|
|
NXP |
MOSFET N-CH 55V 54A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 36nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1592pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 118W (Tc)
- Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
|
Package: TO-220-3 |
Stock3,328 |
|
|
|
NXP |
TRANS NPN 45V 1A TO-92
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 1A
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
- Power - Max: 830mW
- Frequency - Transition: 180MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
|
Package: TO-226-3, TO-92-3 (TO-226AA) |
Stock6,608 |
|
|
|
NXP |
DIODE UHF VAR CAP 30V SOD323
- Capacitance @ Vr, F: 2.1pF @ 28V, 1MHz
- Capacitance Ratio: 12
- Capacitance Ratio Condition: C0.5/C28
- Voltage - Peak Reverse (Max): 30V
- Diode Type: Single
- Q @ Vr, F: -
- Operating Temperature: -55°C ~ 125°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-76, SOD-323
- Supplier Device Package: SOD-323
|
Package: SC-76, SOD-323 |
Stock7,920 |
|
|
|
NXP |
IC VOLT DETECT W/RESET 8SO
- Type: Simple Reset/Power-On Reset
- Number of Voltages Monitored: 1
- Output: Push-Pull, Totem Pole
- Reset: Active High
- Reset Timeout: 400 µs Minimum
- Voltage - Threshold: 3.25V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,016 |
|
|
|
NXP |
IC LCD DRIVER COG 102X4
- Display Type: LCD
- Configuration: -
- Interface: SPI
- Digits or Characters: -
- Current - Supply: -
- Voltage - Supply: 2.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
|
Package: Die |
Stock2,576 |
|
|
|
NXP |
IC 4BIT 1OF2 MUX/DEMUX 16TSSOP
- Type: Multiplexer/Demultiplexer
- Circuit: 4 x 2:1
- Independent Circuits: 1
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,112 |
|
|
|
NXP |
IC D-TYPE POS TRG SNGL 20DHVQFN
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 150MHz
- Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-VFQFN Exposed Pad
|
Package: 20-VFQFN Exposed Pad |
Stock3,680 |
|
|
|
NXP |
IC SBC CAN/LIN 5.0V HS 32HTSSOP
- Applications: Automotive
- Interface: CAN, LIN
- Voltage - Supply: 4.5 V ~ 28 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
|
Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock4,800 |
|
|
|
NXP |
IC MUX/DEMUX TRIPLE 1X2 20DIP
- Switch Circuit: SPDT
- Multiplexer/Demultiplexer Circuit: 2:1
- Number of Circuits: 3
- On-State Resistance (Max): 120 Ohm
- Channel-to-Channel Matching (ΔRon): 6 Ohm
- Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
- Voltage - Supply, Dual (V±): ±1 V ~ 5 V
- Switch Time (Ton, Toff) (Max): 45ns, 45ns
- -3db Bandwidth: 170MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 100nA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock2,544 |
|
|
|
NXP |
IC SWITCH QUAD SPST 14DIP
- Switch Circuit: SPST - NO
- Multiplexer/Demultiplexer Circuit: 1:1
- Number of Circuits: 2
- On-State Resistance (Max): 95 Ohm
- Channel-to-Channel Matching (ΔRon): 5 Ohm
- Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 30ns, 44ns
- -3db Bandwidth: 200MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 1µA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock3,568 |
|
|
|
NXP |
IC MPU MPC74XX 600MHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BCBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
|
Package: 360-BCBGA, FCCBGA |
Stock2,288 |
|
|
|
NXP |
IC MPU M683XX 25MHZ 132QFP
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 132-BQFP Bumpered
- Supplier Device Package: 132-PQFP (24.13x24.13)
|
Package: 132-BQFP Bumpered |
Stock7,584 |
|
|
|
NXP |
IC MCU 32BIT 2MB FLASH 208LQFP
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 125MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 150
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1.064M x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 20x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP
- Supplier Device Package: 208-LQFP (28x28)
|
Package: 208-LQFP |
Stock6,688 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 360PBGA
- Core Processor: Coldfire V4
- Core Size: 32-Bit
- Speed: 266MHz
- Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 360-BBGA
- Supplier Device Package: 360-PBGA (23x23)
|
Package: 360-BBGA |
Stock5,392 |
|
|
|
NXP |
IC MCU 16BIT 64KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock17,724 |
|
|
|
NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 46
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock17,220 |
|
|
|
NXP |
IC CLOCK DIST CHIP 1:18 32-LQFP
- PLL: No
- Main Purpose: Intel CPU Servers
- Input: LVCMOS, LVPECL
- Output: LVCMOS
- Number of Circuits: 1
- Ratio - Input:Output: 2:18
- Differential - Input:Output: Yes/No
- Frequency - Max: 250MHz
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (9x9)
|
Package: 32-LQFP |
Stock4,528 |
|
|
|
NXP |
ACCELEROMETER
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,012 |
|
|
|
NXP |
KIT EVAL MC44S803 SI TUNER
- Type: Tuner
- Frequency: -
- For Use With/Related Products: 802A Tuner
- Supplied Contents: -
|
Package: - |
Stock7,596 |
|
|
|
NXP |
IC RF POWER AMP 2170MHZ 16-PFP
- Frequency: 1.93GHz ~ 1.99GHz
- P1dB: 41.8dBm (15W)
- Gain: 24dB
- Noise Figure: -
- RF Type: Cellular, W-CDMA, IS-95, N-CDMA
- Voltage - Supply: 28V
- Current - Supply: 115mA
- Test Frequency: -
- Package / Case: 16-SOP (0.276", 7.00mm Width)
- Supplier Device Package: 16-PFP
|
Package: 16-SOP (0.276", 7.00mm Width) |
Stock40,992 |
|
|
|
NXP |
I.MXRT1050 A1
- Core Processor: ARM® Cortex®-M7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
- Package / Case: 196-LFBGA
- Supplier Device Package: 196-MAPBGA (10x10)
|
Package: 196-LFBGA |
Stock8,928 |
|
|
|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 29x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock2,784 |
|
|
|
NXP |
KINETIS KM34: 75MHZ CORTEX-M0+ M
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 75MHz
- Connectivity: I²C, SPI, UART/USART
- Peripherals: DMA, LCD, WDT
- Number of I/O: 72
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 12x16b, 4x24b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
|
Package: 100-LQFP |
Stock7,136 |
|
|
|
NXP |
S12Z CORE, 64K FLASH, LIN, 64LQF
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 24
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 9x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
|
Package: - |
Request a Quote |
|
|
|
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
- Applications: -
- Current - Supply: 29µA
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
|
Package: - |
Request a Quote |
|
|
|
NXP |
S32K312, 2MB FLASH, ISELED
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
- Peripherals: DMA, I2S, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
- Data Converters: A/D 24x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-QFP
- Supplier Device Package: 100-MaxQFP (10x10)
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC MCU 32BIT 64KB FLASH 64TQFP
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 36
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-HTQFP (10x10)
|
Package: - |
Request a Quote |
|
|
|
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
|
Package: - |
Request a Quote |
|