Page 926 - NXP Products | Heisener Electronics

J175,116
NXP

JFET P-CH 30V 0.4W TO92

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock5,376
BLF6G10LS-200,118
NXP

FET RF 65V 871.5MHZ SOT502B

Package: SOT-502B

Stock3,200
MC35XS3400CPNAR2
NXP

IC SWITCH QUAD HI SIDE 24-QFN

Package: 24-PowerQFN

Stock5,680
74HC4059DB,112
NXP

IC PROG DIV-BY-N COUNTER 24-SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock4,608
74LVC646ADB,112
NXP

IC TRANSCVR 8BIT N-INV 24SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock3,808
74LV541DB,118
NXP

IC BUFF/DVR TRI-ST 8BIT 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock3,216
N74F126D,623
NXP

IC BUFFER TRI-ST QUAD 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock6,048
74ABT2245DB,112
NXP

IC TRANSCVR TRI-ST 8BIT 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock4,624
SC28L92A1A,518
NXP

IC UART DUAL W/FIFO 44-PLCC

Package: 44-LCC (J-Lead)

Stock3,808
74LVC1284D,112
NXP

IC PRINTR INTFC TXRX/BUFF 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock7,536
T2081NXN7PTB
NXP

IC SOC 64BIT 8X1.5GHZ 780FCBGA

Package: 780-FBGA, FCBGA

Stock7,808
MC8641DVU1250HB
NXP

IC MPU MPC86XX 1.25GHZ 1023BGA

Package: 1023-BCBGA, FCCBGA

Stock6,848
P2040NSE7HLC
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

Package: 780-BFBGA

Stock7,728
MC68302AG16VC
NXP

IC MPU M683XX 16MHZ 144LQFP

Package: 144-LQFP

Stock6,840
MPC850DEZQ50BUR2
NXP

IC MPU MPC8XX 50MHZ 256BGA

Package: 256-BBGA

Stock6,192
P1010NSN5DFB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Package: 425-FBGA

Stock4,032
P89C668HBBD/00,557
NXP

IC MCU 8BIT 64KB FLASH 44LQFP

Package: 44-LQFP

Stock7,408
LPC1114JHN33/203E
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Package: 32-VFQFN Exposed Pad

Stock5,792
LPC1317FHN33,551
NXP

IC MCU 32BIT 64KB FLASH 33HVQFN

Package: 32-VQFN Exposed Pad

Stock9,552
MPC962309D-1H
NXP

IC CLOCK BUFFER 1:9 16-SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock2,176

Part Number	Manufacturer	Description	Package	Stock
J175,116	NXP	JFET P-CH 30V 0.4W TO92 FET Type: P-Channel Voltage - Breakdown (V(BR)GSS): 30V Drain to Source Voltage (Vdss): 30V Current - Drain (Idss) @ Vds (Vgs=0): 7mA @ 15V Current Drain (Id) - Max: - Voltage - Cutoff (VGS off) @ Id: 3V @ 10nA Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Resistance - RDS(On): 125 Ohm Power - Max: 400mW Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock5,376
BLF6G10LS-200,118	NXP	FET RF 65V 871.5MHZ SOT502B Transistor Type: LDMOS Frequency: 871.5MHz Gain: 20.2dB Voltage - Test: 28V Current Rating: 49A Noise Figure: - Current - Test: 1.4A Power - Output: 40W Voltage - Rated: 65V Package / Case: SOT-502B Supplier Device Package: SOT502B	Package: SOT-502B	Stock3,200
MC35XS3400CPNAR2	NXP	IC SWITCH QUAD HI SIDE 24-QFN Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:4 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 35 mOhm (Max) Input Type: - Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12)	Package: 24-PowerQFN	Stock5,680
74HC4059DB,112	NXP	IC PROG DIV-BY-N COUNTER 24-SSOP Logic Type: Divide-by-N Direction: Down Number of Elements: 1 Number of Bits per Element: 16 Reset: Asynchronous Timing: Synchronous Count Rate: 43MHz Trigger Type: Positive Edge Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock4,608
74LVC646ADB,112	NXP	IC TRANSCVR 8BIT N-INV 24SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock3,808
74LV541DB,118	NXP	IC BUFF/DVR TRI-ST 8BIT 20SSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	Package: 20-SSOP (0.209", 5.30mm Width)	Stock3,216
N74F126D,623	NXP	IC BUFFER TRI-ST QUAD 14SOIC Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock6,048
74ABT2245DB,112	NXP	IC TRANSCVR TRI-ST 8BIT 20SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	Package: 20-SSOP (0.209", 5.30mm Width)	Stock4,624
SC28L92A1A,518	NXP	IC UART DUAL W/FIFO 44-PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock3,808
74LVC1284D,112	NXP	IC PRINTR INTFC TXRX/BUFF 20SOIC Type: Transceiver Protocol: IEEE 1284 Number of Drivers/Receivers: 4/4 Duplex: Full Receiver Hysteresis: 400mV Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock7,536
T2081NXN7PTB	NXP	IC SOC 64BIT 8X1.5GHZ 780FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	Package: 780-FBGA, FCBGA	Stock7,808
MC8641DVU1250HB	NXP	IC MPU MPC86XX 1.25GHZ 1023BGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock6,848
P2040NSE7HLC	NXP	IC MPU Q OR IQ 1.2GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 780-BFBGA Supplier Device Package: 780-FCPBGA (23x23)	Package: 780-BFBGA	Stock7,728
MC68302AG16VC	NXP	IC MPU M683XX 16MHZ 144LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock6,840
MPC850DEZQ50BUR2	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock6,192
P1010NSN5DFB	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	Package: 425-FBGA	Stock4,032
P89C668HBBD/00,557	NXP	IC MCU 8BIT 64KB FLASH 44LQFP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	Package: 44-LQFP	Stock7,408
LPC1114JHN33/203E	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: 32-VFQFN Exposed Pad	Stock5,792
LPC1317FHN33,551	NXP	IC MCU 32BIT 64KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: 32-VQFN Exposed Pad	Stock9,552
MPC962309D-1H	NXP	IC CLOCK BUFFER 1:9 16-SOIC Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer PLL: Yes Input: LVCMOS Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 1:9 Differential - Input:Output: No/No Frequency - Max: 133.33MHz Divider/Multiplier: No/No Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.154", 3.90mm Width)	Stock2,176
PCJ7991AT/1081/M,1	NXP	IC FRACTIONAL NPLL 14-SOIC Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,264
S912XEP100J4CVL	NXP	16-BIT MCU S12X CORE 1MB FLASH Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 152 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	Package: 208-BGA	Stock5,520
S9S12GN16J1CLCR	NXP	IC MCU 16BIT 16KB FLASH 32LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: -	Request a Quote
KW45Z41083AFPBT	NXP	K4W1 HVQFN40 Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Speed: 96MHz Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 22 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 14x16b SAR Oscillator Type: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	Package: -	Request a Quote
S912ZVML32AVKH	NXP	S12Z CORE, 32K FLASH, LIN, 64LQF Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-HLQFP (10x10)	Package: -	Request a Quote
MPF5032BMMA5ES	NXP	PMIC 2 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	Package: -	Stock1,470
MC33FS6600M1ES	NXP	SAFETY SBC FOR S32S2 MCU Applications: Safety Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Stock780
SAF4000EL-102Z52AK	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote