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NXP |
CA/JCOP/MF4K/4B-UZ
- FET Type: -
- Technology: -
- Drain to Source Voltage (Vdss): -
- Current - Continuous Drain (Id) @ 25°C: -
- Drive Voltage (Max Rds On, Min Rds On): -
- Vgs(th) (Max) @ Id: -
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: -
- Vgs (Max): -
- FET Feature: -
- Power Dissipation (Max): -
- Rds On (Max) @ Id, Vgs: -
- Operating Temperature: -
- Mounting Type: -
- Supplier Device Package: -
- Package / Case: -
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Package: - |
Stock7,328 |
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NXP |
MOSFET N-CH 60V 120A I2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 95nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 13490pF @ 25V
- Vgs (Max): ±10V
- FET Feature: -
- Power Dissipation (Max): 293W (Tc)
- Rds On (Max) @ Id, Vgs: 3.4 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: I2PAK
- Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA
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Package: TO-262-3 Long Leads, I2Pak, TO-262AA |
Stock3,776 |
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NXP |
TRANS NPN 10V 60MA SOT223
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 12V
- Frequency - Transition: 6GHz
- Noise Figure (dB Typ @ f): 2.7dB ~ 3dB @ 500MHz ~ 1GHz
- Gain: -
- Power - Max: 700mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 45 @ 30mA, 5V
- Current - Collector (Ic) (Max): 60mA
- Operating Temperature: 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-261-4, TO-261AA
- Supplier Device Package: SOT-223
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Package: TO-261-4, TO-261AA |
Stock6,320 |
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NXP |
IC TEMP MONITOR 16SSOP
- Function: Temp Monitoring System (Sensor)
- Sensor Type: Internal and External
- Sensing Temperature: 0°C ~ 125°C, External Sensor
- Accuracy: ±3°C Local(Max), ±5°C Remote(Max)
- Topology: ADC, Multiplexer, Register Bank
- Output Type: SMBus
- Output Alarm: Yes
- Output Fan: No
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: 0°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.154", 3.90mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.154", 3.90mm Width) |
Stock4,352 |
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NXP |
IC SYSTEM BASIS CHIP 32LQFP
- Applications: System Basis Chip
- Current - Supply: 4.5mA
- Voltage - Supply: 5.5 V ~ 27 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock316,800 |
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NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
- Applications: System Basis Chip
- Current - Supply: 4.5mA
- Voltage - Supply: 5.5 V ~ 27 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,488 |
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NXP |
IC PENTA 35MOHM ESWITCH 24PQFN
- Switch Type: General Purpose
- Number of Outputs: 6
- Ratio - Input:Output: 1:6
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 7 V ~ 20 V
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Current - Output (Max): -
- Rds On (Typ): 35 mOhm (Max)
- Input Type: -
- Features: Watchdog Timer
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 24-PowerQFN
- Supplier Device Package: 24-PQFN (12x12)
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Package: 24-PowerQFN |
Stock25,500 |
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NXP |
IC MOTOR DRIVER PAR 32SOIC
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: Automotive
- Current - Output: 5A
- Voltage - Supply: 5 V ~ 28 V
- Voltage - Load: 5 V ~ 28 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock15,384 |
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NXP |
IC INTERFACE SW DETECT 32-SOIC
- Applications: Multiple Switch Detection
- Interface: -
- Voltage - Supply: 4.5 V ~ 36 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock4,608 |
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NXP |
IC PCI-EXPRESS 81LFBGA
- Applications: PCI Express MAX to PCI Express PHY
- Interface: IEEE 1149.1
- Voltage - Supply: 1.2V
- Package / Case: 81-LFBGA
- Supplier Device Package: 81-LFBGA (9x9)
- Mounting Type: Surface Mount
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Package: 81-LFBGA |
Stock6,560 |
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NXP |
IC DISPLAYPORT TO VGA 40HVQFN
- Applications: DisplayPort
- Interface: -
- Voltage - Supply: 3.3V
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
- Mounting Type: Surface Mount
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Package: 40-VFQFN Exposed Pad |
Stock2,224 |
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NXP |
IC CODEC-FILTER PCM 3V 20-SOIC
- Type: PCM, Filter
- Data Interface: PCM Audio Interface
- Resolution (Bits): 13 b
- Number of ADCs / DACs: 1 / 1
- Sigma Delta: No
- S/N Ratio, ADCs / DACs (db) Typ: -
- Dynamic Range, ADCs / DACs (db) Typ: -
- Voltage - Supply, Analog: -
- Voltage - Supply, Digital: 2.7 V ~ 5.25 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock60,000 |
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NXP |
IC SOC 64BIT 8X1.2GHZ 780FCBGA
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-FBGA, FCBGA |
Stock5,584 |
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NXP |
IC MPU M683XX 25MHZ 240FQFP
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-FQFP (32x32)
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Package: 240-BFQFP |
Stock6,768 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,328 |
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NXP |
IC MCU 32BIT 256KB FLASH 100LQFP
- Core Processor: 56800EX
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 86
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 16x12b, 16x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,512 |
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NXP |
IC MCU 8BIT 32KB FLASH 48LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: I2C, IRSCI, SCI, SPI
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 32
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock5,328 |
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NXP |
IC MCU 8BIT 32KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 13
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock7,472 |
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NXP |
IC MCU 32BIT 32KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 33
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,584 |
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NXP |
IC ADC 10BIT PAR 60MHZ 28-SSOP
- Number of Bits: 10
- Sampling Rate (Per Second): 60M
- Number of Inputs: 1
- Input Type: Single Ended
- Data Interface: Parallel
- Configuration: ADC
- Ratio - S/H:ADC: -
- Number of A/D Converters: 1
- Architecture: -
- Reference Type: External
- Voltage - Supply, Analog: 5V
- Voltage - Supply, Digital: 5V
- Features: -
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 28-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 28-SSOP
- Mounting Type: -
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Package: 28-SSOP (0.209", 5.30mm Width) |
Stock2,592 |
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NXP |
IC TUNER 1CHIP RADIO DSP 32HVQFN
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM
- Applications: -
- Current - Receiving: 37mA
- Data Interface: -
- Memory Size: -
- Antenna Connector: -
- Features: -
- Voltage - Supply: 3.3V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock3,276 |
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NXP |
CAR DISP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
I.MX 8QUADXPLUS 21X21
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width: 3 Core, 64-Bit
- Speed: 1.2GHz, 264MHz
- Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -
- Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Package / Case: 609-BFBGA
- Supplier Device Package: 609-FBGA (21x21)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 16KB FLASH 32HVQFN
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 30MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 29
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 12x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: - |
Stock3,099 |
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NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
I.MX 8DUALXPLUS
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width: 3 Core, 64-Bit
- Speed: 1.2GHz, 264MHz
- Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Package / Case: 609-BFBGA
- Supplier Device Package: 609-FBGA (21x21)
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Package: - |
Request a Quote |
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NXP |
IC
- Type: -
- Protocol: -
- Number of Drivers/Receivers: -
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 48KB FLASH 32LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 2x10b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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