Page 352 - NXP Products | Heisener Electronics

BUK652R0-30C,127
NXP

MOSFET N-CH 30V 120A TO220AB

Package: TO-220-3

Stock3,856
ON5250/A,135
NXP

MOSFET RF SOT223 SC-73

Package: TO-261-4, TO-261AA

Stock4,912
A2T18H160-24SR3
NXP

IC TRANS RF LDMOS

Package: NI-780S-4L2L

Stock7,344
A2T21S160-12SR3
NXP

IC TRANS RF LDMOS

Package: NI-780-2S2L

Stock3,840
BC639,126
NXP

TRANS NPN 80V 1A TO-92

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock7,296
74HCT40105N,112
NXP

IC 4X16 FIFO REGISTER 16-DIP

Package: 16-DIP (0.300", 7.62mm)

Stock3,824
SC16C852SVIET,115
NXP

IC UART DL 1.8V W/FIFO 36-TFBGA

Package: 36-TFBGA

Stock5,680
M83242G13
NXP

IC C1K 450MHZ VOIP 448BGA

Package: -

Stock3,824
MC33742PEG
NXP

IC SYSTEM BASE W/CAN 28SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock301,680
HEC4066BT,118
NXP

IC SWITCH QUAD 2X1 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock6,288
MPC8535AVTATHA
NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock2,928
MPC8567EVTANGG
NXP

IC MPU MPC85XX 800MHZ 1023FCBGA

Package: 1023-BBGA, FCBGA

Stock7,632
MCIMX233CJM4B
NXP

IC MPU I.MX23 454MHZ 169MAPBGA

Package: 169-LFBGA

Stock7,088
KMPC8349VVALFB
NXP

IC MPU MPC83XX 667MHZ 672TBGA

Package: 672-LBGA

Stock6,272
XPC850CZT50BUR2
NXP

IC MPU MPC8XX 50MHZ 256BGA

Package: 256-BGA

Stock5,648
MPC8349VVAGD
NXP

IC MPU MPC83XX 400MHZ 672TBGA

Package: 672-LBGA

Stock5,088
BSC9131NLE1HHHB
NXP

IC MPU Q OR IQ 800MHZ 520FCBGA

Package: 520-FBGA, FCBGA

Stock4,928
MCIMX31CJMN4C
NXP

IC MPU I.MX31 400MHZ 473MAPBGA

Package: 473-LFBGA

Stock14,052
P1011NSN2DFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock6,128
LH75411N0Q100C0;55
NXP

IC MCU 32BIT ROMLESS 144LQFP

Package: 144-LQFP

Stock4,288

Part Number	Manufacturer	Description	Package	Stock
BUK652R0-30C,127	NXP	MOSFET N-CH 30V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 229nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 14964pF @ 25V Vgs (Max): ±16V FET Feature: - Power Dissipation (Max): 306W (Tc) Rds On (Max) @ Id, Vgs: 2.2 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock3,856
ON5250/A,135	NXP	MOSFET RF SOT223 SC-73 Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	Package: TO-261-4, TO-261AA	Stock4,912
A2T18H160-24SR3	NXP	IC TRANS RF LDMOS Transistor Type: LDMOS (Dual) Frequency: 1.81GHz Gain: 17.9dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 400mA Power - Output: 28W Voltage - Rated: 65V Package / Case: NI-780S-4L2L Supplier Device Package: NI-780S-4L2L	Package: NI-780S-4L2L	Stock7,344
A2T21S160-12SR3	NXP	IC TRANS RF LDMOS Transistor Type: LDMOS Frequency: 2.17GHz Gain: 18.4dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 38W Voltage - Rated: 65V Package / Case: NI-780-2S2L Supplier Device Package: NI-780-2S2L	Package: NI-780-2S2L	Stock3,840
BC639,126	NXP	TRANS NPN 80V 1A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 80V Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Power - Max: 830mW Frequency - Transition: 180MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock7,296
74HCT40105N,112	NXP	IC 4X16 FIFO REGISTER 16-DIP Memory Size: 64 (16 x 4) Function: Asynchronous Data Rate: 28MHz Access Time: 40ns Voltage - Supply: 4.5 V ~ 5.5 V Current - Supply (Max): - Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock3,824
SC16C852SVIET,115	NXP	IC UART DL 1.8V W/FIFO 36-TFBGA Features: - Number of Channels: 2, DUART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 20Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 36-TFBGA Supplier Device Package: 36-TFBGA (3.5x3.5)	Package: 36-TFBGA	Stock5,680
M83242G13	NXP	IC C1K 450MHZ VOIP 448BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,824
MC33742PEG	NXP	IC SYSTEM BASE W/CAN 28SOIC Applications: Automotive Interface: SPI Serial Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	Package: 28-SOIC (0.295", 7.50mm Width)	Stock301,680
HEC4066BT,118	NXP	IC SWITCH QUAD 2X1 14SOIC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 4 On-State Resistance (Max): 155 Ohm Channel-to-Channel Matching (ΔRon): 5 Ohm Voltage - Supply, Single (V+): 3 V ~ 15 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): - -3db Bandwidth: 90MHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): 7.5pF Current - Leakage (IS(off)) (Max): 200nA Crosstalk: -50dB @ 1MHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock6,288
MPC8535AVTATHA	NXP	IC MPU MPC85XX 1.25GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock2,928
MPC8567EVTANGG	NXP	IC MPU MPC85XX 800MHZ 1023FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	Package: 1023-BBGA, FCBGA	Stock7,632
MCIMX233CJM4B	NXP	IC MPU I.MX23 454MHZ 169MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Ethernet: - SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11x11)	Package: 169-LFBGA	Stock7,088
KMPC8349VVALFB	NXP	IC MPU MPC83XX 667MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock6,272
XPC850CZT50BUR2	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BGA	Stock5,648
MPC8349VVAGD	NXP	IC MPU MPC83XX 400MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock5,088
BSC9131NLE1HHHB	NXP	IC MPU Q OR IQ 800MHZ 520FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21x21)	Package: 520-FBGA, FCBGA	Stock4,928
MCIMX31CJMN4C	NXP	IC MPU I.MX31 400MHZ 473MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Ethernet: - SATA: - USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Package / Case: 473-LFBGA Supplier Device Package: -	Package: 473-LFBGA	Stock14,052
P1011NSN2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock6,128
LH75411N0Q100C0;55	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: ARM7? Core Size: 32-Bit Speed: 84MHz Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Number of I/O: 76 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock4,288
S9S12G128F0CLFR	NXP	IC MCU 16BIT 128KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock2,448
PCA2002U/AB/1,026	NXP	IC WATCH CIRCUIT 32KHZ DIE PLL: No Main Purpose: Battery operated wrist watches Input: Crystal Output: - Number of Circuits: 1 Ratio - Input:Output: 1:2 Differential - Input:Output: No/No Frequency - Max: 32kHz Voltage - Supply: 1.1 V ~ 3.6 V Operating Temperature: -10°C ~ 60°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	Package: Die	Stock5,280
MCIMX6DP6AVT8ABR	NXP	IC MPU I.MX6DP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock6,816
SPC5603EEF2VLHR	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, WDT Number of I/O: 39 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock6,048
SPC5644AF0MMG3	NXP	IC MCU 32BIT 4MB FLASH 208MAPBGA Core Processor: e200z4 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 120 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	Package: 208-BGA	Stock5,120
SAF7751HV-N208W-PK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MVR5510AMMALES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote
SC33908NAER2	NXP	SC33908NAER2 Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote