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NXP |
FET RF 2CH 110V 130MHZ NI-1230S
- Transistor Type: LDMOS (Dual)
- Frequency: 130MHz
- Gain: 26dB
- Voltage - Test: 50V
- Current Rating: -
- Noise Figure: -
- Current - Test: 150mA
- Power - Output: 1000W
- Voltage - Rated: 110V
- Package / Case: NI-1230S-4 GW
- Supplier Device Package: NI-1230S-4 GullWing
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Package: NI-1230S-4 GW |
Stock5,696 |
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NXP |
TRANS PNP 50V 3A TO92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 3A
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 300mV @ 200mA, 2A
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 2A, 2V
- Power - Max: 830mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock3,008 |
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NXP |
IC REG LINEAR 2.2V 200MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.2V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.1V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock6,304 |
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NXP |
IC SYSTEM BASIS CHIP CAN 28-SOIC
- Applications: Automotive
- Current - Supply: 42mA
- Voltage - Supply: 5.5 V ~ 18 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock104,940 |
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NXP |
IC LED DRIVER DIMMABLE 8HSO
- Type: AC DC Offline Switcher
- Topology: Step-Down (Buck), Step-Up (Boost)
- Internal Switch(s): No
- Number of Outputs: 1
- Voltage - Supply (Min): 9.9V
- Voltage - Supply (Max): 16V
- Voltage - Output: -
- Current - Output / Channel: -
- Frequency: -
- Dimming: Triac
- Applications: Lighting
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,032 |
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NXP |
IC SMPS CTLR W/PWR SWITCH 7-SOIC
- Output Isolation: -
- Internal Switch(s): Yes
- Voltage - Breakdown: 700V
- Topology: Flyback
- Voltage - Start Up: 17V
- Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V
- Duty Cycle: 75%
- Frequency - Switching: 22.5kHz ~ 50.5kHz
- Power (Watts): 5W
- Fault Protection: Over Temperature, Over Voltage, Short Circuit
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
- Supplier Device Package: 7-SO
- Mounting Type: Surface Mount
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Package: 8-SOIC (0.154", 3.90mm Width) 7 leads |
Stock6,144 |
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NXP |
IC D-TYPE POS TRG SNGL 24SOIC
- Function: Master Reset
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 9
- Clock Frequency: 200MHz
- Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 250µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock5,888 |
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NXP |
IC BUFF DVR TRI-ST 32BIT 96LFBGA
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 8
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock3,440 |
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NXP |
IC TRANSCEIVER 3ST 8BIT 20SSOP
- Logic Type: Transceiver, Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 6mA, 6mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock2,304 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 784-BBGA, FCBGA |
Stock2,624 |
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NXP |
IC MPU M683XX 25MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock6,864 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock7,264 |
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NXP |
IC MCU 16BIT 256KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b, 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock7,792 |
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NXP |
IC MCU 8BIT ROMLESS 44QFP
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 26
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 192 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-QFP
- Supplier Device Package: 44-QFP (10x10)
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Package: 44-QFP |
Stock5,360 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock21,120 |
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NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
- Core Processor: ARM? Cortex?-A5 + Cortex?-M4
- Core Size: 32-Bit Dual-Core
- Speed: 400MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
- Peripherals: LCD, SAI
- Number of I/O: 136
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1MB
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,928 |
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NXP |
IC CLOCK BUFFER 1:10 32-LQFP
- Type: Fanout Distribution, Multiplexer, Zero Delay Buffer
- PLL: Yes with Bypass
- Input: LVCMOS
- Output: LVCMOS
- Number of Circuits: 1
- Ratio - Input:Output: 1:10
- Differential - Input:Output: No/No
- Frequency - Max: 200MHz
- Divider/Multiplier: Yes/No
- Voltage - Supply: 3.135 V ~ 3.465 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock7,664 |
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NXP |
TVS DIODE 5VWM 18VC SOD882
- Type: Zener
- Unidirectional Channels: 1
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 5V (Max)
- Voltage - Breakdown (Min): 6.2V
- Voltage - Clamping (Max) @ Ipp: 18V
- Current - Peak Pulse (10/1000µs): 10A (8/20µs)
- Power - Peak Pulse: 150W
- Power Line Protection: No
- Applications: Automotive
- Capacitance @ Frequency: 68pF @ 1MHz
- Operating Temperature: -55°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: SOD-882
- Supplier Device Package: DFN1006-2
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Package: SOD-882 |
Stock3,492 |
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NXP |
SENSOR LINEAR ANALOG 8SO
- Type: Linear
- Technology: Magnetoresistive
- Axis: X, Y
- Output Type: Analog Voltage
- Sensing Range: -
- Voltage - Supply: 5 V ~ 9 V
- Current - Supply (Max): -
- Current - Output (Max): -
- Resolution: -
- Bandwidth: -
- Operating Temperature: -40°C ~ 150°C (TA)
- Features: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,806 |
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NXP |
IC MXR/OSC AND SYNTH 38-TSSOP
- Function: Mixer
- Frequency: -
- RF Type: -
- Secondary Attributes: -
- Package / Case: 38-TFSOP (0.173", 4.40mm Width)
- Supplier Device Package: 38-TSSOP
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Package: 38-TFSOP (0.173", 4.40mm Width) |
Stock7,362 |
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NXP |
MAGNIV 16-BIT MCU S12 CORE 32K
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 2x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,536 |
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NXP |
TEA8919AAT
- Applications: -
- Voltage - Input: -
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit Single-Core
- Speed: 180MHz
- Connectivity: I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 64
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 200K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 12x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: - |
Request a Quote |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC TRANSCEIVER HALF 1/1 8HVSON
- Type: Transceiver
- Protocol: CANbus
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 50 mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-HVSON (3x3)
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Package: - |
Stock35,937 |
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NXP |
SAF7772EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
S32K142 32-BIT MCU, ARM CORTEX-M
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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