Page 132 - NXP Products | Heisener Electronics

BUK7C1R8-60EJ
NXP

MOSFET N-CH 60V 200A D2PAK-7

Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

Stock2,224
PSMN3R7-25YLC,115
NXP

MOSFET N-CH 25V 97A LFPAK

Package: SC-100, SOT-669

Stock7,584
MC44BS373CAEF
NXP

AUDIO VIDEO INTERGRATION MOD

Package: 16-SOIC (0.154", 3.90mm Width)

Stock15,948
NX5P3201CUKZ
NXP

IC USB SWITCH HI SD 3A 30WLCSP

Package: 30-UFBGA, WLCSP

Stock2,128
MC33931VWR2
NXP

IC MOTOR DRIVER PAR 44HSOP

Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock4,464
GTL2008PW,118
NXP

IC TRANSLATOR GTL-LVTTL 28-TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock5,328
74HC7030D,653
NXP

IC FIFO REGISTER 9X64 28SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock2,416
TDA9881TS/V2,518
NXP

IC IF-PLL DEMOD 24-SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock6,176
PCA9501PW,112
NXP

IC I/O EXPANDER I2C 8B 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock6,240
PCA9535D,118
NXP

IC I/O EXPANDER I2C 16B 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock2,656
TJA1041T/N1,118
NXP

IC TXRX CAN 14BIT 27V 14-SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock4,928
MPC8360ZUADDH
NXP

IC MPU MPC83XX 266MHZ 740TBGA

Package: 740-LBGA

Stock6,544
MPC8358VVAGDG
NXP

IC MPU MPC83XX 400MHZ 740TBGA

Package: 740-LBGA

Stock5,040
XPC850CVR50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

Package: 256-BBGA

Stock4,896
MC9S08SH4CTGR
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock85,152
MC56F8036VLF
NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Package: 48-LQFP

Stock24,096
LPC1114FHN33/302:5
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Package: 32-VQFN Exposed Pad

Stock19,680
MPL115A1T1
NXP

IC BAROMETER SPI DGTL MINI 8-LGA

Package: 8-TLGA

Stock36,858
MMA2612NKWR2
NXP

ACCELEROMETER 125G PCM 16QFN

Package: 16-QFN Exposed Pad

Stock7,956
MMA20312BVT1
NXP

IC AMP HBT INGAP/GAAS 12QFN

Package: 12-VFQFN Exposed Pad

Stock5,868

Part Number	Manufacturer	Description	Package	Stock
BUK7C1R8-60EJ	NXP	MOSFET N-CH 60V 200A D2PAK-7 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: D2PAK (7-Lead) Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	Stock2,224
PSMN3R7-25YLC,115	NXP	MOSFET N-CH 25V 97A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 97A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 1.95V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 21.6nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1585pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 64W (Tc) Rds On (Max) @ Id, Vgs: 3.9 mOhm @ 20A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	Package: SC-100, SOT-669	Stock7,584
MC44BS373CAEF	NXP	AUDIO VIDEO INTERGRATION MOD Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.154", 3.90mm Width)	Stock15,948
NX5P3201CUKZ	NXP	IC USB SWITCH HI SD 3A 30WLCSP Switch Type: USB Switch Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: Parallel Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3A, 6A Rds On (Typ): 8 mOhm, 32 mOhm Input Type: Non-Inverting Features: Slew Rate Controlled, Status Flag Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 30-UFBGA, WLCSP Supplier Device Package: 30-WLCSP (2.26x2.56)	Package: 30-UFBGA, WLCSP	Stock2,128
MC33931VWR2	NXP	IC MOTOR DRIVER PAR 44HSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Automotive Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 44-HSOP	Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock4,464
GTL2008PW,118	NXP	IC TRANSLATOR GTL-LVTTL 28-TSSOP Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 12 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL, LVTTL Output Signal: LVTTL, GTL Output Type: Open Drain, Tri-State Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock5,328
74HC7030D,653	NXP	IC FIFO REGISTER 9X64 28SOIC Memory Size: 576 (64 x 9) Function: Asynchronous, Synchronous Data Rate: 33MHz Access Time: 36ns Voltage - Supply: 2 V ~ 6 V Current - Supply (Max): - Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SO	Package: 28-SOIC (0.295", 7.50mm Width)	Stock2,416
TDA9881TS/V2,518	NXP	IC IF-PLL DEMOD 24-SSOP Type: Demodulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock6,176
PCA9501PW,112	NXP	IC I/O EXPANDER I2C 8B 20TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: EEPROM, POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock6,240
PCA9535D,118	NXP	IC I/O EXPANDER I2C 16B 24SOIC Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock2,656
TJA1041T/N1,118	NXP	IC TXRX CAN 14BIT 27V 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock4,928
MPC8360ZUADDH	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock6,544
MPC8358VVAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock5,040
XPC850CVR50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock4,896
MC9S08SH4CTGR	NXP	IC MCU 8BIT 4KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock85,152
MC56F8036VLF	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock24,096
LPC1114FHN33/302:5	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	Package: 32-VQFN Exposed Pad	Stock19,680
MPL115A1T1	NXP	IC BAROMETER SPI DGTL MINI 8-LGA Pressure Type: Absolute Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa) Output Type: SPI Output: 10 b Accuracy: ±0.145 PSI (±1 kPa) Voltage - Supply: 2.375 V ~ 5.5 V Port Size: - Port Style: No Port Features: Shutdown Mode, Standby Mode Termination Style: PCB Maximum Pressure: 145.04 PSI (1000 kPa) Operating Temperature: -40°C ~ 105°C Package / Case: 8-TLGA Supplier Device Package: 8-LGA	Package: 8-TLGA	Stock36,858
MMA2612NKWR2	NXP	ACCELEROMETER 125G PCM 16QFN Type: Digital Axis: X Acceleration Range: ±125g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM Voltage - Supply: 6.3 V ~ 30 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	Package: 16-QFN Exposed Pad	Stock7,956
MMA20312BVT1	NXP	IC AMP HBT INGAP/GAAS 12QFN Frequency: 1.8GHz ~ 2.2GHz P1dB: 28.2dBm Gain: 27.2dB Noise Figure: 3.3dB RF Type: LTE, PCS, TD-SCDMA, UMTS Voltage - Supply: 5V Current - Supply: 70mA Test Frequency: 2.14GHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	Package: 12-VFQFN Exposed Pad	Stock5,868
MWCT1013VLH	NXP	32BIT256K FLASHIFR PGM Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock9,012
SAF3560HV/V1101,55	NXP	DIGITAL RADIO PROCESSOR 144HLQFP Applications: Automotive Interface: I²C, SPI, UART Voltage - Supply: 1.2V, 3.3V Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20) Mounting Type: Surface Mount	Package: 144-LQFP Exposed Pad	Stock5,040
SPC5606BK0MLL6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,072
SPC5643LFK0MLQ1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock5,568
S912XET256BCALR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock5,760
S9S08DN48F2MLH	NXP	8-BIT MCU S08 CORE 48KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock3,696
MIMX8MM2CVTKZAA	NXP	IC MPU I.MX 8M MINI SOLO BGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-FCBGA (14x14)	Package: 486-LFBGA, FCBGA	Stock4,624
SAF7770EL-200Z10AY	NXP	SAF7770EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	Package: -	Request a Quote