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NXP |
TRANS PREBIAS PNP 250MW SMT3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 22k
- Resistor - Emitter Base (R2) (Ohms): 47k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock6,176 |
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NXP |
IC OCTAL TRANSP LATCH 3ST 20SOIC
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 3.6ns
- Current - Output High, Low: 32mA, 64mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock6,768 |
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NXP |
IC D-TYPE POS TRG DUAL 48SSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 2
- Number of Bits per Element: 8
- Clock Frequency: 250MHz
- Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Current - Quiescent (Iq): 100µA
- Input Capacitance: 3pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-BSSOP (0.295", 7.50mm Width)
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Package: 48-BSSOP (0.295", 7.50mm Width) |
Stock5,856 |
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NXP |
IC COUNTER DUAL 4BIT BIN 14DIP
- Logic Type: Binary Counter
- Direction: Up
- Number of Elements: 2
- Number of Bits per Element: 4
- Reset: Asynchronous
- Timing: -
- Count Rate: 107MHz
- Trigger Type: Negative Edge
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-DIP
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Package: 14-DIP (0.300", 7.62mm) |
Stock4,784 |
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NXP |
IC BUFFER TRI-ST QUAD 14SOIC
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 1
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 15mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock6,448 |
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NXP |
HDMI TRANSMITTER 1080P 80HTQFP
- Type: HDMI 1.3 Transmitter
- Applications: Set-Top Boxes, Video Players, Recorders
- Mounting Type: Surface Mount
- Package / Case: 80-TQFP Exposed Pad
- Supplier Device Package: 80-HTQFP (12x12)
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Package: 80-TQFP Exposed Pad |
Stock3,312 |
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NXP |
IC CATV AMPLIFIER MOD 7-CATV
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 250mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: Surface Mount
- Package / Case: Module
- Supplier Device Package: 7-CATV Module
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Package: Module |
Stock7,456 |
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NXP |
IC AMP AUDIO PWR 55W STER 17SIL
- Type: Class B
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: DBS17P
- Package / Case: 17-SIP Formed Leads
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Package: 17-SIP Formed Leads |
Stock4,848 |
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NXP |
IC SBC CAN/LIN 5.0V HS DL 54SOIC
- Applications: System Basis Chip
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOICW-EP
- Mounting Type: Surface Mount
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Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock5,344 |
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NXP |
IC SBC LINE 3.3V 32HTSSOP
- Applications: Automotive
- Interface: SPI Serial
- Voltage - Supply: 4.5 V ~ 28 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
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Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock7,008 |
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NXP |
IC MPU Q OR IQ 1.5GHZ 1295FCBGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (8), 10 Gbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1295-BBGA, FCBGA
- Supplier Device Package: 1295-FCPBGA (37.5x37.5)
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Package: 1295-BBGA, FCBGA |
Stock6,544 |
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NXP |
IC MPU MPC85XX 600MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,320 |
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NXP |
IC MPU MPC83XX 333MHZ 473MAPBGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 473-LFBGA
- Supplier Device Package: 473-MAPBGA (19x19)
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Package: 473-LFBGA |
Stock4,784 |
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NXP |
IC MPU MPC6XX 266MHZ 255FCCBGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 255-BCBGA Exposed Pad
- Supplier Device Package: 255-FCCBGA (21x21)
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Package: 255-BCBGA Exposed Pad |
Stock2,512 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock6,064 |
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NXP |
IC MCU 32BIT 768KB FLASH 176LQFP
- Core Processor: e200z1
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 137
- Program Memory Size: 768KB (768K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock6,928 |
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NXP |
IC CLK BUFFER 1:10 125MHZ 24SSOP
- Type: Fanout Buffer (Distribution)
- Number of Circuits: 1
- Ratio - Input:Output: 1:10
- Differential - Input:Output: No/No
- Input: LVTTL
- Output: LVTTL
- Frequency - Max: 125MHz
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 24-SSOP
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Package: 24-SSOP (0.209", 5.30mm Width) |
Stock6,464 |
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NXP |
IC CLK BUFFER 1:5 1.5GHZ 32HVQFN
- Type: Fanout Buffer (Distribution)
- Number of Circuits: 2
- Ratio - Input:Output: 1:5
- Differential - Input:Output: Yes/Yes
- Input: ECL, PECL
- Output: PECL
- Frequency - Max: 1.5GHz
- Voltage - Supply: 2.25 V ~ 3.8 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock4,960 |
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NXP |
IC CLK BUFFER 2:9 350MHZ 32LQFP
- Type: Fanout Buffer (Distribution), Multiplexer
- Number of Circuits: 1
- Ratio - Input:Output: 2:9
- Differential - Input:Output: No/No
- Input: LVCMOS
- Output: LVCMOS
- Frequency - Max: 350MHz
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock4,912 |
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NXP |
ACCELEROMETER 120G 16QFN
- Type: Digital
- Axis: X
- Acceleration Range: ±120g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: 4.2 V ~ 17 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN Exposed Pad |
Stock8,010 |
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NXP |
DUAL CORE, 3M FLASH, 256
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Package: 100-LBGA |
Stock5,664 |
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NXP |
16-BIT MCU S12X CORE 256KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock4,784 |
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NXP |
16-BIT MCU S12X CORE 384KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock2,256 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 40MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock5,232 |
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NXP |
16BIT 96K FLASH
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 3K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock5,920 |
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NXP |
IC MCU 3MB FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 128KB FLSH 100HLQFP
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 64
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP Exposed Pad
- Supplier Device Package: 100-HLQFP (14x14)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: 56800EX
- Core Size: 32-Bit Single-Core
- Speed: 100MHz
- Connectivity: CANbus, I2C, LINbus, SCI, SPI
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
- Data Converters: A/D 20x12b; D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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