4x1.8)
|
Package: 10-XFQFN |
Stock7,408 |
|
|
|
NXP |
IC MPU Q OR IQ 800MHZ 425TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 4.4
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
- Package / Case: 425-FBGA
- Supplier Device Package: 425-TEPBGA I (19x19)
|
Package: 425-FBGA |
Stock6,352 |
|
|
|
NXP |
IC MPU MPC85XX 600MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock7,808 |
|
|
|
NXP |
IC MPU MPC83XX 266MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
|
Package: 620-BBGA Exposed Pad |
Stock5,264 |
|
|
|
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
- Core Processor: PowerPC e300c4s
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Security; SEC 3.0
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (4)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
|
Package: 689-BBGA Exposed Pad |
Stock3,760 |
|
|
|
NXP |
IC MPU MPC83XX 400MHZ 668BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 668-BBGA Exposed Pad
- Supplier Device Package: 668-PBGA-PGE (29x29)
|
Package: 668-BBGA Exposed Pad |
Stock6,704 |
|
|
|
NXP |
IC MCU 8BIT 32KB FLASH 42PSDIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: I2C, IRSCI, SCI, SPI
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 30
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 42-SDIP (0.600", 15.24mm)
- Supplier Device Package: 42-PSDIP
|
Package: 42-SDIP (0.600", 15.24mm) |
Stock5,184 |
|
|
|
NXP |
IC MCU 16BIT 1MB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock3,696 |
|
|
|
NXP |
IC MCU 16BIT 32KB FLASH 100LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 80
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
|
Package: 100-LQFP |
Stock5,232 |
|
|
|
NXP |
IC MCU 16BIT 128KB FLASH 48QFN
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
|
Package: 48-VFQFN Exposed Pad |
Stock4,624 |
|
|
|
NXP |
IC MCU 8BIT 8KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 37
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
|
Package: 44-LQFP |
Stock3,776 |
|
|
|
NXP |
IC MCU 8BIT 48KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
|
Package: 44-LQFP |
Stock8,940 |
|
|
|
NXP |
IC VIDEO DAC 10BIT TRIPLE 48LQFP
- Number of Bits: 10
- Number of D/A Converters: 3
- Settling Time: -
- Output Type: Current - Unbuffered
- Differential Output: Yes
- Data Interface: Parallel
- Reference Type: Internal
- Voltage - Supply, Analog: 3 V ~ 3.6 V
- Voltage - Supply, Digital: 3 V ~ 3.6 V
- INL/DNL (LSB): ±1.8 (Max), ±0.9 (Max)
- Architecture: String DAC
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
- Mounting Type: -
|
Package: 48-LQFP |
Stock4,064 |
|
|
|
NXP |
SENSOR TEMPERATURE I2C 8TSSOP
- Sensor Type: Digital, Local
- Sensing Temperature - Local: -55°C ~ 125°C
- Sensing Temperature - Remote: -
- Output Type: I2C
- Voltage - Supply: 2.8 V ~ 5.5 V
- Resolution: 10 b
- Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest): ±2°C (±3°C)
- Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
- Operating Temperature: -55°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package: 8-TSSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,498 |
|
|
|
NXP |
SENS PRESSURE 29 PSI MAX MPAK
- Pressure Type: Absolute
- Operating Pressure: 29.01 PSI (200 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -
- Voltage - Supply: 10 V ~ 16 V
- Port Size: Male - 0.12" (2.97mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 5-SMD Module
- Supplier Device Package: 5-MPAK
|
Package: 5-SMD Module |
Stock7,764 |
|
|
|
NXP |
IC MIFARE SAM AV2 32HVQFN
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443, MIFARE
- Interface: UART
- Voltage - Supply: 2.7 V ~ 3.3 V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
|
Package: 32-VFQFN Exposed Pad |
Stock3,690 |
|
|
|
NXP |
MIFARE CLASSIC SMART CARD IC
- Type: RFID Transponder
- Frequency: 13.56MHz
- Standards: ISO 14443, MIFARE
- Interface: UART
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C
- Package / Case: MOA8, Smart Card Module
- Supplier Device Package: PLLMC
|
Package: MOA8, Smart Card Module |
Stock8,676 |
|
|
|
NXP |
S12Z CORE, 128K FLASH, LIN, 64LQ
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 9x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-HLQFP (10x10)
|
Package: - |
Request a Quote |
|
|
|
NXP |
POWER MANAGEMENT IC, I.MX8, PRE-
- Applications: Processor
- Current - Supply: 10µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
|
Package: - |
Request a Quote |
|
|
|
NXP |
CAR DISP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|