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NXP |
MOSFET N-CH 30V 2.5A SOT23
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 2.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 4.6nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 147pF @ 10V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 830mW (Tc)
- Rds On (Max) @ Id, Vgs: 117 mOhm @ 500mA, 10V
- Operating Temperature: -65°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: TO-236AB (SOT23)
- Package / Case: TO-236-3, SC-59, SOT-23-3
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock142,800 |
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NXP |
TRANS PREBIAS PNP 500MW TO92-3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 800mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 1k
- Resistor - Emitter Base (R2) (Ohms): 10k
- DC Current Gain (hFE) (Min) @ Ic, Vce: -
- Vce Saturation (Max) @ Ib, Ic: -
- Current - Collector Cutoff (Max): -
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock2,768 |
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NXP |
TRANS PREBIAS NPN 150MW SC89
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 10k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 150mW
- Mounting Type: Surface Mount
- Package / Case: SC-89, SOT-490
- Supplier Device Package: SC-89
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Package: SC-89, SOT-490 |
Stock6,144 |
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NXP |
TRANS NPN 25MA 15V 1GHZ SOT23
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 15V
- Frequency - Transition: 1GHz
- Noise Figure (dB Typ @ f): 4.5dB @ 500MHz
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 2mA, 1V
- Current - Collector (Ic) (Max): 25mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock3,760 |
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NXP |
IC MOTOR DRIVER PAR 20HSOP
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: Power MOSFET
- Step Resolution: -
- Applications: General Purpose
- Current - Output: 5A
- Voltage - Supply: 5 V ~ 28 V
- Voltage - Load: 5 V ~ 28 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 20-HSOP
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Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock7,424 |
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NXP |
IC MULTIPLEXER DUAL 4BIT 16DIP
- Type: Multiplexer
- Circuit: 2 x 4:1
- Independent Circuits: 1
- Current - Output High, Low: 3mA, 24mA
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock5,168 |
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NXP |
IC 1-16 DECOD/DEMUX 24-DIP
- Type: Decoder/Demultiplexer
- Circuit: 1 x 4:16
- Independent Circuits: 1
- Current - Output High, Low: 3mA, 3mA
- Voltage Supply Source: Dual Supply
- Voltage - Supply: 4.5 V ~ 15.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 24-DIP (0.600", 15.24mm)
- Supplier Device Package: 24-DIP
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Package: 24-DIP (0.600", 15.24mm) |
Stock7,712 |
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NXP |
IC MIXER/OSC SYNTH 32TSSOP
- Type: Video Processor
- Applications: Tuners
- Mounting Type: Surface Mount
- Package / Case: 32-TSSOP (0.240", 6.10mm Width)
- Supplier Device Package: 32-TSSOP
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Package: 32-TSSOP (0.240", 6.10mm Width) |
Stock2,100 |
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NXP |
IC AMP AUDIO 4W MONO AB 8TSSOP
- Type: Class AB
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 400mW x 1 @ 100 Ohm
- Voltage - Supply: 2 V ~ 16 V, ±1 V ~ 8 V
- Features: Shutdown
- Mounting Type: Surface Mount
- Operating Temperature: -20°C ~ 70°C (TA)
- Supplier Device Package: 8-TSSOP
- Package / Case: 8-TSSOP (0.173", 4.40mm Width)
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Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock1,735,272 |
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NXP |
IC AUDIO DEVICE 36HSOP
- Type: Class AB
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 28W x 4 @ 4 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Short-Circuit and Thermal Protection
- Mounting Type: Surface Mount
- Operating Temperature: -
- Supplier Device Package: 36-HSOP
- Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
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Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
Stock5,488 |
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NXP |
IC SBC CAN HS 5.0V 32SOIC
- Applications: System Basis Chip
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3,056 |
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NXP |
IC TXRX CAN 14BIT 5V 14-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock6,096 |
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NXP |
IC MPU I.MX35 532MHZ 400MAPBGA
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 532MHz
- Co-Processors/DSP: Multimedia; GPU, IPU, VFP
- RAM Controllers: LPDDR, DDR2
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, KPP, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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Package: 400-LFBGA |
Stock5,248 |
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NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,136 |
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NXP |
IC MCU 32BIT 1MB FLASH 256LBGA
- Core Processor: ARM? Cortex?-M4/M0
- Core Size: 32-Bit Dual-Core
- Speed: 204MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 164
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 136K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-LBGA (17x17)
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Package: 256-LBGA |
Stock4,720 |
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NXP |
IC RTC CLK/CALENDAR I2C 8-DIP
- Type: Clock/Calendar
- Features: Alarm, NVSRAM
- Memory Size: 8B
- Time Format: HH:MM:SS:hh (12/24 hr)
- Date Format: YY-MM-DD-dd
- Interface: I2C, 2-Wire Serial
- Voltage - Supply: 2.5 V ~ 6 V
- Voltage - Supply, Battery: -
- Current - Timekeeping (Max): 8µA ~ 15µA @ 2V ~ 5V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-DIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock5,808 |
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NXP |
ACCELEROMETER
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,356 |
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NXP |
FS6500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock2,768 |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,120 |
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NXP |
QORIQ64B POWER ARCH8X 1.5GHZ T
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,352 |
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NXP |
I.MX6Q ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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Package: 624-FBGA, FCBGA |
Stock2,240 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 123
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 36x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,296 |
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NXP |
16-BIT MCU S12X CORE 256KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock2,256 |
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NXP |
KINETIS KL16: 48MHZ CORTEX-M0+ U
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, LINbus, SPI, TSI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D - 16bit, D/A - 12bit
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,352 |
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NXP |
SAF4000EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
AUTO SBC
- Applications: -
- Current - Supply: 30µA
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
MWCT2D17S,MAXQFP172
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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