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Molex, LLC |
CONN SOCKET LGA 1356POS GOLD
- Type: LGA
- Number of Positions or Pins (Grid): 1356 (32 x 41)
- Pitch - Mating: 0.040" (1.01mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: -
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock4,662 |
|
1356 (32 x 41) | 0.040" (1.01mm) | Gold | 15µin (0.38µm) | - | Surface Mount | Open Frame | - | - | - | - | - | - | - |
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Molex, LLC |
CONN SOCKET LGA 1366POS GOLD
- Type: LGA
- Number of Positions or Pins (Grid): 1366 (32 x 41)
- Pitch - Mating: 0.040" (1.01mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock7,038 |
|
1366 (32 x 41) | 0.040" (1.01mm) | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET LGA 1366POS GOLD
- Type: LGA
- Number of Positions or Pins (Grid): 1366 (32 x 41)
- Pitch - Mating: 0.040" (1.01mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock6,444 |
|
1366 (32 x 41) | 0.040" (1.01mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET LGA 1366POS NICKEL
- Type: LGA
- Number of Positions or Pins (Grid): 1366 (32 x 41)
- Pitch - Mating: -
- Contact Finish - Mating: Nickel
- Contact Finish Thickness - Mating: 3µin (0.08µm)
- Contact Material - Mating: -
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Nickel
- Contact Finish Thickness - Post: 3µin (0.08µm)
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock2,718 |
|
1366 (32 x 41) | - | Nickel | 3µin (0.08µm) | - | Surface Mount | Closed Frame | Solder | - | Nickel | 3µin (0.08µm) | - | - | - |
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Molex, LLC |
CONN SOCKET PGA 988POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 988 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock5,130 |
|
988 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock8,550 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock8,586 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock6,858 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock8,406 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
|
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock6,606 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
|
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock6,012 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
|
|
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Molex, LLC |
CONN SOCKET PGA 989POS GOLD
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock2,502 |
|
989 (35 x 36) | 0.039" (1.00mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | - |
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Molex, LLC |
CONN SOCKET TRANSIST TO-220 3POS
- Type: Transistor, TO-220
- Number of Positions or Pins (Grid): 3 (Rectangular)
- Pitch - Mating: -
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Material - Mating: Brass
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 100µin (2.54µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA66), Nylon 6/6
- Operating Temperature: -40°C ~ 80°C
|
Package: - |
Stock2,304 |
|
3 (Rectangular) | - | Tin | 100µin (2.54µm) | Brass | Through Hole | Closed Frame | Solder | - | Tin | 100µin (2.54µm) | Brass | Polyamide (PA66), Nylon 6/6 | -40°C ~ 80°C |
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Molex, LLC |
LGA2011-3 SOCKET FULL ASSY 30U'
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock5,976 |
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- | - | - | - | - | - | - | - | - | - | - | - | - | - |
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Molex, LLC |
CONN SOCKET LGA 2011POS GOLD
- Type: LGA
- Number of Positions or Pins (Grid): 2011 (47 x 58)
- Pitch - Mating: 0.040" (1.01mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Thermoplastic
- Operating Temperature: -
|
Package: - |
Stock3,924 |
|
2011 (47 x 58) | 0.040" (1.01mm) | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
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Molex, LLC |
LGA2011-3 SOCKET FULL ASSY 15U'
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock3,762 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
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Molex, LLC |
CONN SOCKET LGA 2011POS GOLD
- Type: LGA
- Number of Positions or Pins (Grid): 2011 (47 x 58)
- Pitch - Mating: 0.040" (1.01mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Thermoplastic
- Operating Temperature: -
|
Package: - |
Stock6,030 |
|
2011 (47 x 58) | 0.040" (1.01mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
|
|
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Molex, LLC |
CONN CAMERA SOCKET 32POS GOLD
- Type: Camera Socket
- Number of Positions or Pins (Grid): 32 (4 x 8)
- Pitch - Mating: 0.035" (0.90mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 3µin (0.08µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.035" (0.90mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Plastic
- Operating Temperature: -
|
Package: - |
Stock5,364 |
|
