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NXP |
TRANS NPN 50V 0.5A SC-59
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
- Current - Collector Cutoff (Max): 10nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V
- Power - Max: 250mW
- Frequency - Transition: 180MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock3,088 |
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NXP |
IC REG LINEAR 2.9V 200MA 5TSOP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.9V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.13V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: SC-74A, SOT-753
- Supplier Device Package: 5-TSOP
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Package: SC-74A, SOT-753 |
Stock6,336 |
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NXP |
IC GATE DRIVER 3PHASE 32SOIC
- Driven Configuration: Half-Bridge
- Channel Type: 3-Phase
- Number of Drivers: 6
- Gate Type: N-Channel MOSFET
- Voltage - Supply: 5.5 V ~ 24 V
- Logic Voltage - VIL, VIH: -
- Current - Peak Output (Source, Sink): -
- Input Type: Non-Inverting
- High Side Voltage - Max (Bootstrap): -
- Rise / Fall Time (Typ): 350ns, 250ns
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 32-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 32-SOIC
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Package: 32-SOIC (0.295", 7.50mm Width) |
Stock5,360 |
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NXP |
IC EEPROM 1KBIT 100KHZ 8SO
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 1Kb (128 x 8)
- Memory Interface: I2C
- Clock Frequency: 100kHz
- Write Cycle Time - Word, Page: 10ms
- Access Time: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -25°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,736 |
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NXP |
TXRX 20BIT TRANSLATNG 56TSSOP
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 2
- Channels per Circuit: 10
- Voltage - VCCA: 0.8V ~ 3.6V
- Voltage - VCCB: 0.8V ~ 3.6V
- Input Signal: -
- Output Signal: -
- Output Type: Tri-State, Non-Inverted
- Data Rate: 380Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.173", 4.40mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.173", 4.40mm Width) |
Stock3,856 |
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NXP |
IC D-TYPE POS TRG SNGL 20SSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 200MHz
- Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock7,744 |
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NXP |
IC SQUIB DRIVER 4-CH 32-SOIC
- Applications: -
- Interface: SPI
- Voltage - Supply: 4.75 V ~ 5.25 V
- Package / Case: 32-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 32-SOIC
- Mounting Type: Surface Mount
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Package: 32-SOIC (0.295", 7.50mm Width) |
Stock35,424 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock6,600 |
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NXP |
IC MCU 8BIT 4KB FLASH 20TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,448 |
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NXP |
IC MCU 8BIT 4KB FLASH 20TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, UART/USART
- Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock3,152 |
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NXP |
IC MCU 8BIT 4KB FLASH 28DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 23
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
- Data Converters: A/D 12x8b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-DIP (0.600", 15.24mm)
- Supplier Device Package: 28-PDIP
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Package: 28-DIP (0.600", 15.24mm) |
Stock4,656 |
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NXP |
IC MCU 32BIT 2MB FLASH 324TEBGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 132MHz
- Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 238
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 324-BBGA
- Supplier Device Package: 324-TEPBGA (23x23)
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Package: 324-BBGA |
Stock3,744 |
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NXP |
IC MCU 32BIT ROMLESS 388PBGA
- Core Processor: Coldfire V4E
- Core Size: 32-Bit
- Speed: 200MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals: DMA, PWM, WDT
- Number of I/O: 99
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 388-BBGA
- Supplier Device Package: 388-PBGA (27x27)
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Package: 388-BBGA |
Stock4,448 |
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NXP |
IC MCU 16BIT 384KB FLASH 144QFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 117
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 28K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x8/10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-QFP (20x20)
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Package: 144-LQFP |
Stock4,288 |
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NXP |
IC MCU 32BIT ROMLESS 208LQFP
- Core Processor: ARM9?
- Core Size: 16/32-Bit
- Speed: 125MHz
- Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 152
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 56K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP |
Stock5,856 |
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NXP |
IC MCU 16BIT 128KB FLASH 64LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock85,212 |
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NXP |
IC SENSOR TEMP 2.8-5.5V SOT96-1
- Sensor Type: Digital, Local
- Sensing Temperature - Local: -55°C ~ 125°C
- Sensing Temperature - Remote: -
- Output Type: I2C/SMBus
- Voltage - Supply: 2.8 V ~ 5.5 V
- Resolution: 10 b
- Features: Output Switch, Programmable Limit, Shutdown Mode
- Accuracy - Highest (Lowest): ±1°C (±3°C)
- Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
- Operating Temperature: -55°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock26,604 |
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NXP |
REGULATOR BUCK QUAD WITH UP TO
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 250µA
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock7,032 |
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NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,464 |
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NXP |
I.MX 6SX ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 200MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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Package: 400-LFBGA |
Stock2,912 |
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NXP |
M74K MASK ONLY - AUTO
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,152 |
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NXP |
8-BIT MCU S08 CORE 16KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock5,216 |
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NXP |
IC POWER MANAGEMENT I.MX8QM
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.7V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock4,992 |
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NXP |
HIGH VOLTAGE PMIC QFN56
- Applications: Power Supplies
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
S12Z CPU, 16K FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
REGULATOR BUCK QUAD WITH UP TO 4
- Applications: QorlQ LS1/T1 Communications Processors
- Current - Supply: 15mA
- Voltage - Supply: 2.8V ~ 4.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: - |
Request a Quote |
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NXP |
TEA8919DAT
- Applications: -
- Voltage - Input: -
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: - |
Request a Quote |
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