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NXP |
MOSFET N-CH 30V 6A SC-73
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs: 11nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 492pF @ 15V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 820mW (Ta), 8.33W (Tc)
- Rds On (Max) @ Id, Vgs: 29 mOhm @ 6A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: SOT-223
- Package / Case: TO-261-4, TO-261AA
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Package: TO-261-4, TO-261AA |
Stock5,056 |
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NXP |
FET RF 10V 400MHZ 6TSSOP
- Transistor Type: N-Channel Dual Gate
- Frequency: 400MHz
- Gain: 27dB
- Voltage - Test: 5V
- Current Rating: 30mA
- Noise Figure: 1dB
- Current - Test: 15mA
- Power - Output: -
- Voltage - Rated: 10V
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Supplier Device Package: 6-TSSOP
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Package: 6-TSSOP, SC-88, SOT-363 |
Stock2,496 |
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NXP |
FET RF 68V 960MHZ TO-270-2
- Transistor Type: LDMOS
- Frequency: 960MHz
- Gain: 18dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 125mA
- Power - Output: 10W
- Voltage - Rated: 68V
- Package / Case: TO-270-2
- Supplier Device Package: TO-270-2
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Package: TO-270-2 |
Stock5,328 |
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NXP |
TRANS PREBIAS PNP 500MW TO92-3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 10k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock5,024 |
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NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 3.6V
- Tolerance: ±5%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 90 Ohms
- Current - Reverse Leakage @ Vr: 5µA @ 1V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock4,672 |
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NXP |
IC REG LINEAR 2.3V 200MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.3V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.1V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock7,376 |
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NXP |
IC 18BIT UNVRSL BUS TXRX 56TSSOP
- Logic Type: Universal Bus Transceiver
- Number of Circuits: 18-Bit
- Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock6,672 |
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NXP |
IC 16BIT D TYPE LATCH 48TSSOP
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 2
- Delay Time - Propagation: 2ns
- Current - Output High, Low: 32mA, 64mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock2,256 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 48TSSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock4,240 |
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NXP |
IC SYSTEM BASIS W/CAN 20-HSOP
- Applications: Automotive
- Interface: CAN
- Voltage - Supply: 5 V ~ 18 V
- Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 20-HSOP
- Mounting Type: Surface Mount
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Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock17,160 |
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NXP |
IC MPU M683XX 20MHZ 100LQFP
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Speed: 20MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock2,848 |
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NXP |
IC MPU SOC 32BIT 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,080 |
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NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock6,396 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock5,376 |
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NXP |
IC MCU 8BIT 96KB FLASH 64QFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock2,960 |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 70
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 37x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,928 |
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NXP |
IC MCU 8BIT 16KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock71,676 |
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NXP |
IC PLL/IDCS CLK GENERATOR 48LQFP
- Type: Clock Generator, Fanout Distribution, Zero Delay Buffer
- PLL: Yes with Bypass
- Input: LVCMOS
- Output: LVCMOS
- Number of Circuits: 1
- Ratio - Input:Output: 2:12
- Differential - Input:Output: No/No
- Frequency - Max: 200MHz
- Divider/Multiplier: Yes/Yes
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,960 |
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NXP |
IC CLK BUFFER 2:9 350MHZ 32LQFP
- Type: Fanout Buffer (Distribution), Multiplexer
- Number of Circuits: 1
- Ratio - Input:Output: 2:9
- Differential - Input:Output: No/No
- Input: LVCMOS
- Output: LVCMOS
- Frequency - Max: 350MHz
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock5,648 |
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NXP |
QORIQ 64B POWER 24X 1.67GHZ TH
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,816 |
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NXP |
DUAL CORE 6M FLASH 768K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Package: 256-LBGA |
Stock3,200 |
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NXP |
16-BIT MCU S12X CORE 384KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock3,568 |
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NXP |
IC MPU 667MHZ 561-TEPBGA1
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: 561-FBGA
- Supplier Device Package: 561-TEPBGA I (23x23)
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Package: 561-FBGA |
Stock7,824 |
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NXP |
IC MPU QORLQ 2.2GHZ 1517FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 16 Core, 64-Bit
- Speed: 2.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
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Package: - |
Request a Quote |
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NXP |
IC LED DRV CTRL PWM 1.5A 36HVQFN
- Type: DC DC Controller
- Topology: Switched Capacitor (Charge Pump)
- Internal Switch(s): Yes
- Number of Outputs: 12
- Voltage - Supply (Min): 4.5V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: -
- Current - Output / Channel: 1.5A
- Frequency: 200MHz
- Dimming: PWM
- Applications: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 36-VFQFN Exposed Pad
- Supplier Device Package: 36-HVQFN (6x6)
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Package: - |
Request a Quote |
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NXP |
IC PROCESSOR C100 672BGA
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC AMPLIFIER CLASS D 100HLQFP
- Type: Class D
- Output Type: 5-Channel
- Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
- Voltage - Supply: 5.5V ~ 25V
- Features: -
- Mounting Type: Surface Mount
- Operating Temperature: -
- Supplier Device Package: 100-HLQFP (14x14)
- Package / Case: 100-FQFP Exposed Pad
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Package: - |
Request a Quote |
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NXP |
S32K118 ARM CORTEX-M0+, 48 MHZ,
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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