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NXP |
FET RF 68V 945MHZ NI-360
- Transistor Type: LDMOS
- Frequency: 945MHz
- Gain: 19dB
- Voltage - Test: 26V
- Current Rating: -
- Noise Figure: -
- Current - Test: 250mA
- Power - Output: 30W
- Voltage - Rated: 68V
- Package / Case: NI-360
- Supplier Device Package: NI-360
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Package: NI-360 |
Stock2,160 |
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NXP |
TRANS NPN 50V 2A SOT96-1
- Transistor Type: NPN + Diode (Isolated)
- Current - Collector (Ic) (Max): 2A
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 370mV @ 300mA, 3A
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1A, 2V
- Power - Max: 1W
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,080 |
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NXP |
TRANS PREBIAS NPN 500MW TO92-3
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 2.2k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
- Current - Collector Cutoff (Max): 500nA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock4,640 |
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NXP |
IC PWR MGMT I.MX6 56QFN
- Applications: Converter, i.MX6
- Voltage - Input: 2.8 V ~ 4.5 V
- Number of Outputs: 12
- Voltage - Output: Multiple
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock3,440 |
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NXP |
IC D-TYPE POS TRG QUAD 96LFBGA
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 4
- Number of Bits per Element: 8
- Clock Frequency: 300MHz
- Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.65 V ~ 3.6 V
- Current - Quiescent (Iq): 40µA
- Input Capacitance: 5pF
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
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Package: 96-LFBGA |
Stock4,960 |
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NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 300MHz
- Max Propagation Delay @ V, Max CL: 4.9ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 250µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock2,752 |
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NXP |
IC RGSTRD DVR 3-ST 18BIT 56TVSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 18
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.173", 4.40mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.173", 4.40mm Width) |
Stock7,888 |
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NXP |
IC 16BIT TXRX 3-ST 48SSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 48-SSOP
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Package: 48-BSSOP (0.295", 7.50mm Width) |
Stock3,824 |
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NXP |
IC SBC CAN HS 3.3V 32SOIC
- Applications: System Basis Chip
- Interface: CAN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock59,700 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,368 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock4,400 |
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NXP |
IC MPU MPC82XX 266MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock6,336 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BFBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BFBGA, FCBGA |
Stock2,560 |
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NXP |
IC MCU 32BIT 512KB FLASH 256BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 142
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPBGA
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Package: 256-LBGA |
Stock7,376 |
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NXP |
IC MCU 32BIT ROMLESS 320LFBGA
- Core Processor: ARM9?
- Core Size: 16/32-Bit
- Speed: 208MHz
- Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
- Peripherals: DMA, PWM, WDT
- Number of I/O: 55
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.3 V
- Data Converters: A/D 3x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 320-LFBGA
- Supplier Device Package: 320-LFBGA (13x13)
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Package: 320-LFBGA |
Stock13,428 |
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NXP |
IC MCU 32BIT 32KB FLASH 44MAPLGA
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 9x12b, D/A 1x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 44-VFLGA
- Supplier Device Package: 44-MAPLGA (5x5)
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Package: 44-VFLGA |
Stock4,320 |
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NXP |
IC MCU 16BIT 128KB FLASH 48LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock72,000 |
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NXP |
RF TXRX MODULE 802.15.4 SMA ANT
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: -
- Frequency: 2.4GHz
- Data Rate: -
- Power - Output: 2.5dBm
- Sensitivity: -96dBm
- Serial Interfaces: I2C, SPI, UART
- Antenna Type: Not Included, SMA
- Memory Size: 192kB ROM, 96kB RAM
- Voltage - Supply: 2.2 V ~ 3.6 V
- Current - Receiving: 37mA
- Current - Transmitting: 37mA
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Module
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Package: Module |
Stock3,060 |
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NXP |
IC CAR RADIO SGL CHIP CIRC 64QFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: 102mA
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 8 V ~ 9 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 64-BQFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-BQFP |
Stock8,010 |
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NXP |
SWITCH DETECT INTERFACE 33 CHAN
- Applications: Switch Monitoring
- Interface: SPI
- Voltage - Supply: 4.5 V ~ 36 V
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock2,688 |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock7,792 |
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NXP |
2MB NVM 2 X E200Z4 CORES 150MH
- Core Processor: e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 150MHz
- Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,480 |
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NXP |
IC MPU POWERQUICC II PRO 516PBGA
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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Package: 516-BBGA Exposed Pad |
Stock2,100 |
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NXP |
IC
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
S32K146 ARM CORTEX-M4F, 80 MHZ,
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
- Applications: Camera
- Current - Supply: -
- Voltage - Supply: 4.5V ~ 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT EXT MEM 196LFBGA
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Single-Core
- Speed: 528MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O: 127
- Program Memory Size: -
- Program Memory Type: External Program Memory
- EEPROM Size: -
- RAM Size: 1M x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 20x12b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 196-LFBGA
- Supplier Device Package: 196-LFBGA (12x12)
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Package: - |
Stock7,371 |
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