NXP Products

THYRISTOR 200V 0.8A SOT54

• Voltage - Off State: 200V
• Voltage - Gate Trigger (Vgt) (Max): 800mV
• Current - Gate Trigger (Igt) (Max): 200µA
• Voltage - On State (Vtm) (Max): 1.7V
• Current - On State (It (AV)) (Max): 500mA
• Current - On State (It (RMS)) (Max): 800mA
• Current - Hold (Ih) (Max): 5mA
• Current - Off State (Max): 100µA
• Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 9A
• SCR Type: Sensitive Gate
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

DIODE ZENER 6.8V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 6.8V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 2µA @ 4V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

IC CTLR SMPS STANDBY 6TSOP

• Applications: Secondary-Side Controller
• Voltage - Input: 5 V ~ 30 V
• Voltage - Supply: 5 V ~ 30 V
• Current - Supply: 30µA
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

IC LED DRIVER LINEAR DIM 24TSSOP

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 8
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 40V
• Current - Output / Channel: 100mA
• Frequency: 100kHz ~ 1MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: Open Drain
• Voltage - Supply: 1.2 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: -, 32mA
• Logic Level - Low: 0.7 V ~ 0.8 V
• Logic Level - High: 1.7 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

IC BUFF DVR TRI-ST 16BIT 56VFBGA

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (4.5x7)

IC TRANSCVR 8BIT N-INV 20SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC BUFF INVERT 5.5V 20TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

IC PHONE TONE RINGER 2KHZ 8-DIP

• Function: Tone Ringer
• Interface: -
• Number of Circuits: 1
• Voltage - Supply: 5V
• Current - Supply: 20mA
• Power (Watts): 1W
• Operating Temperature: -20°C ~ 60°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

IC I2C 2:1 SELECTOR 16-HVQFN

• Applications: 2-Channel I2C Multiplexer
• Interface: I2C
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (4x4)
• Mounting Type: Surface Mount

IC BUFFER I2C/SMBUS HOTSWAP 8SO

• Type: Buffer, Accelerator
• Applications: I2C - Hotswap
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 5pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

IC TRANSCEIVER J-1850 BUS 8-SOIC

• Type: Transceiver
• Protocol: -
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 200mV
• Data Rate: 10.4Kbps
• Voltage - Supply: 9 V ~ 16 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC MPU M680X0 16MHZ 68PLCC

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

IC MPU M680X0 16MHZ 100QFP

• Core Processor: 68020
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 100-BQFP
• Supplier Device Package: 100-QFP (14x20)

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 25x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

IC MCU 8BIT 16KB OTP 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

IC MCU 32BIT 6MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

IC MCU 8BIT 12KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

MODULE MCF5301 32-BIT VOIP

• Module/Board Type: MCU, VOIP Core
• Core Processor: ColdFire V3, MCF53017
• Co-Processor: -
• Speed: 80MHz
• Flash Size: 32MB
• RAM Size: 64MB
• Connector Type: Edge Connector
• Size / Dimension: -
• Operating Temperature: -

IC RF TXRX+MCU 802.15.4 56-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: -
• Frequency: 2.4GHz
• Data Rate (Max): 1Mbps
• Power - Output: 3dBm
• Sensitivity: -97dBm
• Memory Size: 192kB ROM, 96kB RAM
• Serial Interfaces: SPI, UART
• GPIO: 21
• Voltage - Supply: 2.2 V ~ 3.6 V
• Current - Receiving: 37mA
• Current - Transmitting: 38mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN

FS6500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

PF1510

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

32 BIT,SINGLE CORE,2M FL

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 160MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

VMB64 64K FLASH 4K RAM 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

NO DESCRIPTION

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -