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NXP |
FET RF 65V 2.17GHZ TO270-2
- Transistor Type: LDMOS
- Frequency: 2.17GHz
- Gain: 17.6dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 132mA
- Power - Output: 1.5W
- Voltage - Rated: 65V
- Package / Case: TO-270AA
- Supplier Device Package: TO-270-2
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Package: TO-270AA |
Stock3,232 |
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NXP |
TRANS NPN 45V 0.1A 6TSOP
- Transistor Type: NPN + Zener
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: -
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
- Power - Max: 300mW
- Frequency - Transition: -
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-74, SOT-457
- Supplier Device Package: 6-TSOP
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Package: SC-74, SOT-457 |
Stock6,032 |
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NXP |
IC LED DRVR RGLTR DIM 50MA 32QFN
- Type: DC DC Regulator
- Topology: Step-Up (Boost)
- Internal Switch(s): Yes
- Number of Outputs: 10
- Voltage - Supply (Min): 7V
- Voltage - Supply (Max): 28V
- Voltage - Output: 8 V ~ 60 V
- Current - Output / Channel: 50mA
- Frequency: -
- Dimming: Analog, PWM
- Applications: Backlight
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN Exposed Pad (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock66,732 |
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NXP |
IC UNIV SHIFT REGISTER 20SOIC
- Logic Type: Universal Shift Register
- Number of Circuits: 8-Bit
- Current - Output High, Low: 6mA, 6mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock5,472 |
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NXP |
IC SHIFT REG 8BIT PI-SO 16DIP
- Logic Type: Shift Register
- Output Type: Complementary
- Number of Elements: 1
- Number of Bits per Element: 8
- Function: Parallel or Serial to Serial
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock17,916 |
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NXP |
IC COMPARATOR MAGNITUDE 20TSSOP
- Type: Identity Comparator
- Number of Bits: 8
- Output: Active Low
- Output Function: A=B
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Output High, Low: 4mA, 4mA
- Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
- Current - Quiescent (Iq): 8µA
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Mounting Type: Surface Mount
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,176 |
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NXP |
IC BUFFER DVR HEX N-INV 16SOIC
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 2, 4 (Hex)
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 15mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,592 |
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NXP |
IC AMP AUDIO BTL DBSMS27P
- Type: Class AB
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Short-Circuit and Thermal Protection
- Mounting Type: Surface Mount
- Operating Temperature: -
- Supplier Device Package: 27-DBSMS
- Package / Case: 27-DBSMS
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Package: 27-DBSMS |
Stock4,240 |
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NXP |
IC ON/OFF LOGIC 24SOIC
- Applications: Automotive Audio
- Interface: I2C
- Voltage - Supply: 4.5 V ~ 5.5 V
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
- Mounting Type: Surface Mount
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock7,296 |
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NXP |
IC CAN TRANSEIVER HS 8SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 120mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock23,916 |
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NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Security Features: -
- Package / Case: 561-FBGA
- Supplier Device Package: 561-TEPBGA1 (23x23)
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Package: 561-FBGA |
Stock4,576 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,112 |
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NXP |
IC SOC 64BIT 16X 1.5GHZ 1932BGA
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 8 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (13), 10 Gbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FCPBGA (45x45)
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Package: 1932-BBGA, FCBGA |
Stock5,232 |
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NXP |
IC MPU MPC83XX 400MHZ 668BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 668-BBGA Exposed Pad
- Supplier Device Package: 668-PBGA-PGE (29x29)
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Package: 668-BBGA Exposed Pad |
Stock7,088 |
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NXP |
IC MPU I.MX6S 800MHZ 624MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Package: 624-LFBGA |
Stock6,400 |
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NXP |
IC MPU I.MXL 200MHZ 225MAPBGA
- Core Processor: ARM920T
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: -
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 3.0V
- Operating Temperature: -30°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 225-LFBGA
- Supplier Device Package: 225-MAPBGA (13x13)
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Package: 225-LFBGA |
Stock8,568 |
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NXP |
IC MCU 8BIT 48KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 21
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1.5K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,248 |
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NXP |
IC MCU 32BIT ROMLESS 132QFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 16MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: -
- Number of I/O: 47
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 8x8/10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 132-BQFP Bumpered
- Supplier Device Package: 132-PQFP (24.13x24.13)
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Package: 132-BQFP Bumpered |
Stock15,840 |
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NXP |
IC MCU 32BIT 1MB FLASH 100TFBGA
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
- Number of I/O: 49
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 136K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 4x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-TFBGA
- Supplier Device Package: -
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Package: 100-TFBGA |
Stock2,368 |
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NXP |
IC MCU 16BIT 16KB FLASH 48LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: LIN, SCI, SPI
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 15
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock6,960 |
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NXP |
IC MCU 32BIT 64KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 20x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,960 |
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NXP |
IC MCU 32BIT 256KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 57
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 35x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,744 |
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NXP |
IC DSP 300/400MHZ 431FCBGA
- Type: SC140 Core
- Interface: Ethernet, I2C, TDM, UART
- Clock Rate: 400MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.10V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock6,272 |
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NXP |
DSP 16BIT QUAD 500MHZ 431FCBGA
- Type: SC140 Core
- Interface: DSI, Ethernet, RS-232
- Clock Rate: 500MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.20V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock4,128 |
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NXP |
2.5 MHZ 300 MA STEP-UP DC-DC CVR
- Function: Step-Up
- Output Configuration: Positive
- Topology: Boost
- Output Type: Fixed
- Number of Outputs: 1
- Voltage - Input (Min): 2.5V
- Voltage - Input (Max): 5.25V
- Voltage - Output (Min/Fixed): 5.4V
- Voltage - Output (Max): 5.56V
- Current - Output: 300mA
- Frequency - Switching: 3MHz
- Synchronous Rectifier: Yes
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 9-UFBGA
- Supplier Device Package: 9-WLCSP (1.24x1.24)
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Package: 9-UFBGA |
Stock3,072 |
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NXP |
QORIQ 64B POWER ARCH 8X 1.67GH
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,808 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b, 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,088 |
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NXP |
IC TXRX HS-CAN HALF 1/1 8HVSON
- Type: -
- Protocol: -
- Number of Drivers/Receivers: -
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-HVSON (3x3)
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Package: - |
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