Page 6 - Amphenol FCI Products - Sockets for ICs, Transistors

SIP41430-001LF
Amphenol FCI

CONN

Package: -

Stock3,870
54020-84030LF
Amphenol FCI

CONN SOCKET PLCC 84POS TIN

Package: -

Stock5,706
54020-52030LF
Amphenol FCI

CONN SOCKET PLCC 52POS TIN

Package: -

Stock6,750
54020-68030LF
Amphenol FCI

CONN SOCKET PLCC 68POS TIN

Package: -

Stock2,574
69802-452LF
Amphenol FCI

CONN SOCKET PLCC 52POS TIN

Package: -

Stock8,010
69802-168LF
Amphenol FCI

CONN SOCKET PLCC 68POS TIN

Package: -

Stock8,532
69802-120LF
Amphenol FCI

CONN SOCKET PLCC 20POS TIN

Package: -

Stock4,032
69802-128LF
Amphenol FCI

CONN SOCKET PLCC 28POS TIN

Package: -

Stock5,346
SIP1X02-041BLF
Amphenol FCI

CONN SOCKET SIP 2POS GOLD

Package: -

Stock3,600
DPF308-998Z
Amphenol FCI

CONN IC DIP SOCKET 8POS TIN-LEAD

Package: -

Stock2,322
DPF314-998Z
Amphenol FCI

CONN IC DIP SOCKET 14POS TINLEAD

Package: -

Stock6,462
DPF316-998Z
Amphenol FCI

CONN IC DIP SOCKET 16POS TINLEAD

Package: -

Stock7,902
SIP1X16-041BLF
Amphenol FCI

CONN SOCKET SIP 16POS GOLD

Package: -

Stock6,462
SIP050-1X27-160BLF
Amphenol FCI

CONN SOCKET SIP 27POS GOLD

Package: -

Stock3,024
SIP050-1X31-157BLF
Amphenol FCI

CONN SOCKET SIP 31POS TIN

Package: -

Stock7,128
SIP050-1X21-160BLF
Amphenol FCI

CONN SOCKET SIP 21POS GOLD

Package: -

Stock3,618
SIP050-1X26-160BLF
Amphenol FCI

CONN SOCKET SIP 26POS GOLD

Package: -

Stock2,394

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
SIP41430-001LF	Amphenol FCI	CONN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,870	-	-	-	-	-	-	-	-	-	-	-	-	-	-
54020-84030LF	Amphenol FCI	CONN SOCKET PLCC 84POS TIN Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	Package: -	Stock5,706	84 (4 x 21)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
54020-52030LF	Amphenol FCI	CONN SOCKET PLCC 52POS TIN Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	Package: -	Stock6,750	52 (4 x 13)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
54020-68030LF	Amphenol FCI	CONN SOCKET PLCC 68POS TIN Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	Package: -	Stock2,574	68 (4 x 17)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
69802-452LF	Amphenol FCI	CONN SOCKET PLCC 52POS TIN Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,010	52 (4 x 13)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-168LF	Amphenol FCI	CONN SOCKET PLCC 68POS TIN Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,532	68 (4 x 17)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-120LF	Amphenol FCI	CONN SOCKET PLCC 20POS TIN Type: PLCC Number of Positions or Pins (Grid): 20 (4 x 5) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,032	20 (4 x 5)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-128LF	Amphenol FCI	CONN SOCKET PLCC 28POS TIN Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,346	28 (4 x 7)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
SIP1X02-041BLF	Amphenol FCI	CONN SOCKET SIP 2POS GOLD Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock3,600	2 (1 x 2)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
DPF308-998Z	Amphenol FCI	CONN IC DIP SOCKET 8POS TIN-LEAD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock2,322	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
DPF314-998Z	Amphenol FCI	CONN IC DIP SOCKET 14POS TINLEAD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock6,462	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
DPF316-998Z	Amphenol FCI	CONN IC DIP SOCKET 16POS TINLEAD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock7,902	16 (2 x 8)	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP1X16-041BLF	Amphenol FCI	CONN SOCKET SIP 16POS GOLD Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock6,462	16 (1 x 16)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP050-1X27-160BLF	Amphenol FCI	CONN SOCKET SIP 27POS GOLD Type: SIP Number of Positions or Pins (Grid): 27 (1 x 27) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock3,024	27 (1 x 27)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP050-1X31-157BLF	Amphenol FCI	CONN SOCKET SIP 31POS TIN Type: SIP Number of Positions or Pins (Grid): 31 (1 x 31) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock7,128	31 (1 x 31)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP050-1X21-160BLF	Amphenol FCI	CONN SOCKET SIP 21POS GOLD Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock3,618	21 (1 x 21)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP050-1X26-160BLF	Amphenol FCI	CONN SOCKET SIP 26POS GOLD Type: SIP Number of Positions or Pins (Grid): 26 (1 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock2,394	26 (1 x 26)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-