Page 2 - Molex, LLC Products - Sockets for ICs, Transistors

0475962032
Molex, LLC

CONN SOCKET LGA 1155POS

Package: -

Stock6,192
0475960532
Molex, LLC

CONN SOCKET LGA 1156POS GOLD

Package: -

Stock2,682
0475960233
Molex, LLC

CONN SOCKET LGA 1155POS GOLD

Package: -

Stock7,452
0475960232
Molex, LLC

CONN SOCKET LGA 1155POS GOLD

Package: -

Stock3,726
0475960132
Molex, LLC

CONN SOCKET LGA 1156POS GOLD

Package: -

Stock6,408

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
0475962032	Molex, LLC	CONN SOCKET LGA 1155POS Type: LGA Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,192	-	-	-	-	-	-	-	-	-	-	-	-	-	-
0475960532	Molex, LLC	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock2,682	1156 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960233	Molex, LLC	CONN SOCKET LGA 1155POS GOLD Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock7,452	1155 (40 x 40)	0.036" (0.91mm)	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960232	Molex, LLC	CONN SOCKET LGA 1155POS GOLD Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock3,726	1155 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960132	Molex, LLC	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock6,408	1156 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-