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NXP |
TRANS NPN PREBIAS/PNP SOT666
- Transistor Type: 1 NPN Pre-Biased, 1 PNP
- Current - Collector (Ic) (Max): 100mA, 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V, 40V
- Resistor - Base (R1) (Ohms): 47k
- Resistor - Emitter Base (R2) (Ohms): 47k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: 300MHz
- Power - Max: 300mW
- Mounting Type: Surface Mount
- Package / Case: SOT-563, SOT-666
- Supplier Device Package: SOT-666
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Package: SOT-563, SOT-666 |
Stock2,816 |
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NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 5.6V
- Tolerance: ±5%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 40 Ohms
- Current - Reverse Leakage @ Vr: 1µA @ 2V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,376 |
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NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48
- Applications: System Basis Chip
- Current - Supply: 7mA
- Voltage - Supply: 3.5 V ~ 28 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,096 |
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NXP |
IC CNTL BALLAST 600V 16-SOIC
- Type: Ballast Controller
- Frequency: 40.5kHz ~ 100kHz
- Voltage - Supply: 9.1 V ~ 13 V
- Current - Supply: 1.5mA
- Current - Output Source/Sink: -
- Dimming: No
- Operating Temperature: -25°C ~ 80°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock30,000 |
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NXP |
IC GATE NAND 1CH 13-INP 16-DIP
- Logic Type: NAND Gate
- Number of Circuits: 1
- Number of Inputs: 13
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Supplier Device Package: 16-DIP
- Package / Case: 16-DIP (0.300", 7.62mm)
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Package: 16-DIP (0.300", 7.62mm) |
Stock6,032 |
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NXP |
IC GATE NAND 2CH 4-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 2
- Number of Inputs: 4
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 50µA
- Current - Output High, Low: 15mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock3,360 |
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NXP |
IC DEMOD DUAL W/RX 64-HVQFN
- Type: Demodulator
- Applications: Set-Top Boxes
- Mounting Type: Surface Mount
- Package / Case: 64-VFQFN Dual Rows Exposed Pad
- Supplier Device Package: 64-HVQFN (9x9)
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Package: 64-VFQFN Dual Rows Exposed Pad |
Stock2,672 |
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NXP |
IC AMP MODULE RCVR CATV SOT115X
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 205mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115Y
- Supplier Device Package: SOT115Y
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Package: SOT-115Y |
Stock2,272 |
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NXP |
IC SYSTEM BASIS W/CAN 28SOIC
- Applications: System Basis Chip
- Interface: CAN
- Voltage - Supply: 5V
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
- Mounting Type: Surface Mount
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock7,584 |
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NXP |
IC REDRIVER I2C 2CH 400KHZ 8SO
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 2
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 7pF
- Voltage - Supply: 2 V ~ 15 V
- Current - Supply: 900µA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock107,292 |
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NXP |
IC MPU MPC8XX 66MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock5,392 |
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NXP |
IC MPU MPC83XX 533MHZ 672TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 672-LBGA
- Supplier Device Package: 672-TBGA (35x35)
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Package: 672-LBGA |
Stock3,088 |
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NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 784-BBGA, FCBGA |
Stock4,368 |
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NXP |
IC MPU MPC74XX 1.42GHZ 360FCCLGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.42GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CLGA, FCCLGA
- Supplier Device Package: 360-FCCLGA (25x25)
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Package: 360-CLGA, FCCLGA |
Stock2,336 |
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NXP |
IC MCU 32BIT 128KB FLASH 64QFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: CAN, I2C, SCI, SPI, USB OTG
- Peripherals: LVD, PWM, WDT
- Number of I/O: 51
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock4,608 |
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NXP |
IC MCU 16BIT 1MB FLASH 208MAPBGA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 152
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 32x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-BGA
- Supplier Device Package: 208-MAPBGA (17x17)
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Package: 208-BGA |
Stock5,232 |
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NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LCD, LVD, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,440 |
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NXP |
SENSOR DIFF PRESS 14.5PSI MAX
- Pressure Type: Differential
- Operating Pressure: 14.5 PSI (100 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -
- Voltage - Supply: 10 V ~ 16 V
- Port Size: -
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 4-SIP Module
- Supplier Device Package: -
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Package: 4-SIP Module |
Stock13,224 |
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NXP |
ACCELEROMETER
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,282 |
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NXP |
EVAL BOARD FOR BFU690F
- Type: Amplifier
- Frequency: 2.33GHz
- For Use With/Related Products: BFU690F
- Supplied Contents: Board
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Package: - |
Stock4,914 |
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NXP |
PF1510
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Package: 40-VFQFN Exposed Pad |
Stock5,632 |
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NXP |
KINETIS W 32-BIT MCU ARM CORTEX-
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: 40-QFN
- Supplier Device Package: -
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Package: 40-QFN |
Stock10,920 |
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NXP |
MULTICH CAR RADIO TUNER & AUDIO
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
CAR RADIO TUNER & AUDIO DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC TRANSLATOR BIDIR 20TSSOP
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 8
- Voltage - VCCA: 0.95 V ~ 3.6 V
- Voltage - VCCB: 1.65 V ~ 5.5 V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Push-Pull
- Data Rate: 20Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: - |
Stock5,946 |
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NXP |
IC TRANSCEIVER HALF 1/1 8SO
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: -
- Data Rate: 20kBaud
- Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: - |
Stock7,485 |
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NXP |
DIODE ZENER SOD323
- Voltage - Zener (Nom) (Vz): -
- Tolerance: -
- Power - Max: -
- Impedance (Max) (Zzt): -
- Current - Reverse Leakage @ Vr: -
- Voltage - Forward (Vf) (Max) @ If: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
BUFFER, LVC/LCX/Z SERIES
- Logic Type: -
- Number of Elements: -
- Number of Bits per Element: -
- Input Type: -
- Output Type: -
- Current - Output High, Low: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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