32 (4 x 8) | 0.035" (0.90mm) | Gold | 3µin (0.08µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | Plastic | - |
|
|
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Molex, LLC |
CONN CAM SOCKET 24POS GOLD
- Type: Camera Socket
- Number of Positions or Pins (Grid): 24 (2 x 4, 2 x 8)
- Pitch - Mating: 0.024" (0.60mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.024" (0.60mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Plastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock8,568 |
|
24 (2 x 4, 2 x 8) | 0.024" (0.60mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.024" (0.60mm) | Gold | Flash | Copper Alloy | Plastic | -55°C ~ 85°C |
|
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Molex, LLC |
CONN CAM SOCKET 24POS GOLD
- Type: Camera Socket
- Number of Positions or Pins (Grid): 24 (4 x 6)
- Pitch - Mating: 0.035" (0.90mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.035" (0.90mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock7,200 |
|
24 (4 x 6) | 0.035" (0.90mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 85°C |
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Molex, LLC |
SMIA85 CAMERA SOCKET T/BRD 18PIN
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock8,550 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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Molex, LLC |
CONN CAM SOCKET 34POS GOLD
- Type: Camera Socket
- Number of Positions or Pins (Grid): 34 (2 x 8, 2 x 9)
- Pitch - Mating: 0.024" (0.60mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.024" (0.60mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Plastic
- Operating Temperature: -30°C ~ 85°C
|
Package: - |
Stock5,652 |
|
34 (2 x 8, 2 x 9) | 0.024" (0.60mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.024" (0.60mm) | - | - | Copper Alloy | Plastic | -30°C ~ 85°C |
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Molex, LLC |
SMIA55 CAMERA SOCKET BOTTOM CONT
- Type: Camera Socket
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.028" (0.70mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount, Through Board
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.028" (0.70mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock8,406 |
|
12 (2 x 6) | 0.028" (0.70mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.028" (0.70mm) | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
|
|
|
Molex, LLC |
SMIA55 CAMERA SOCKET BOTTOM CONT
- Type: Camera Socket
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.028" (0.70mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount, Through Board
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.028" (0.70mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock3,438 |
|
12 (2 x 6) | 0.028" (0.70mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.028" (0.70mm) | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
|
|
|
Molex, LLC |
TOP-MOUNT CAMERA SOCKET FOR SMIA
- Type: Camera Socket
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.033" (0.85mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Phosphor Bronze Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.033" (0.85mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Phosphor Bronze Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock8,154 |
|
12 (2 x 6) | 0.033" (0.85mm) | Gold | 12µin (0.30µm) | Phosphor Bronze Alloy | Surface Mount | Open Frame | Solder | 0.033" (0.85mm) | Gold | Flash | Phosphor Bronze Alloy | Thermoplastic | -55°C ~ 85°C |
|
|
|
Molex, LLC |
SMIA65 TOP MNT CAMERA SOCKET
- Type: Camera Socket
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.037" (0.95mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock5,364 |
|
12 (2 x 6) | 0.037" (0.95mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
|
|
|
Molex, LLC |
SMIA65 CAMERA SOCKET CONTACT
- Type: Camera Socket
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.037" (0.95mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12µin (0.30µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount, Through Board
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.037" (0.95mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 85°C
|
Package: - |
Stock6,714 |
|
12 (2 x 6) | 0.037" (0.95mm) | Gold | 12µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.037" (0.95mm) | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
|
|
|
Molex, LLC |
CONN CAM SOCKET 32POS GOLD
- Type: Camera Socket
- Number of Positions or Pins (Grid): 32 (4 x 8)
- Pitch - Mating: 0.035" (0.90mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 3µin (0.08µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.035" (0.90mm)
- Contact Finish - Post: Nickel
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
|
Package: - |
Stock7,020 |
|
32 (4 x 8) | 0.035" (0.90mm) | Gold | 3µin (0.08µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Nickel | 50µin (1.27µm) | Copper Alloy | Thermoplastic | - |
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