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NXP |
MOSFET N-CH 55V 75A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 92nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 6021pF @ 25V
- Vgs (Max): ±15V
- FET Feature: -
- Power Dissipation (Max): 253W (Tc)
- Rds On (Max) @ Id, Vgs: 7.5 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock2,384 |
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NXP |
FET RF 65V 2.17GHZ SOT502B
- Transistor Type: LDMOS
- Frequency: 2.11GHz ~ 2.17GHz
- Gain: 13.5dB
- Voltage - Test: 28V
- Current Rating: 15A
- Noise Figure: -
- Current - Test: 1.15A
- Power - Output: 33W
- Voltage - Rated: 65V
- Package / Case: SOT-502B
- Supplier Device Package: SOT502B
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Package: SOT-502B |
Stock4,384 |
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NXP |
FET RF 2CH 65V 1.81GHZ
- Transistor Type: LDMOS (Dual)
- Frequency: 1.81GHz
- Gain: 18.1dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 230mA
- Power - Output: 18W
- Voltage - Rated: 65V
- Package / Case: NI-780-4S4
- Supplier Device Package: NI-780-4S4
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Package: NI-780-4S4 |
Stock3,312 |
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NXP |
TRANS NPN PREBIAS/NPN 6TSSOP
- Transistor Type: 1 NPN Pre-Biased, 1 NPN
- Current - Collector (Ic) (Max): 100mA, 200mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 10k
- Resistor - Emitter Base (R2) (Ohms): 10k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 210 @ 2mA, 10V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 10mA, 100mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: 230MHz
- Power - Max: 300mW
- Mounting Type: Surface Mount
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Supplier Device Package: 6-TSSOP
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Package: 6-TSSOP, SC-88, SOT-363 |
Stock36,000 |
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NXP |
TRIAC SOT78
- Triac Type: Standard
- Voltage - Off State: -
- Current - On State (It (RMS)) (Max): -
- Voltage - Gate Trigger (Vgt) (Max): -
- Current - Non Rep. Surge 50, 60Hz (Itsm): -
- Current - Gate Trigger (Igt) (Max): -
- Current - Hold (Ih) (Max): -
- Configuration: Single
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,480 |
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NXP |
IC BUFFER 1.8V 28BIT SOT802-1
- Logic Type: 1:2 Registered Buffer with Parity
- Supply Voltage: 1.7 V ~ 1.9 V
- Number of Bits: 28
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 160-TFBGA
- Supplier Device Package: 160-TFBGA (9x13)
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Package: 160-TFBGA |
Stock7,600 |
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NXP |
IC GATE AND 4CH 2-INP 14-SO
- Logic Type: AND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock180,000 |
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NXP |
IC TRANSCEIVER CAN HS 8HVSON
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 120mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-HVSON (3x3)
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Package: 8-VDFN Exposed Pad |
Stock2,528 |
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NXP |
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BCBGA, FCCBGA
- Supplier Device Package: 1023-FCCBGA (33x33)
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Package: 1023-BCBGA, FCCBGA |
Stock3,808 |
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NXP |
IC MPU MPC82XX 266MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock3,232 |
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NXP |
IC MPU M683XX 33MHZ 240FQFP
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 33MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-FQFP (32x32)
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Package: 240-BFQFP |
Stock4,528 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock5,136 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock9,792 |
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NXP |
IC MCU 8BIT 8KB FLASH 20TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,176 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock5,456 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,032 |
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NXP |
IC MCU 16BIT ROMLESS 44PLCC
- Core Processor: XA
- Core Size: 16-Bit
- Speed: 30MHz
- Connectivity: UART/USART
- Peripherals: PWM, WDT
- Number of I/O: 32
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock5,760 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 132MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 256
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock46,548 |
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NXP |
IC MCU 32BIT 384KB FLASH 100LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 36K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 30x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock4,352 |
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NXP |
IC MCU 8BIT ROMLESS 68PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 30
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (25x25)
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Package: 68-LCC (J-Lead) |
Stock3,648 |
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NXP |
ACCELEROMETER
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,940 |
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NXP |
RFID HITAG PROX MODULE RS232
- RF Type: Read Only
- Frequency: 125kHz
- Features: HITAG Transponders
- Package / Case: Module
- Supplier Device Package: -
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Package: Module |
Stock2,430 |
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NXP |
IC MCU 16BIT FLASH
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP-EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock3,856 |
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NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
- Core Processor: ARM® Cortex®-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP Exposed Pad
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP Exposed Pad |
Stock6,432 |
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NXP |
S32K344 ARM CORTEX-M7, 160 MHZ,
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit
- Speed: 160MHz
- Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
- Peripherals: DMA, I2S, Serial Audio, WDT
- Number of I/O: 218
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 172-QFP
- Supplier Device Package: 172-QFP (16x16)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 256KB FLSH 48HVQFN
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
SOFTWARE DEFINED RADIO
- Type: Audio, Car Signal Processor
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
IC MPU QORLQ 1.8GHZ 1517FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 12 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
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Package: - |
Request a Quote |
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