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NXP |
MOSFET N-CH 55V TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 1500pF @ 25V
- Vgs (Max): ±16V
- FET Feature: -
- Power Dissipation (Max): 103W (Tc)
- Rds On (Max) @ Id, Vgs: 24 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock3,088 |
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NXP |
IC TRANS RF LDMOS
- Transistor Type: LDMOS
- Frequency: 1.88GHz
- Gain: 17.6dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.4A
- Power - Output: 50W
- Voltage - Rated: 65V
- Package / Case: OM-780-2L2L
- Supplier Device Package: OM-780-2L2L
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Package: OM-780-2L2L |
Stock48,000 |
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NXP |
IC MOTOR DRIVER PAR 20TSSOP
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: Parallel
- Technology: Power MOSFET
- Step Resolution: -
- Applications: Battery Powered
- Current - Output: 700mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Voltage - Load: 2 V ~ 8.6 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Stock7,696 |
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NXP |
IC D-TYPE POS TRG SNGL 20DIP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 44MHz
- Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 6mA, 6mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 4µA
- Input Capacitance: 3.5pF
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
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Package: 20-DIP (0.300", 7.62mm) |
Stock3,632 |
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NXP |
TXRX 16BIT DUAL 3STATE 48TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock6,576 |
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NXP |
IC AMP AUD 2CHAN 20W 17PDBS
- Type: Class D
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 20W x 2 @ 6 Ohm
- Voltage - Supply: ±7.5 V ~ 30 V
- Features: Short-Circuit and Thermal Protection
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 17-RDBS
- Package / Case: 17-SIP Formed Leads
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Package: 17-SIP Formed Leads |
Stock5,376 |
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NXP |
IC TRANSMISSION LV 16-DIP
- Function: Low Voltage Transmission
- Interface: -
- Number of Circuits: 1
- Voltage - Supply: 3.4V
- Current - Supply: 900µA
- Power (Watts): 666mW
- Operating Temperature: -25°C ~ 75°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock3,952 |
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NXP |
IC MUX/DEMUX TRIPLE 2X1 16SOIC
- Switch Circuit: SPDT
- Multiplexer/Demultiplexer Circuit: 2:1
- Number of Circuits: 3
- On-State Resistance (Max): 120 Ohm
- Channel-to-Channel Matching (ΔRon): 6 Ohm
- Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
- Voltage - Supply, Dual (V±): ±1 V ~ 5 V
- Switch Time (Ton, Toff) (Max): 34ns, 31ns
- -3db Bandwidth: 170MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 100nA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock3,776 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock2,496 |
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NXP |
IC MPU MPC85XX 1.333GHZ 1023BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BFBGA, FCBGA |
Stock3,360 |
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NXP |
IC MPU M680X0 50MHZ 304TBGA
- Core Processor: 68060
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 304-LBGA
- Supplier Device Package: 304-TBGA (31x31)
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Package: 304-LBGA |
Stock5,936 |
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NXP |
IC MPU M683XX 33MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 33MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BGA |
Stock7,008 |
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NXP |
IC SOC 4CORE 1400MHZ 780FCBGA
- Core Processor: PowerPC e5500
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L/4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (5)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: 780-FBGA, FCBGA |
Stock5,856 |
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NXP |
IC MCU 16BIT 32KB FLASH 64LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 42
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock7,888 |
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NXP |
IC MCU 16BIT 256KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,792 |
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NXP |
IC MCU 8BIT 16KB OTP 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: POR
- Number of I/O: 32
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock3,520 |
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NXP |
32 BIT SINGLE CORE 3M FLASH 384
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,848 |
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NXP |
IC MCU 8BIT ROMLESS 68PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 30
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (25x25)
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Package: 68-LCC (J-Lead) |
Stock5,808 |
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NXP |
IC MCU 32BIT 64KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 50
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 14x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock4,432 |
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NXP |
IC MCU 16BIT 64KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 59
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock59,400 |
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NXP |
IC MCU 32BIT 256KB FLASH 144LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 112
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock16,380 |
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NXP |
IC OSC TIMER CTRL 100KHZ 16DIP
- Type: Timer Control
- Count: -
- Frequency: 100kHz
- Voltage - Supply: 0.9 V ~ 6 V
- Current - Supply: 36µA
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
- Mounting Type: Through Hole
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Package: 16-DIP (0.300", 7.62mm) |
Stock2,080 |
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NXP |
IC ONE-CHIP RADIO 64HTQFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM
- Applications: AM/FM Radio Receiver
- Current - Receiving: -
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-HTQFP (10x10)
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Package: 64-TQFP Exposed Pad |
Stock7,002 |
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NXP |
POWER MANAGEMENT IC: 3 BUCK REGS
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Package: 40-VFQFN Exposed Pad |
Stock7,088 |
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NXP |
HIGH-SIDE SWITCH 12V TRIPLE 7M
- Switch Type: -
- Number of Outputs: -
- Ratio - Input:Output: -
- Output Configuration: -
- Output Type: -
- Interface: -
- Voltage - Load: -
- Voltage - Supply (Vcc/Vdd): -
- Current - Output (Max): -
- Rds On (Typ): -
- Input Type: -
- Features: -
- Fault Protection: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock16,644 |
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NXP |
QORIQ 1XCPU 64-BIT PWR ARCH 1.
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,944 |
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NXP |
BATTERY CELL CONTROLLER, ADVANCE
- Function: Battery Cell Controller
- Battery Chemistry: Lithium Ion
- Number of Cells: 7 ~ 14
- Fault Protection: Over/Under Voltage
- Interface: SPI
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
IC MPU QORIQ 1.6GHZ 1292FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.6GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (1)
- SATA: SATA 6Gbps (2)
- USB: USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1292-BBGA, FCBGA
- Supplier Device Package: 1292-FCPBGA (37.5x37.5)
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Package: - |
Request a Quote |
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