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NXP |
MOSFET N-CH 20V 6.3A 6TSOP
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 20V
- Current - Continuous Drain (Id) @ 25°C: 6.3A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
- Vgs(th) (Max) @ Id: 700mV @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 10.6nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 740pF @ 10V
- Vgs (Max): ±8V
- FET Feature: -
- Power Dissipation (Max): 1.75W (Tc)
- Rds On (Max) @ Id, Vgs: 28 mOhm @ 2A, 4.5V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: 6-TSOP
- Package / Case: SC-74, SOT-457
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Package: SC-74, SOT-457 |
Stock3,712 |
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NXP |
FET RF 15V 3.55GHZ NI360HF
- Transistor Type: pHEMT FET
- Frequency: 3.55GHz
- Gain: 10dB
- Voltage - Test: 12V
- Current Rating: -
- Noise Figure: -
- Current - Test: 180mA
- Power - Output: 10W
- Voltage - Rated: 15V
- Package / Case: NI-360HF
- Supplier Device Package: NI-360HF
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Package: NI-360HF |
Stock6,060 |
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NXP |
IC REG LINEAR 3.3V 300MA 5TSOP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 3.3V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.2V @ 300mA
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: SC-74A, SOT-753
- Supplier Device Package: 5-TSOP
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Package: SC-74A, SOT-753 |
Stock5,472 |
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NXP |
IC REG LINEAR 2V 300MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.16V @ 300mA
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock5,344 |
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NXP |
IC REG CTRLR FLYBACK PWM 6TSOP
- Output Isolation: Isolated
- Internal Switch(s): No
- Voltage - Breakdown: -
- Topology: Flyback
- Voltage - Start Up: 22V
- Voltage - Supply (Vcc/Vdd): 10.5 V ~ 36 V
- Duty Cycle: 90%
- Frequency - Switching: 36kHz ~ 130kHz
- Power (Watts): -
- Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: SC-74, SOT-457
- Supplier Device Package: 6-TSOP
- Mounting Type: Surface Mount
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Package: SC-74, SOT-457 |
Stock3,648 |
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NXP |
IC CTRLR SMPS GREEN OVP 8SOIC
- Output Isolation: Isolated
- Internal Switch(s): No
- Voltage - Breakdown: -
- Topology: Flyback
- Voltage - Start Up: 20.6V
- Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
- Duty Cycle: 72%
- Frequency - Switching: 91.5kHz
- Power (Watts): 75W
- Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
- Mounting Type: Surface Mount
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,888 |
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NXP |
IC REG BUFF 13BIT SSTL 56HVQFN
- Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
- Supply Voltage: 2.3 V ~ 2.7 V
- Number of Bits: 13, 26
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN
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Package: 56-VFQFN Exposed Pad |
Stock4,480 |
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NXP |
IC DECODER/DEMUX 1OF4 16DIP
- Type: Decoder/Demultiplexer
- Circuit: 1 x 2:4
- Independent Circuits: 2
- Current - Output High, Low: 3mA, 3mA
- Voltage Supply Source: Dual Supply
- Voltage - Supply: 3 V ~ 15 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock2,032 |
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NXP |
IC DIGITAL/CD DAC DECODER 80LQFP
- Type: Audio Decoder
- Applications: -
- Voltage - Supply, Analog: 3 V ~ 3.6 V
- Voltage - Supply, Digital: 1.65 V ~ 1.95 V
- Mounting Type: Surface Mount
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock7,616 |
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NXP |
IC MPU I.MX23 454MHZ 128LQFP
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 454MHz
- Co-Processors/DSP: Data; DCP
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Touchscreen
- Ethernet: -
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: Cryptography, Hardware ID
- Package / Case: 128-LQFP
- Supplier Device Package: -
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Package: 128-LQFP |
Stock6,352 |
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NXP |
IC MPU M683XX 66MHZ 196BGA
- Core Processor: FLX68000
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: -
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Touch Panel
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 196-PBGA
- Supplier Device Package: 196-BGA
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Package: 196-PBGA |
Stock5,248 |
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NXP |
IC MPU MPC8XX 50MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock7,408 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock3,632 |
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NXP |
IC MCU 32BIT 256KB FLASH 64QFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 20x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock5,312 |
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NXP |
IC MCU 32BIT 256KB FLASH 112LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 60MHz
- Connectivity: Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 73
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock6,592 |
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NXP |
IC CLK BUFFER 2:16 350MHZ 48LQFP
- Type: Fanout Buffer (Distribution), Divider, Multiplexer
- Number of Circuits: 1
- Ratio - Input:Output: 2:16
- Differential - Input:Output: Yes/No
- Input: LVCMOS, LVPECL
- Output: LVCMOS
- Frequency - Max: 350MHz
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock11,808 |
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NXP |
MAGNETIC SWITCH SPEC PURP 2SIP
- Function: Special Purpose
- Technology: Magnetoresistive
- Polarization: -
- Sensing Range: -
- Test Condition: -
- Voltage - Supply: 0.5 V ~ 16 V
- Current - Supply (Max): -
- Current - Output (Max): 14mA (Typ)
- Output Type: Current Source
- Features: Amplified Output, Temperature Compensated
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: SOT-453C
- Supplier Device Package: 2-SIP
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Package: SOT-453C |
Stock7,200 |
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NXP |
IC MIXER 150MHZ UP CONVRT 20SSOP
- RF Type: Cellular, ASK, FSK, VHF
- Frequency: 150MHz
- Number of Mixers: 2
- Gain: 17dB
- Noise Figure: 6.2dB
- Secondary Attributes: Up Converter
- Current - Supply: 4.2mA
- Voltage - Supply: 2.7 V ~ 7 V
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock4,734 |
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NXP |
I.MX 6 SERIES 32-BIT MPU QUAD A
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -20°C ~ 105°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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Package: 624-FBGA, FCBGA |
Stock4,096 |
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NXP |
912XDT512J1 GENERAL
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 20K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock4,640 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,680 |
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NXP |
16-BIT16K FLASH2K RAM
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,752 |
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NXP |
CAR DISP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 1MB FLASH 100LQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit Single-Core
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 89
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 24x12b SAR; D/A1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: - |
Request a Quote |
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NXP |
S12Z CORE,64K FLASH,CAN,64LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
- Data Converters: A/D 9x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-HLQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
PF5020
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: 10µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
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Package: - |
Request a Quote |
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NXP |
S12Z CPU, 64K FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC AMPLIFIER DBS37P
- Type: Class AB
- Output Type: 4 Half Bridge
- Max Output Power x Channels @ Load: 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
- Voltage - Supply: 6V ~ 18V
- Features: -
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 105°C (TA)
- Supplier Device Package: 37-PDBS
- Package / Case: 37-SSIP Formed Leads
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Package: - |
Request a Quote |
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