Amphenol FCI Products - Sockets for ICs, Transistors

SIP1X06-001BLF
Amphenol FCI

CONN SOCKET SIP 6POS GOLD

Package: -

Stock5,238
SIP1X08-001BLF
Amphenol FCI

CONN SOCKET SIP 8POS GOLD

Package: -

Stock4,824
SIP1X05-011BLF
Amphenol FCI

CONN SOCKET SIP 5POS GOLD

Package: -

Stock4,284
SIP1X07-011BLF
Amphenol FCI

CONN SOCKET SIP 7POS GOLD

Package: -

Stock2,034
SIP1X06-011BLF
Amphenol FCI

CONN SOCKET SIP 6POS GOLD

Package: -

Stock5,274
SIP1X07-014BLF
Amphenol FCI

CONN SOCKET SIP 7POS TIN

Package: -

Stock7,650
SIP1X08-011BLF
Amphenol FCI

CONN SOCKET SIP 8POS GOLD

Package: -

Stock8,496
SIP1X05-014BLF
Amphenol FCI

CONN SOCKET SIP 5POS TIN

Package: -

Stock6,714
SIP1X06-014BLF
Amphenol FCI

CONN SOCKET SIP 6POS TIN

Package: -

Stock6,498
69802-444LF
Amphenol FCI

CONN SOCKET

Package: -

Stock2,322
69802-432LF
Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Package: -

Stock2,682
69802-032LF
Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Package: -

Stock5,238
DILB42P-223TLF
Amphenol FCI

CONN IC DIP SOCKET

Package: -

Stock7,200
DILB32P-223TLF
Amphenol FCI

CONN IC DIP SOCKET

Package: -

Stock2,592
DILB24P-223TLF
Amphenol FCI

CONN IC DIP SOCKET

Package: -

Stock7,272
DILB24P-224TLF
Amphenol FCI

CONN IC DIP SOCKET

Package: -

Stock4,032
DILB18P-223TLF
Amphenol FCI

CONN IC DIP SOCKET

Package: -

Stock3,024
69802-144LF
Amphenol FCI

CONN SOCKET PLCC 44POS TIN

Package: -

Stock16,392
69802-044LF
Amphenol FCI

CONN SOCKET PLCC 44POS TIN

Package: -

Stock36,744
54020-32030LF
Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Package: -

Stock27,942

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
SIP1X06-001BLF	Amphenol FCI	CONN SOCKET SIP 6POS GOLD Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock5,238	6 (1 x 6)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X08-001BLF	Amphenol FCI	CONN SOCKET SIP 8POS GOLD Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock4,824	8 (1 x 8)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X05-011BLF	Amphenol FCI	CONN SOCKET SIP 5POS GOLD Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock4,284	5 (1 x 5)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X07-011BLF	Amphenol FCI	CONN SOCKET SIP 7POS GOLD Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock2,034	7 (1 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X06-011BLF	Amphenol FCI	CONN SOCKET SIP 6POS GOLD Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock5,274	6 (1 x 6)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X07-014BLF	Amphenol FCI	CONN SOCKET SIP 7POS TIN Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock7,650	7 (1 x 7)	0.100" (2.54mm)	Tin	150µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X08-011BLF	Amphenol FCI	CONN SOCKET SIP 8POS GOLD Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock8,496	8 (1 x 8)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X05-014BLF	Amphenol FCI	CONN SOCKET SIP 5POS TIN Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock6,714	5 (1 x 5)	0.100" (2.54mm)	Tin	150µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X06-014BLF	Amphenol FCI	CONN SOCKET SIP 6POS TIN Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock6,498	6 (1 x 6)	0.100" (2.54mm)	Tin	150µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
69802-444LF	Amphenol FCI	CONN SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,322	-	-	-	-	-	-	-	-	-	-	-	-	-	-
69802-432LF	Amphenol FCI	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,682	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-032LF	Amphenol FCI	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,238	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
DILB42P-223TLF	Amphenol FCI	CONN IC DIP SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,200	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DILB32P-223TLF	Amphenol FCI	CONN IC DIP SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,592	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DILB24P-223TLF	Amphenol FCI	CONN IC DIP SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,272	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DILB24P-224TLF	Amphenol FCI	CONN IC DIP SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock4,032	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DILB18P-223TLF	Amphenol FCI	CONN IC DIP SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,024	-	-	-	-	-	-	-	-	-	-	-	-	-	-
69802-144LF	Amphenol FCI	CONN SOCKET PLCC 44POS TIN Type: PLCC Number of Positions or Pins (Grid): 44 (4 x 11) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock16,392	44 (4 x 11)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-044LF	Amphenol FCI	CONN SOCKET PLCC 44POS TIN Type: PLCC Number of Positions or Pins (Grid): 44 (4 x 11) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock36,744	44 (4 x 11)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
54020-32030LF	Amphenol FCI	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	Package: -	Stock27,942	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
69802-132LF	Amphenol FCI	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock88,020	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
DILB40P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 40POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock41,388	40 (2 x 20)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB28P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock96,786	28 (2 x 14)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB20P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 20POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock56,160	20 (2 x 10)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB16P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 16POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock116,790	16 (2 x 8)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB14P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock104,868	14 (2 x 7)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB8P-223TLF	Amphenol FCI	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 105°C	Package: -	Stock233,664	8 (2 x 4)	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
54020-44030LF	Amphenol FCI	CONN SOCKET PLCC 44POS TIN Type: PLCC Number of Positions or Pins (Grid): 44 (4 x 11) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	Package: -	Stock45,306	44 (4 x 11)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C