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NXP |
JFET P-CH 30V 0.3W SOT23
- FET Type: P-Channel
- Voltage - Breakdown (V(BR)GSS): 30V
- Drain to Source Voltage (Vdss): 30V
- Current - Drain (Idss) @ Vds (Vgs=0): 7mA @ 15V
- Current Drain (Id) - Max: -
- Voltage - Cutoff (VGS off) @ Id: 3V @ 10nA
- Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
- Resistance - RDS(On): 125 Ohm
- Power - Max: 300mW
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SOT-23 (TO-236AB)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock27,594 |
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NXP |
TRANS NPN 50MA 10V 8GHZ SOT23
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 10V
- Frequency - Transition: 8GHz
- Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
- Current - Collector (Ic) (Max): 50mA
- Operating Temperature: 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,184 |
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NXP |
DIODE GEN PURP 600V 4A DO201AD
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 600V
- Current - Average Rectified (Io): 4A
- Voltage - Forward (Vf) (Max) @ If: 1.28V @ 4A
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 60ns
- Current - Reverse Leakage @ Vr: 50µA @ 600V
- Capacitance @ Vr, F: -
- Mounting Type: Through Hole
- Package / Case: DO-201AD, Axial
- Supplier Device Package: DO-201AD
- Operating Temperature - Junction: 150°C (Max)
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Package: DO-201AD, Axial |
Stock6,192 |
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NXP |
IC LCD DRIVER COG 4X40 UNCASED
- Display Type: LCD
- Configuration: 160 Segment
- Interface: I2C
- Digits or Characters: 10 Characters, 20 Characters, 160 Elements
- Current - Supply: 2.7µA
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock4,144 |
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NXP |
IC BUFFER 1.8V 1/14BIT SOT536-1
- Logic Type: 1:2 Configurable Registered Buffer
- Supply Voltage: 1.7 V ~ 1.9 V
- Number of Bits: 25, 14
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock5,488 |
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NXP |
IC I2C EEPROM DIP SWITCH 16SSOP
- Type: Multiplexer
- Circuit: 1 x 4:4
- Independent Circuits: 1
- Current - Output High, Low: 2mA, 2mA
- Voltage Supply Source: Single Supply
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.209", 5.30mm Width) |
Stock7,344 |
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NXP |
IC DTYPE LATCH OCTAL 20SOIC
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 3.5ns
- Current - Output High, Low: 3mA, 24mA
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock2,496 |
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NXP |
IC BUFF/DVR DUAL NON-INV 20DIP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Open Collector
- Current - Output High, Low: -, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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Package: 20-DIP (0.300", 7.62mm) |
Stock6,096 |
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NXP |
IC AMP AUDIO PWR 70W MONO 17SIL
- Type: Class B, Class H
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 70W x 1 @ 4 Ohm
- Voltage - Supply: 8 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -
- Supplier Device Package: DBS17P
- Package / Case: 17-SIP Formed Leads
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Package: 17-SIP Formed Leads |
Stock3,664 |
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NXP |
IC UART DUAL 44-PLCC
- Features: Configurable GPIO, Internal Oscillator, Timer/Counter
- Number of Channels: 2, DUART
- FIFO's: -
- Protocol: -
- Data Rate (Max): 1Mbps
- Voltage - Supply: 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: -
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock5,616 |
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NXP |
IC SBC CAN HS 3.3V 32SOIC
- Applications: System Basis Chip
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock4,944 |
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NXP |
IC I/O EXPANDER I2C 8B 16DIP
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock7,024 |
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NXP |
IC I/O EXPANDER I2C 8B 16SOIC
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock23,760 |
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NXP |
IC TXRX CAN SGL WIRE 14-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 500mV
- Data Rate: 83.33Kbps
- Voltage - Supply: 12V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock30,000 |
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NXP |
IC MPU MPC85XX 1.067GHZ 1023BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BFBGA, FCBGA |
Stock4,992 |
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NXP |
IC MPU MPC83XX 333MHZ 516BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: Security; SEC 2.2
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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Package: 516-BBGA Exposed Pad |
Stock4,704 |
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NXP |
IC MPU M683XX 25MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock5,744 |
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NXP |
IC MPU I.MXL 150MHZ 256MAPBGA
- Core Processor: ARM920T
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 150MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: -
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 3.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 256-LFBGA
- Supplier Device Package: -
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Package: 256-LFBGA |
Stock6,168 |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 28x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock7,712 |
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NXP |
IC MCU 32BIT 64KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: CAN, I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 46
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,640 |
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NXP |
IC MCU 32BIT 128KB FLASH 35WLCSP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 9x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 35-UFBGA, WLCSP
- Supplier Device Package: 35-WLCSP (2.53x2.98)
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Package: 35-UFBGA, WLCSP |
Stock4,720 |
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NXP |
IC MCU 32BIT 512KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 78
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 37x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock3,584 |
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NXP |
DEMO BOARD WIRELESS MCU
- Type: -
- Frequency: -
- For Use With/Related Products: -
- Supplied Contents: -
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Package: - |
Stock8,982 |
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NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,256 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 32
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,280 |
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NXP |
IC MCU 32BIT 128KB FLASH 32HVQFN
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 48MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: DMA, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 17K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 13x12b SAR; D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT ROMLESS 360BGA
- Core Processor: Coldfire V4
- Core Size: 32-Bit Single-Core
- Speed: 266MHz
- Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
- Data Converters: -
- Oscillator Type: External, Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 360-BBGA
- Supplier Device Package: 360-BGA (23x23)
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 128KB FLASH 32LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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