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NXP |
MOSFET RF SOT426 D2PAK
- Transistor Type: -
- Frequency: -
- Gain: -
- Voltage - Test: -
- Current Rating: -
- Noise Figure: -
- Current - Test: -
- Power - Output: -
- Voltage - Rated: -
- Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
- Supplier Device Package: SOT-426
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Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB |
Stock5,712 |
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NXP |
IC RF LDMOS TRANS CELL
- Transistor Type: N-Channel
- Frequency: -
- Gain: -
- Voltage - Test: -
- Current Rating: -
- Noise Figure: -
- Current - Test: -
- Power - Output: -
- Voltage - Rated: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,168 |
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NXP |
IC SWITCH HIGH SIDE 32SOIC
- Switch Type: General Purpose
- Number of Outputs: 4
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 7 V ~ 18 V
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Current - Output (Max): 5.5A, 11A
- Rds On (Typ): 8 mOhm, 21 mOhm
- Input Type: -
- Features: Slew Rate Controlled
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,456 |
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NXP |
IC 4BIT BI-DIR SHIFT REG 16DIP
- Logic Type: Register, Bidirectional
- Output Type: Push-Pull
- Number of Elements: 1
- Number of Bits per Element: 4
- Function: Universal
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock3,216 |
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NXP |
IC D-TYPE POS TRG SNGL 20SOIC
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 200MHz
- Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock4,880 |
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NXP |
IC D-TYPE POS TRG SNGL 20SOIC
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 100MHz
- Max Propagation Delay @ V, Max CL: 16ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Iq): 160µA
- Input Capacitance: 3.5pF
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock6,992 |
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NXP |
CANHS 8SOIC
- Applications: -
- Interface: -
- Voltage - Supply: -
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock6,800 |
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NXP |
IC MPU MPC83XX 667MHZ 672TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 672-LBGA
- Supplier Device Package: 672-TBGA (35x35)
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Package: 672-LBGA |
Stock6,816 |
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NXP |
IC MPU MPC74XX 1.42GHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.42GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BCBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
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Package: 360-BCBGA, FCCBGA |
Stock9,924 |
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NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.25GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock4,192 |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM
- Number of I/O: 48
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 17x12b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock7,584 |
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NXP |
IC MCU 8BIT 8KB OTP 44LQFP
- Core Processor: HC05
- Core Size: 8-Bit
- Speed: 2.1MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 24
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 304 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock7,024 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 8QFN
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 5
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-DFN-EP (4x4)
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Package: 8-VDFN Exposed Pad |
Stock2,664,948 |
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NXP |
IC MCU 8BIT 8KB OTP 20TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock3,872 |
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NXP |
IC MCU 8BIT 64KB FLASH 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: I2C, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock4,016 |
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NXP |
IC MCU 32BIT 512KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 94
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 41x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,872 |
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NXP |
IC MCU 8BIT 32KB FLASH 48QFN
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SCI, SPI, USB
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 37
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock5,808 |
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NXP |
IC MCU 32BIT 256KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 104
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 46x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock10,188 |
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NXP |
IC MCU 8BIT 60KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 37
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock7,272 |
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NXP |
IC MCU 32BIT 256KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 42x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock5,232 |
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NXP |
IC MCU 32BIT 128KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 33
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock19,704 |
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NXP |
IC MCU 16BIT 64KB FLASH 64LQFP
- Core Processor: 56800E
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 53
- Program Memory Size: 64KB (32K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 16
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 16x12b; D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock52,248 |
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NXP |
SENSOR ABS PRESS 16.7 PSI MAX
- Pressure Type: Absolute
- Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.8 V
- Accuracy: -
- Voltage - Supply: 4.85 V ~ 5.35 V
- Port Size: -
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 6-SIP Module
- Supplier Device Package: -
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Package: 6-SIP Module |
Stock6,564 |
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NXP |
IC W/NOISE AMPLIFIER BASE 12-QFN
- Frequency: 800MHz ~ 2.5GHz
- P1dB: -10dBm (0.1mW)
- Gain: 18dB
- Noise Figure: 1.25dB
- RF Type: Cellular, ISM, PCS, GPS
- Voltage - Supply: 2.7 V ~ 3 V
- Current - Supply: 2.8mA
- Test Frequency: 1.575GHz
- Package / Case: 12-VFQFN Exposed Pad
- Supplier Device Package: 12-QFN (3x3)
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Package: 12-VFQFN Exposed Pad |
Stock2,232 |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
TDF8536HH
- Type: Class D
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
- Voltage - Supply: 5.5V ~ 45V
- Features: -
- Mounting Type: Surface Mount
- Operating Temperature: -
- Supplier Device Package: 100-HLQFP (14x14)
- Package / Case: 100-FQFP Exposed Pad
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Package: - |
Request a Quote |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: -
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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