Page 370 - NXP Products | Heisener Electronics

BUK752R7-60E,127
NXP

MOSFET N-CH 60V 120A TO220AB

Package: TO-220-3

Stock4,784
MD7P19130HR3
NXP

FET RF 2CH 65V 1.99GHZ NI780H-4

Package: NI-780-4

Stock3,328
MRFE6VP61K25GSR5
NXP

FET RF 2CH 133V 230MHZ NI1230GS

Package: NI-1230S-4 GW

Stock5,456
MRF6V3090NBR5
NXP

FET RF 110V 860MHZ TO272-4

Package: TO-272BB

Stock5,472
PDTA114ES,126
NXP

TRANS PREBIAS PNP 500MW TO92-3

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock7,216
PIP212-12M,518
NXP

IC REG BUCK SYNC ADJ 35A 56HVQFN

Package: 56-VFQFN Exposed Pad

Stock5,568
MC34931EK
NXP

IC BRIDGE DRIVER PAR 32SOIC

Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock6,128
74HCT4316N,112
NXP

IC SWITCH QUAD 1X1 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock3,680
NX3V1G66GM,132
NXP

IC SWITCH SPST 6XSON

Package: 6-XFDFN

Stock2,944
MC68EN360CAI25L
NXP

IC MPU M683XX 25MHZ 240FQFP

Package: 240-BFQFP

Stock6,528
P1010NXE5KHB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Package: 425-FBGA

Stock7,488
MC908JB12JDWE
NXP

IC MCU 8BIT 12KB FLASH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock5,744
SPC5747GK1MMJ6
NXP

IC MCU 32BIT 4MB FLASH 256MAPBGA

Package: 256-LBGA

Stock3,584
SPC5645BF0MLU1
NXP

IC MCU 32BIT 2MB FLASH 176LQFP

Package: 176-LQFP

Stock4,224
MCF51AC128AVLKE
NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Package: 80-LQFP

Stock2,160
LPC1517JBD48E
NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Package: 48-LQFP

Stock19,860
ASC8851ET/M2,557
NXP

IC IP CAMERA MPU SXGA TFBGA

Package: 484-TFBGA

Stock2,768
NE1618DS,112
NXP

SENSOR TEMPERATURE SMBUS 16SSOP

Package: 16-SSOP (0.154", 3.90mm Width)

Stock6,570
MF1SEP1021DA4/03BJ
NXP

MIFARE CLASSIC SMART CARD IC

Package: -

Stock2,502
SA612AD/01,118
NXP

IC MIXER 500MHZ UP CONVRT 8SO

Package: 8-SOIC (0.154", 3.90mm Width)

