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NXP |
FET RF 68V 2.16GHZ TO272-4
- Transistor Type: LDMOS
- Frequency: 2.11GHz ~ 2.16GHz
- Gain: 14.5dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.05A
- Power - Output: 23W
- Voltage - Rated: 68V
- Package / Case: TO-272-4
- Supplier Device Package: TO-272 WB-4
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Package: TO-272-4 |
Stock4,720 |
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NXP |
TRANS PNP 45V 0.5A TO-92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
- Power - Max: 625mW
- Frequency - Transition: 80MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock4,080 |
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NXP |
IC PWR MGMT I.MX6 56QFN
- Applications: Converter, i.MX6
- Voltage - Input: 2.8 V ~ 4.5 V
- Number of Outputs: 12
- Voltage - Output: Multiple
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock6,480 |
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NXP |
IC SW HIGH SIDE 24V DUAL 23PQFN
- Switch Type: General Purpose
- Number of Outputs: 2
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 8 V ~ 36 V
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Current - Output (Max): 6A
- Rds On (Typ): 10 mOhm (Max)
- Input Type: -
- Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 23-PowerQFN
- Supplier Device Package: 23-PQFN (12x12)
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Package: 23-PowerQFN |
Stock5,232 |
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NXP |
IC OR CTRLR N+1 D2PAK
- Type: N+1 ORing Controller
- FET Type: N-Channel
- Ratio - Input:Output: N:1
- Internal Switch(s): Yes
- Delay Time - ON: 7µs
- Delay Time - OFF: 200ns
- Current - Output (Max): 75A
- Current - Supply: 3mA
- Voltage - Supply: 5 V ~ 20 V
- Applications: CompactPCI? High Reliability Power Supply Networks
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
- Supplier Device Package: D2PAK
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Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB |
Stock4,896 |
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NXP |
IC SGL CELL BATTERY CHRGR 8-UDFN
- Battery Chemistry: Lithium-Ion/Polymer
- Number of Cells: 1
- Current - Charging: Constant - Programmable
- Programmable Features: -
- Fault Protection: Over Voltage
- Charge Current - Max: 1.2A
- Battery Pack Voltage: 4.2V
- Voltage - Supply (Max): 6.6V
- Interface: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-UFDFN Exposed Pad
- Supplier Device Package: 8-UDFN-EP (2x3)
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Package: 8-UFDFN Exposed Pad |
Stock7,968 |
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NXP |
IC CTRLR SMPS DCM/QR 8SOIC
- Output Isolation: Isolated
- Internal Switch(s): No
- Voltage - Breakdown: -
- Topology: Flyback
- Voltage - Start Up: 14.9V
- Voltage - Supply (Vcc/Vdd): 9.9 V ~ 30 V
- Duty Cycle: -
- Frequency - Switching: 25kHz ~ 132.5kHz
- Power (Watts): 75W
- Fault Protection: Over Power, Over Temperature, Over Voltage
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
- Mounting Type: Surface Mount
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock48,696 |
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NXP |
IC REGISTER BUS 8STAGE 16-DIP
- Logic Type: Shift Register
- Output Type: Tri-State
- Number of Elements: 1
- Number of Bits per Element: 8
- Function: Serial to Parallel, Serial
- Voltage - Supply: 3 V ~ 15 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock2,864 |
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NXP |
IC HEX SCHMITT-TRIG INV 14SOIC
- Logic Type: Inverter
- Number of Circuits: 6
- Number of Inputs: 6
- Features: Schmitt Trigger
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 4mA, 4mA
- Logic Level - Low: 0.5 V ~ 0.6 V
- Logic Level - High: 1.9 V ~ 2.1 V
- Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,208 |
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NXP |
IC COUNTER 12STAGE BINARY 16DIP
- Logic Type: Binary Counter
- Direction: Up
- Number of Elements: 1
- Number of Bits per Element: 12
- Reset: Asynchronous
- Timing: -
- Count Rate: 98MHz
- Trigger Type: Negative Edge
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock7,744 |
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NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock4,464 |
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NXP |
IC MPU MPC83XX 266MHZ 516BGA
- Core Processor: PowerPC e300c2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock6,512 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock6,576 |
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NXP |
IC MPU MPC82XX 450MHZ 408TBGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 450MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock3,872 |
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NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Security; SEC 4.4
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
- Package / Case: 425-FBGA
- Supplier Device Package: 425-TEPBGA I (19x19)
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Package: 425-FBGA |
Stock6,512 |
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NXP |
IC MCU 32BIT ROMLESS 160QFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 20MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 7.5K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 160-BQFP
- Supplier Device Package: 160-QFP (28x28)
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Package: 160-BQFP |
Stock4,832 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 16DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock6,192 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,184 |
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NXP |
IC MCU 16BIT 64KB FLASH 80QFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,728 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock32,748 |
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NXP |
IC MCU 32BIT 512KB FLASH 144LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 72MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 104
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 98K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock9,612 |
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NXP |
IC ADC 10BIT 18MSPS 48-LQFP
- Type: CCD (Charged Coupled Device)
- Number of Channels: -
- Resolution (Bits): 10 b
- Sampling Rate (Per Second): 18M
- Data Interface: Serial
- Voltage Supply Source: Analog and Digital
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -20°C ~ 75°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock5,888 |
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NXP |
IC SENSOR MULTICHIP XZAXIS 24QFN
- Sensor Type: -
- Output Type: -
- Operating Temperature: -
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Package: - |
Stock8,028 |
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NXP |
IC MIXR 150MHZ RSSI EQUIP 20SSOP
- RF Type: Cellular, ASK, FSK
- Frequency: 150MHz
- Number of Mixers: 2
- Gain: 17dB
- Noise Figure: 6.8dB
- Secondary Attributes: RSSI Equipped
- Current - Supply: 3.5mA
- Voltage - Supply: 2.7 V ~ 7 V
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock12,564 |
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NXP |
32-BIT DSC 56800EX CORE 128KB
- Core Processor: 56800EX
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 68
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 16x12b, 10x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-FQFP (12x12)
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Package: 80-LQFP |
Stock2,240 |
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NXP |
IC MPU QORIQ 800MHZ 448FBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 1 Core, 64-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 1Gbps (1), 2.5Gbps (5)
- SATA: SATA 6Gbps (1)
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 448-BFBGA
- Supplier Device Package: 448-FBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
IC AMP CATV PWR DOUBLER SOT115J
- Applications: -
- Output Type: -
- Number of Circuits: -
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: -
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 16KB FLASH 16WLCSP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 15MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 13
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-UFBGA, WLCSP
- Supplier Device Package: 16-WLCSP (1.84x1.84)
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Package: - |
Request a Quote |
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