Page 157 - NXP Products | Heisener Electronics

MRF5S9070MR1
NXP

FET RF 68V 880MHZ TO-270-2

Package: TO-270-2

Stock3,504
PMDPB56XN,115
NXP

MOSFET 2N-CH 30V 3.1A HUSON6

Package: 6-UDFN Exposed Pad

Stock162,000
TEA1742T/N1,118
NXP

IC CTRLR GREENCHIP PFC 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock7,376
MC34937APEK
NXP

IC MOTOR CTRLR SPI 54SOIC

Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock5,520
74ABT2240PW,112
NXP

IC BUFF INVERT 5.5V 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock5,024
SC16C554BIB80,528
NXP

IC UART QUAD W/FIFO 80-LQFP

Package: 80-LQFP

Stock3,664
M86295G12
NXP

IC C2K 900MHZ 16CH VOIP 625BGA

Package: -

Stock5,376
PTN36241BBS,115
NXP

IC REDRIVER USB 3.0 1CH 24HVQFN

Package: 24-VFQFN Exposed Pad

Stock12,984
PCA9500PW,112
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock16,044
SC16IS750IBS,151
NXP

IC UART I2C/SPI 24-HVQFN

Package: 24-VFQFN Exposed Pad

Stock25,020
MC68306EH16B
NXP

IC MPU M683XX 16MHZ 132QFP

Package: 132-BQFP Bumpered

Stock7,760
MPC862TVR100B
NXP

IC MPU MPC8XX 100MHZ 357BGA

Package: 357-BBGA

Stock5,648
MCIMX6U5EVM10AC
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

Package: 624-LFBGA

Stock32,628
MCF5271CVM150
NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Package: 196-LBGA

Stock3,328
MK22FN1M0VLL12
NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Package: 100-LQFP

Stock7,356
SPC5604PEF1MLL6
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Package: 100-LQFP

Stock5,712
MC9RS08KB8CSG
NXP

IC MCU 8BIT 8KB FLASH 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock4,528
MK50DX128CLH7
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Package: 64-LQFP

Stock6,256
LPC2292FET144/01,5
NXP

IC MCU 32BIT 256KB FLASH 144BGA

Package: 144-TFBGA

Stock15,210
MM912G634CV2AP
NXP

IC MCU 16BIT 48KB FLASH 48LQFP

Package: 48-LQFP

Stock6,060

Part Number	Manufacturer	Description	Package	Stock
MRF5S9070MR1	NXP	FET RF 68V 880MHZ TO-270-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 17.8dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 14W Voltage - Rated: 68V Package / Case: TO-270-2 Supplier Device Package: TO-270-2	Package: TO-270-2	Stock3,504
PMDPB56XN,115	NXP	MOSFET 2N-CH 30V 3.1A HUSON6 FET Type: 2 N-Channel (Dual) FET Feature: Logic Level Gate Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 3.1A Rds On (Max) @ Id, Vgs: 73 mOhm @ 3.1A, 4.5V Vgs(th) (Max) @ Id: 1.5V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V Power - Max: 510mW Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 6-UDFN Exposed Pad Supplier Device Package: DFN2020-6	Package: 6-UDFN Exposed Pad	Stock162,000
TEA1742T/N1,118	NXP	IC CTRLR GREENCHIP PFC 8-SOIC Mode: Continuous Conduction (CCM) Frequency - Switching: 125kHz Current - Startup: 60µA Voltage - Supply: 10.6 V ~ 38 V Operating Temperature: -20°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock7,376
MC34937APEK	NXP	IC MOTOR CTRLR SPI 54SOIC Motor Type - Stepper: - Motor Type - AC, DC: Brushless DC (BLDC) Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: SPI Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: - Voltage - Supply: 6 V ~ 58 V Voltage - Load: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock5,520
74ABT2240PW,112	NXP	IC BUFF INVERT 5.5V 20TSSOP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock5,024
SC16C554BIB80,528	NXP	IC UART QUAD W/FIFO 80-LQFP Features: - Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	Package: 80-LQFP	Stock3,664
M86295G12	NXP	IC C2K 900MHZ 16CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,376
PTN36241BBS,115	NXP	IC REDRIVER USB 3.0 1CH 24HVQFN Type: Buffer, ReDriver Applications: USB 3.0 Input: - Output: - Data Rate (Max): 5Gbps Number of Channels: 2 Delay Time: 1.0ns Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: - Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 100mA Operating Temperature: 0°C ~ 85°C Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock12,984
PCA9500PW,112	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: No Features: EEPROM, POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock16,044
SC16IS750IBS,151	NXP	IC UART I2C/SPI 24-HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Operating Temperature: -40°C ~ 95°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock25,020
MC68306EH16B	NXP	IC MPU M683XX 16MHZ 132QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	Package: 132-BQFP Bumpered	Stock7,760
MPC862TVR100B	NXP	IC MPU MPC8XX 100MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock5,648
MCIMX6U5EVM10AC	NXP	IC MPU I.MX6DL 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock32,628
MCF5271CVM150	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock3,328
MK22FN1M0VLL12	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 33x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,356
SPC5604PEF1MLL6	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, FlexRay, LIN, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 68 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 40K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 30x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,712
MC9RS08KB8CSG	NXP	IC MCU 8BIT 8KB FLASH 16SOIC Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.154", 3.90mm Width)	Stock4,528
MK50DX128CLH7	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 22x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock6,256
LPC2292FET144/01,5	NXP	IC MCU 32BIT 256KB FLASH 144BGA Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (12x12)	Package: 144-TFBGA	Stock15,210
MM912G634CV2AP	NXP	IC MCU 16BIT 48KB FLASH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock6,060
MMA6821BKCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,182
MMA5124NDIKGCWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,022
MFRC50001T/0FE,112	NXP	IC MIFARE READER 32SO Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: SPI Voltage - Supply: 5V Operating Temperature: -40°C ~ 150°C Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	Package: 32-SOIC (0.295", 7.50mm Width)	Stock19,524
J3A081GX0/T1AG2384	NXP	IC RF MODULE PLLCC8 Function: - Frequency: - RF Type: - Secondary Attributes: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,448
TWR-METRO-KIT-NA	NXP	KIT METRO AREA NETWORK DEV TOWER Type: Transceiver, 6LoWPAN Frequency: - For Use With/Related Products: Freescale Tower System Supplied Contents: 4 Boards	Package: -	Stock6,192
SPC5606BK0CLU4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock5,744
MC9S08PB16VTG	NXP	IC MCU 8BIT 16KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: -	Request a Quote
TDA20142-2	NXP	HIGH QUALITY INTEGRATED CIRCUIT Type: Tuner Applications: - Mounting Type: Surface Mount Package / Case: 28-VFQFN Exposed Pad Supplier Device Package: 28-HVQFN (5x5)	Package: -	Request a Quote