Stock25,674

Part Number	Manufacturer	Description	Package	Stock
BUK752R7-60E,127	NXP	MOSFET N-CH 60V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 158nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 11180pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 349W (Tc) Rds On (Max) @ Id, Vgs: 2.6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock4,784
MD7P19130HR3	NXP	FET RF 2CH 65V 1.99GHZ NI780H-4 Transistor Type: LDMOS (Dual) Frequency: 1.99GHz Gain: 20dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.25A Power - Output: 40W Voltage - Rated: 65V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	Package: NI-780-4	Stock3,328
MRFE6VP61K25GSR5	NXP	FET RF 2CH 133V 230MHZ NI1230GS Transistor Type: LDMOS Frequency: 230MHz Gain: 24dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 1250W Voltage - Rated: 133V Package / Case: NI-1230S-4 GW Supplier Device Package: NI-1230S-4 GullWing	Package: NI-1230S-4 GW	Stock5,456
MRF6V3090NBR5	NXP	FET RF 110V 860MHZ TO272-4 Transistor Type: LDMOS Frequency: 860MHz Gain: 22dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 350mA Power - Output: 18W Voltage - Rated: 110V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	Package: TO-272BB	Stock5,472
PDTA114ES,126	NXP	TRANS PREBIAS PNP 500MW TO92-3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 10k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock7,216
PIP212-12M,518	NXP	IC REG BUCK SYNC ADJ 35A 56HVQFN Output Configuration: Half Bridge Applications: Synchronous Buck Converters Interface: PWM Load Type: Inductive Technology: DrMOS Rds On (Typ): 1.9 mOhm LS, 6.5 mOhm HS Current - Output / Channel: 35A Current - Peak Output: 60A Voltage - Supply: 3.3 V ~ 16 V Voltage - Load: 24V (Max) Operating Temperature: -55°C ~ 150°C (TJ) Features: Bootstrap Circuit, 5V Regulated Output Fault Protection: Over Temperature, UVLO Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock5,568
MC34931EK	NXP	IC BRIDGE DRIVER PAR 32SOIC Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose Interface: Logic Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 120 mOhm Current - Output / Channel: 5A Current - Peak Output: - Voltage - Supply: 5 V ~ 36 V Voltage - Load: 5 V ~ 36 V Operating Temperature: -40°C ~ 150°C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock6,128
74HCT4316N,112	NXP	IC SWITCH QUAD 1X1 16DIP Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 4 On-State Resistance (Max): 135 Ohm Channel-to-Channel Matching (ΔRon): 6 Ohm Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V Voltage - Supply, Dual (V±): ±1 V ~ 5 V Switch Time (Ton, Toff) (Max): 42ns, 34ns -3db Bandwidth: 160MHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 100nA Crosstalk: -60dB @ 1MHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock3,680
NX3V1G66GM,132	NXP	IC SWITCH SPST 6XSON Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 1 On-State Resistance (Max): 450 mOhm Channel-to-Channel Matching (ΔRon): - Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 24ns, 9ns -3db Bandwidth: 25MHz Charge Injection: 12pC Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: - Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	Package: 6-XFDFN	Stock2,944
MC68EN360CAI25L	NXP	IC MPU M683XX 25MHZ 240FQFP Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32)	Package: 240-BFQFP	Stock6,528
P1010NXE5KHB	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	Package: 425-FBGA	Stock7,488
MC908JB12JDWE	NXP	IC MCU 8BIT 12KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 6MHz Connectivity: SCI, USB Peripherals: LED, LVD, POR, PWM Number of I/O: 13 Program Memory Size: 12KB (12K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	Package: 20-SOIC (0.295", 7.50mm Width)	Stock5,744
SPC5747GK1MMJ6	NXP	IC MCU 32BIT 4MB FLASH 256MAPBGA Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock3,584
SPC5645BF0MLU1	NXP	IC MCU 32BIT 2MB FLASH 176LQFP Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 160K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock4,224
MCF51AC128AVLKE	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	Package: 80-LQFP	Stock2,160
LPC1517JBD48E	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock19,860
ASC8851ET/M2,557	NXP	IC IP CAMERA MPU SXGA TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	Package: 484-TFBGA	Stock2,768
NE1618DS,112	NXP	SENSOR TEMPERATURE SMBUS 16SSOP Sensor Type: Digital, Local/Remote Sensing Temperature - Local: 0°C ~ 120°C Sensing Temperature - Remote: 0°C ~ 120°C Output Type: SMBus Voltage - Supply: 3 V ~ 3.6 V Resolution: 8 b Features: One-Shot, Output Switch, Programmable Limit, Shutdown Mode, Standby Mode Accuracy - Highest (Lowest): ±1.5°C (±3°C) Test Condition: 60°C ~ 100°C (0°C ~ 120°C) Operating Temperature: 0°C ~ 120°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.154", 3.90mm Width) Supplier Device Package: 16-SSOP	Package: 16-SSOP (0.154", 3.90mm Width)	Stock6,570
MF1SEP1021DA4/03BJ	NXP	MIFARE CLASSIC SMART CARD IC Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,502
SA612AD/01,118	NXP	IC MIXER 500MHZ UP CONVRT 8SO RF Type: Cellular, HF, VHF Frequency: 500MHz Number of Mixers: 1 Gain: 17dB Noise Figure: 5dB Secondary Attributes: Up Converter Current - Supply: 2.4mA Voltage - Supply: 4.5 V ~ 8 V Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock25,674
13237ADC-SFTW	NXP	KIT DEV MC13237CHT SFTW Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1323x Supplied Contents: Board	Package: -	Stock5,112
MW5IC2030GMBR1	NXP	IC PWR AMP RF 26V 30W TO272-16GW Frequency: 1.93GHz ~ 1.99GHz P1dB: - Gain: 23dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 160mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	Package: TO-272-16 Variant, Gull Wing	Stock7,974
A7004CMHN1/T1AGBEL	NXP	AU10TICS Applications: - Core Processor: - Program Memory Type: - Controller Series: - RAM Size: - Interface: - Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,248
MCIMX6L3DVN10AC	NXP	I.MX 6SL ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 432-TFBGA Supplier Device Package: 432-MAPBGA (13x13)	Package: 432-TFBGA	Stock4,912
SP5748GHK0AMMJ6R	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock6,336
S9S12ZVLS1F0VFM	NXP	MAGNIV 16-BIT MCU S12Z CORE 16 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	Package: 32-VFQFN Exposed Pad	Stock3,184
A3T18H400W23SR6	NXP	RF MOSFET LDMOS 28V ACP1230S-4 Transistor Type: LDMOS Frequency: 1.805GHz ~ 1.88GHz Gain: 16.8dB Voltage - Test: 28 V Current Rating: 10µA Noise Figure: - Current - Test: 300 mA Power - Output: 170W Voltage - Rated: 65 V Package / Case: ACP-1230S-4L2S Supplier Device Package: ACP-1230S-4L2S	Package: -	Request a Quote
MIMX8ML3DVNLZAB	NXP	IC MPU I.MX8ML 1.8GHZ 486LFBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, RDC Package / Case: 486-LFBGA Supplier Device Package: 486-LFBGA (14x14)	Package: -	Request a Quote