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NXP |
DIODE ZENER 2.4V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 2.4V
- Tolerance: ±5%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 100 Ohms
- Current - Reverse Leakage @ Vr: 50µA @ 1V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock6,512 |
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NXP |
IC MULTIVIBRATOR DUAL MONO 16DIP
- Logic Type: Monostable
- Independent Circuits: 2
- Schmitt Trigger Input: No
- Propagation Delay: 77ns
- Current - Output High, Low: 4mA, 4mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock3,296 |
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NXP |
IC 16BIT D TYPE LATCH 48TSSOP
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 2
- Delay Time - Propagation: 2ns
- Current - Output High, Low: 32mA, 64mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock2,768 |
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NXP |
IC TV SILICON TUNER 64-HLQFN
- Type: Silicon Tuner
- Applications: Set-Top Boxes
- Mounting Type: Surface Mount
- Package / Case: 64-LFQFN Exposed Pad
- Supplier Device Package: 64-HLFQFN (9x9)
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Package: 64-LFQFN Exposed Pad |
Stock6,752 |
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NXP |
IC AMP AUDIO CLASSD 3.4W 9WLCSP
- Type: Class D
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 3.4W x 1 @ 4 Ohm
- Voltage - Supply: 2.5 V ~ 5.5 V
- Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 9-WLCSP (1.49x1.27)
- Package / Case: 9-UFBGA, WLCSP
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Package: 9-UFBGA, WLCSP |
Stock4,544 |
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NXP |
IC SBC CAN HS 5.0V 32SOIC
- Applications: System Basis Chip
- Interface: CAN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock5,088 |
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NXP |
IC REDRIVER I2C 2CH 400KHZ 8SO
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 2
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 7pF
- Voltage - Supply: 2 V ~ 15 V
- Current - Supply: 900µA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock20,112 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,656 |
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NXP |
IC MPU MPC74XX 1.0GHZ 483FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 483-BCBGA, FCCBGA
- Supplier Device Package: 483-FCCBGA (29x29)
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Package: 483-BCBGA, FCCBGA |
Stock5,424 |
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NXP |
IC MPU Q OR IQ 1.3GHZ 780FCBGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.3GHz
- Co-Processors/DSP: Security; SEC 4.2
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-BBGA, FCBGA |
Stock2,912 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,008 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock7,648 |
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NXP |
IC MCU 8BIT 7.5KB FLASH 28DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 17
- Program Memory Size: 7.5KB (7.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 384 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-DIP (0.600", 15.24mm)
- Supplier Device Package: 28-PDIP
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Package: 28-DIP (0.600", 15.24mm) |
Stock5,136 |
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NXP |
IC MCU 32BIT 512KB FLASH 144BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 96
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock5,936 |
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NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,768 |
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NXP |
IC MCU 8BIT 4KB FLASH 8DIP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 10MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 4
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock6,736 |
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NXP |
IC MCU 8BIT 60KB FLASH 80LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LCD, LVD, POR, PWM, WDT
- Number of I/O: 24
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock36,444 |
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NXP |
SENSOR PRESSURE 20-304KPA 1317A
- Pressure Type: Absolute
- Operating Pressure: 2.9 PSI ~ 44.09 PSI (20 kPa ~ 304 kPa)
- Output Type: Analog Voltage
- Output: 0.3 V ~ 4.9 V
- Accuracy: ±1.5%
- Voltage - Supply: 4.74 V ~ 5.46 V
- Port Size: Male - 0.13" (3.3mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 174.05 PSI (1200 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port
- Supplier Device Package: 8-SSOP
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Package: 8-SSOP (0.335", 8.50mm Width), Top Port |
Stock7,248 |
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NXP |
ACCELEROMETER 4-9G ANALOG 14LGA
- Type: Analog
- Axis: X, Y, Z
- Acceleration Range: ±4g, 9g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
- Bandwidth: 400Hz (X,Y), 300Hz (Z)
- Output Type: Analog Voltage
- Voltage - Supply: 2.2 V ~ 3.6 V
- Features: Selectable Scale
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 14-VFLGA
- Supplier Device Package: 14-LGA (3x5)
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Package: 14-VFLGA |
Stock6,048 |
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NXP |
IC MPU I.MX 8M MINI DUAL BGA
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: ARM® Cortex®-M4
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Package / Case: 486-LFBGA, FCBGA
- Supplier Device Package: 486-FCBGA (14x14)
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Package: 486-LFBGA, FCBGA |
Stock4,816 |
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NXP |
CAR RADIO TUNER & AUDIO DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
TRIAC SENS GATE 800V 6A TO220AB
- Triac Type: Logic - Sensitive Gate
- Voltage - Off State: 800 V
- Current - On State (It (RMS)) (Max): 6 A
- Voltage - Gate Trigger (Vgt) (Max): -
- Current - Non Rep. Surge 50, 60Hz (Itsm): 51A, 56A
- Current - Gate Trigger (Igt) (Max): 10 mA
- Current - Hold (Ih) (Max): 25 mA
- Configuration: Single
- Operating Temperature: 125°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-220-3
- Supplier Device Package: TO-220AB
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 48KB FLASH 32LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
- Applications: -
- Current - Supply: -
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC TRANSCEIVER HALF 2/2 14HVSON
- Type: Transceiver
- Protocol: CANbus
- Number of Drivers/Receivers: 2/2
- Duplex: Half
- Receiver Hysteresis: 50 mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 14-VDFN Exposed Pad
- Supplier Device Package: 14-HVSON (3x4.5)
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Package: - |
Stock23,967 |
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NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 83
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 168K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 8x10b SAR; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: - |
Request a Quote |
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NXP |
MPU I.MX8 QUAD MAX
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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