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NXP |
JFET N-CH 25V 250MW SOT23
- FET Type: N-Channel
- Voltage - Breakdown (V(BR)GSS): 25V
- Drain to Source Voltage (Vdss): 25V
- Current - Drain (Idss) @ Vds (Vgs=0): 12mA @ 10V
- Current Drain (Id) - Max: -
- Voltage - Cutoff (VGS off) @ Id: 1V @ 1µA
- Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
- Resistance - RDS(On): 50 Ohm
- Power - Max: 250mW
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SOT-23 (TO-236AB)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock6,192 |
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NXP |
TRANS PREBIAS PNP 250MW SMT3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 1k
- Resistor - Emitter Base (R2) (Ohms): 10k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock3,680 |
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NXP |
IC LCD DRIVER 56TSSOP
- Display Type: LCD
- Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
- Interface: I2C
- Digits or Characters: 10 Characters, 20 Characters, 160 Elements
- Current - Supply: 6µA
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock4,688 |
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NXP |
IC GATE XOR 4CH 2-INP 14-TSSOP
- Logic Type: XOR (Exclusive OR)
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 1.65 V ~ 3.6 V
- Current - Quiescent (Max): 10µA
- Current - Output High, Low: 24mA, 24mA
- Logic Level - Low: 0.12 V ~ 0.8 V
- Logic Level - High: 1.08 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock2,704 |
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NXP |
IC GATE NAND 4CH 2-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 3 V ~ 15 V
- Current - Quiescent (Max): 4µA
- Current - Output High, Low: 3mA, 3mA
- Logic Level - Low: 1 V ~ 2.5 V
- Logic Level - High: 4 V ~ 12.5 V
- Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,720 |
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NXP |
IC GATE AND 4CH 2-INP 14-DIP
- Logic Type: AND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,512 |
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NXP |
IC GATE NOR 4CH 2-INP 14-SO
- Logic Type: NOR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock3,376 |
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NXP |
IC UART QUAD W/FIFO 80-LQFP
- Features: Internal Oscillator, Timer/Counter
- Number of Channels: 4, QUART
- FIFO's: 16 Byte
- Protocol: -
- Data Rate (Max): -
- Voltage - Supply: 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock4,640 |
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NXP |
CANHS 8SOIC
- Applications: -
- Interface: -
- Voltage - Supply: -
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock6,992 |
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NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 1 Core, 64-Bit
- Speed: 2.0GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (5), 10 Gbps (1)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1295-BBGA, FCBGA
- Supplier Device Package: 1295-FCPBGA (37.5x37.5)
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Package: 1295-BBGA, FCBGA |
Stock3,664 |
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NXP |
IC MPU MPC6XX 200MHZ 255FCCBGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 255-BCBGA Exposed Pad
- Supplier Device Package: 255-FCCBGA (21x21)
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Package: 255-BCBGA Exposed Pad |
Stock5,088 |
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NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BBGA, FCBGA |
Stock2,992 |
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NXP |
IC MCU 8BIT 4KB OTP 20DIP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, UART/USART
- Peripherals: Brown-out Detect/Reset, LED, POR, WDT
- Number of I/O: 18
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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Package: 20-DIP (0.300", 7.62mm) |
Stock7,536 |
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NXP |
IC MCU 32BIT 1MB FLASH 144MAPBGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 58x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock4,432 |
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NXP |
IC MCU 8BIT 16KB FLASH 28TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 22
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
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Package: 28-TSSOP (0.173", 4.40mm Width) |
Stock5,104 |
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NXP |
IC MCU 32BIT 128KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 10K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock27,996 |
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NXP |
IC RTC CLK/CALENDAR I2C 8-HVSON
- Type: Clock/Calendar
- Features: Alarm, Leap Year, Watchdog Timer
- Memory Size: -
- Time Format: HH:MM:SS (12/24 hr)
- Date Format: YY-MM-DD-dd
- Interface: I2C, 2-Wire Serial
- Voltage - Supply: 1.6 V ~ 5.5 V
- Voltage - Supply, Battery: 1.8 V ~ 5.5 V
- Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-HVSON (4x4)
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Package: 8-VDFN Exposed Pad |
Stock43,254 |
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NXP |
IC PRESSURE SENSOR 5-MPAK
- Pressure Type: Vented Gauge
- Operating Pressure: 1.45 PSI (10 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 55 mV (3V)
- Accuracy: ±5%
- Voltage - Supply: 3 V ~ 6 V
- Port Size: Male - 0.12" (2.97mm) Tube
- Port Style: Barbless
- Features: -
- Termination Style: PCB
- Maximum Pressure: 10.88 PSI (75 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 5-SMD Module
- Supplier Device Package: 5-MPAK
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Package: 5-SMD Module |
Stock8,370 |
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NXP |
ACCELEROMETER 60G PCM/SPI 16QFN
- Type: Digital
- Axis: Z
- Acceleration Range: ±60g
- Sensitivity (LSB/g): 8
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: PCM, SPI
- Voltage - Supply: 4.2 V ~ 17 V
- Features: Selectable Low Pass Filter
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN Exposed Pad |
Stock5,544 |
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NXP |
DEMO BOARD MCU WIRELESS
- Type: -
- Frequency: -
- For Use With/Related Products: -
- Supplied Contents: -
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Package: - |
Stock3,744 |
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NXP |
BOARD DEMO SA636DK
- Type: Receiver
- Frequency: 110.59MHz
- For Use With/Related Products: SA636
- Supplied Contents: Board
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Package: - |
Stock4,554 |
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NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
- Applications: -
- Current - Supply: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,752 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock16,968 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 28K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock51,864 |
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NXP |
KINETIS L 32-BIT MCU ARM CORTEX
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, SPI, UART/USART, USB
- Peripherals: DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 23
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-UFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-UFQFN Exposed Pad |
Stock6,928 |
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NXP |
INTEGRATED CIRCUIT
- Function: -
- Interface: -
- Number of Circuits: -
- Voltage - Supply: -
- Current - Supply: -
- Power (Watts): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
NXP 32-BIT MCU, POWER ARCH CORE,
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 144MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: - |
Request a Quote |
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NXP |
IC TRANSCEIVER HALF 2/2 14SO
- Type: Transceiver
- Protocol: CANbus
- Number of Drivers/Receivers: 2/2
- Duplex: Half
- Receiver Hysteresis: 50 mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
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Package: - |
Stock14,670 |
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