Page 626 - NXP Products | Heisener Electronics

BFG35,115
NXP

TRANS NPN 10V 150MA SOT223

Package: TO-261-4, TO-261AA

Stock27,630
LD6816CX4/21HYL
NXP

IC REG LINEAR 2.1V 150MA UNCASED

Package: 4-XFBGA

Stock5,904
74AVCM162836DGG:11
NXP

IC RGSTRD DVR 3-ST 20BIT 56TSSOP

Package: 56-TFSOP (0.240", 6.10mm Width)

Stock2,352
TDF8541TH/N3,118
NXP

IC AMP AUDIO BTL 36HSOP

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock2,448
PCA82C250T/N4,115
NXP

IC CAN CNTRL INTERFACE SOT96-1

Package: 8-SOIC (0.154", 3.90mm Width)

Stock5,760
MPC8378EVRAGDA
NXP

IC MPU MPC83XX 400MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock2,192
MPC8547EPXAUJB
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Package: 783-BBGA, FCBGA

Stock5,328
MPC8347ECVVAJFB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

Package: 672-LBGA

Stock4,288
MPC8313ZQAFF
NXP

IC MPU MPC83XX 333MHZ 516BGA

Package: 516-BBGA Exposed Pad

Stock4,096
MPC8360VVALFH
NXP

IC MPU MPC83XX 667MHZ 740TBGA

Package: 740-LBGA

Stock6,320
MC68360VR33L
NXP

IC MPU M683XX 33MHZ 357BGA

Package: 357-BBGA

Stock6,288
MK10DX128VMB7
NXP

IC MCU 32BIT 128KB FLASH 81BGA

Package: 81-LBGA

Stock6,672
MC9S12A256BCFU
NXP

IC MCU 16BIT 256KB FLASH 80QFP

Package: 80-QFP

Stock3,440
MCF5275CVM166
NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Package: 256-LBGA

Stock7,952
SVF512R3K2CMK4
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Package: -

Stock7,024
MC68HC908QY2CDTE
NXP

IC MCU 8BIT 1.5KB FLASH 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock3,488
LPC1113JHN33/203E
NXP

IC MCU 32BIT 24KB FLASH 33HVQFN

Package: 32-VQFN Exposed Pad

Stock6,736
LPC1113JBD48/303QL
NXP

IC MCU 32BIT 24KB FLASH 48LQFP

Package: 48-LQFP

Stock9,912
MK30DX64VLH7
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Package: 64-LQFP

Stock4,592
LPC1112FHN33/203,5
NXP

IC MCU 32BIT 16KB FLASH 33HVQFN

Package: 32-VQFN Exposed Pad

Stock21,768

Part Number	Manufacturer	Description	Package	Stock
BFG35,115	NXP	TRANS NPN 10V 150MA SOT223 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 18V Frequency - Transition: 4GHz Noise Figure (dB Typ @ f): - Gain: - Power - Max: 1W DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 100mA, 10V Current - Collector (Ic) (Max): 150mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	Package: TO-261-4, TO-261AA	Stock27,630
LD6816CX4/21HYL	NXP	IC REG LINEAR 2.1V 150MA UNCASED Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.1V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA Supplier Device Package: -	Package: 4-XFBGA	Stock5,904
74AVCM162836DGG:11	NXP	IC RGSTRD DVR 3-ST 20BIT 56TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 20 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	Package: 56-TFSOP (0.240", 6.10mm Width)	Stock2,352
TDF8541TH/N3,118	NXP	IC AMP AUDIO BTL 36HSOP Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 64W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock2,448
PCA82C250T/N4,115	NXP	IC CAN CNTRL INTERFACE SOT96-1 Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 150mV Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock5,760
MPC8378EVRAGDA	NXP	IC MPU MPC83XX 400MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock2,192
MPC8547EPXAUJB	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,328
MPC8347ECVVAJFB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock4,288
MPC8313ZQAFF	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	Package: 516-BBGA Exposed Pad	Stock4,096
MPC8360VVALFH	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock6,320
MC68360VR33L	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock6,288
MK10DX128VMB7	NXP	IC MCU 32BIT 128KB FLASH 81BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 39x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	Package: 81-LBGA	Stock6,672
MC9S12A256BCFU	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock3,440
MCF5275CVM166	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 166MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 69 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	Package: 256-LBGA	Stock7,952
SVF512R3K2CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,024
MC68HC908QY2CDTE	NXP	IC MCU 8BIT 1.5KB FLASH 16TSSOP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock3,488
LPC1113JHN33/203E	NXP	IC MCU 32BIT 24KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: 32-VQFN Exposed Pad	Stock6,736
LPC1113JBD48/303QL	NXP	IC MCU 32BIT 24KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock9,912
MK30DX64VLH7	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 22x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,592
LPC1112FHN33/203,5	NXP	IC MCU 32BIT 16KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: 32-VQFN Exposed Pad	Stock21,768
MK22FN512VMP12	NXP	IC MCU 32BIT 512KB FLASH 64BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 22x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	Package: 64-LFBGA	Stock14,004
MM912I637AM2EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock5,984
MSC8154SAG1000B	NXP	IC DSP 4X 1GHZ SC3850 783FCBGA Type: SC3850 Quad Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,712
MC9S08PL16CTG	NXP	MCU 8-BIT 16KB 20MHZ TSSOP16 Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock9,780
MC9S08PL4CTJ	NXP	MCU 8-BIT 4KB 20MHZ TSSOP20 Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock7,812
SAF7751HV-N208W-PY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
SAF7770EL-203Z13AY	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MPF5020AVNA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote