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NXP |
MOSFET N-CH 30V 23.7A 8SOIC
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 23.7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 30.3nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 2800pF @ 20V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 6.25W (Tc)
- Rds On (Max) @ Id, Vgs: 6.5 mOhm @ 14A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SO
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,280 |
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NXP |
FET RF 66V 880MHZ NI-860C3
- Transistor Type: LDMOS
- Frequency: 880MHz
- Gain: 20dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.6A
- Power - Output: 47W
- Voltage - Rated: 66V
- Package / Case: NI-860C3
- Supplier Device Package: NI-860C3
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Package: NI-860C3 |
Stock4,176 |
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NXP |
FET RF 65V 1.93GHZ NI-880S
- Transistor Type: LDMOS
- Frequency: 1.93GHz
- Gain: 11.5dB
- Voltage - Test: 26V
- Current Rating: -
- Noise Figure: -
- Current - Test: 750mA
- Power - Output: 90W
- Voltage - Rated: 65V
- Package / Case: NI-880S
- Supplier Device Package: NI-880S
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Package: NI-880S |
Stock2,464 |
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NXP |
FET RF 2CH 65V 2.5GHZ NI1230S-4
- Transistor Type: LDMOS
- Frequency: 2.5GHz
- Gain: 14.1dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 700mA
- Power - Output: 50W
- Voltage - Rated: 65V
- Package / Case: NI-1230-4LS2L
- Supplier Device Package: NI-1230-4LS2L
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Package: NI-1230-4LS2L |
Stock6,928 |
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NXP |
FET RF 68V 1.99GHZ NI-880S
- Transistor Type: LDMOS
- Frequency: 1.93GHz ~ 1.99GHz
- Gain: 16dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.15A
- Power - Output: 29W
- Voltage - Rated: 68V
- Package / Case: NI-880S
- Supplier Device Package: NI-880S
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Package: NI-880S |
Stock7,836 |
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NXP |
TRANS PREBIAS PNP 250MW SMT3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 1k
- Resistor - Emitter Base (R2) (Ohms): 1k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 33 @ 50mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
- Current - Collector Cutoff (Max): 500nA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,088 |
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NXP |
IC MOTOR DRIVER PAR 24QFN
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: Battery Powered
- Current - Output: 700mA
- Voltage - Supply: 2.7 V ~ 5.6 V
- Voltage - Load: 2 V ~ 6.8 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN-EP (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock2,912 |
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NXP |
IC MOTOR DRIVER PAR 16QFN
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: Parallel
- Technology: Power MOSFET
- Step Resolution: -
- Applications: Camera
- Current - Output: 400mA
- Voltage - Supply: 2.7 V ~ 5.5 V
- Voltage - Load: 2.7 V ~ 5.5 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-QFN (3x3)
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Package: 16-VFQFN Exposed Pad |
Stock14,064 |
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NXP |
IC LED DRIVER AUTO 14HVSON
- Type: -
- Topology: -
- Internal Switch(s): -
- Number of Outputs: -
- Voltage - Supply (Min): -
- Voltage - Supply (Max): -
- Voltage - Output: -
- Current - Output / Channel: -
- Frequency: -
- Dimming: -
- Applications: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,560 |
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NXP |
IC 10BIT BUS INTRFC LATCH 24SSOP
- Logic Type: D-Type Transparent Latch
- Circuit: 10:10
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 4ns
- Current - Output High, Low: 32mA, 64mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 24-SSOP
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Package: 24-SSOP (0.209", 5.30mm Width) |
Stock3,488 |
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NXP |
IC TRANSCVR TRI-ST 32BIT 96BGA
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock5,776 |
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NXP |
IC I/O EXPANDER I2C 8B 20SSOP
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 1MHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock32,160 |
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NXP |
IC ANLG SWITCH DPDT 16XQFN
- Switch Circuit: DPDT
- Multiplexer/Demultiplexer Circuit: 2:2
- Number of Circuits: 2
- On-State Resistance (Max): 3.3 Ohm
- Channel-to-Channel Matching (ΔRon): 700 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 40ns, 20ns
- -3db Bandwidth: 200MHz
- Charge Injection: 4pC
- Channel Capacitance (CS(off), CD(off)): 8pF
- Current - Leakage (IS(off)) (Max): 5nA
- Crosstalk: -90dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-XFQFN
- Supplier Device Package: 16-XQFN (1.8x2.6)
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Package: 16-XFQFN |
Stock4,704 |
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NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock6,592 |
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NXP |
IC MPU Q OR IQ 1.333GHZ 780FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SC3850 - Dual
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 780-BFBGA, FCBGA
- Supplier Device Package: 780-FCBGA (23x23)
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Package: 780-BFBGA, FCBGA |
Stock5,808 |
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NXP |
IC SOC 2CORE 1200MHZ SW 780FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L/4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (12)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-FBGA, FCBGA |
Stock6,608 |
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NXP |
IC MPU MPC8XX 133MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock4,992 |
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NXP |
IC MCU 8BIT 4KB OTP 44PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 26
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 192 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (17.525x17.525)
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Package: 44-LCC (J-Lead) |
Stock6,096 |
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NXP |
IC MCU 32BIT 128KB FLASH 48QFN
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 33
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,336 |
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NXP |
MINI HIGH-SPEED CAN COMPANION SY
- Applications: System Basis Chip
- Interface: CAN
- Voltage - Supply: 5V
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock4,816 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORES
- Core Processor: e200z7
- Core Size: 32-Bit Tri-Core
- Speed: 264MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 8MB (8M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16b Sigma-Delta, eQADC
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BGA
- Supplier Device Package: 416-MAPBGA (27x27)
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Package: 416-BGA |
Stock7,888 |
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NXP |
16-BIT MCU S12X CORE 512KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock5,664 |
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NXP |
32 BIT SINGLE CORE 2M FLASH 2
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, I²S, POR, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Package: 100-LBGA |
Stock3,584 |
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NXP |
KINETIS K 32-BIT MCU ARM CORTEX
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 31x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-FQFP (12x12)
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Package: 80-LQFP |
Stock3,520 |
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NXP |
16-BIT MCU S12 CORE 48KB FLASH
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,112 |
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NXP |
IC
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
AUTO SBC
- Applications: -
- Current - Supply: 30µA
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 32-PowerWFQFN
- Supplier Device Package: 32-HWQFN (5x5)
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Package: - |
Request a Quote |
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