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NXP |
IC OPAMP GP 2.5MHZ RRO 14DIP
- Amplifier Type: General Purpose
- Number of Circuits: 4
- Output Type: Rail-to-Rail
- Slew Rate: 0.8 V/µs
- Gain Bandwidth Product: -
- -3db Bandwidth: 2.5MHz
- Current - Input Bias: 90nA
- Voltage - Input Offset: 200µV
- Current - Supply: 2.8mA
- Current - Output / Channel: 12mA
- Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-DIP
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Package: 14-DIP (0.300", 7.62mm) |
Stock7,328 |
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NXP |
IC REDRIVER USB 3.0 2CH 32HVQFN
- Type: Buffer, ReDriver
- Applications: USB 3.0
- Input: -
- Output: -
- Data Rate (Max): -
- Number of Channels: 2
- Delay Time: 0.4ns
- Signal Conditioning: Input Equalization, Output De-Emphasis
- Capacitance - Input: -
- Voltage - Supply: 3 V ~ 3.6 V
- Current - Supply: 225mA
- Operating Temperature: 0°C ~ 85°C
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN
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Package: 32-VFQFN Exposed Pad |
Stock3,568 |
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NXP |
IC REDRIVER I2C 3CH 16TSSOP
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 3
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 7pF
- Voltage - Supply: 0.8 V ~ 5.5 V
- Current - Supply: 16µA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock7,936 |
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NXP |
IC I/O EXPANDER I2C 8B 16HVQFN
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 1mA, 3mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.1 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-HVQFN (3x3)
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Package: 16-VFQFN Exposed Pad |
Stock44,064 |
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NXP |
IC TRANSCEIVER CAN 8SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 70mV
- Data Rate: -
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,960 |
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NXP |
IC MPU MPC83XX 333MHZ 369BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 369-LFBGA
- Supplier Device Package: 369-PBGA (19x19)
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Package: 369-LFBGA |
Stock4,304 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock5,952 |
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NXP |
IC MPU MPC83XX 333MHZ 620BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock3,568 |
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NXP |
IC MPU MPC83XX 400MHZ 620BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Security; SEC 3.3
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock3,328 |
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NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
- Core Processor: ARM? Cortex?-A5
- Core Size: 32-Bit Single-Core
- Speed: 400MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
- Peripherals: LCD, SAI
- Number of I/O: 136
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1.5MB
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-MAPBGA (17x17)
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Package: 364-LFBGA |
Stock2,288 |
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NXP |
IC MCU 32BIT 256KB FLASH 256BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 142
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPBGA
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Package: 256-LBGA |
Stock2,464 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 132MHz
- Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 238
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock4,400 |
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NXP |
IC MCU 8BIT ROMLESS 44LQFP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: POR
- Number of I/O: 32
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock5,328 |
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NXP |
IC MCU 8BIT 8KB FLASH 28DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI
- Peripherals: LVD, POR, PWM
- Number of I/O: 12
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-DIP (0.600", 15.24mm)
- Supplier Device Package: 28-PDIP
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Package: 28-DIP (0.600", 15.24mm) |
Stock5,760 |
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NXP |
IC MCU 8BIT 8KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock2,400 |
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NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
- Applications: Automotive
- Core Processor: S12
- Program Memory Type: FLASH (48 kB)
- Controller Series: HCS12
- RAM Size: 2K x 8
- Interface: LIN, SCI
- Number of I/O: 9
- Voltage - Supply: 2.25 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,600 |
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NXP |
IC MAGNETIC FIELD SENSOR 8SOIC
- For Measuring: Angle
- Technology: Magnetoresistive
- Rotation Angle - Electrical, Mechanical: 0° ~ 45°
- Linear Range: -
- Output: Wheatstone Bridge
- Output Signal: -
- Actuator Type: External Magnet Not Included
- Linearity: -
- Resistance: 3.7 kOhms
- Resistance Tolerance: -
- Voltage - Supply: 5V
- Mounting Type: Surface Mount
- Termination Style: SMD (SMT) Tab
- Operating Temperature: -40°C ~ 150°C
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Package: - |
Stock25,026 |
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NXP |
TRANSPONDER RFIC HITAG S UNCASED
- Type: RFID Transponder
- Frequency: 100kHz ~ 150kHz
- Standards: -
- Interface: -
- Voltage - Supply: 3.5V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock6,174 |
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NXP |
IC TRANSPONDER RFID HITAG
- Type: RFID Transponder
- Frequency: 100kHz ~ 150kHz
- Standards: ISO 11784, ISO 11785
- Interface: -
- Voltage - Supply: 4 V ~ 6 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Die
- Supplier Device Package: Wafer
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Package: Die |
Stock4,266 |
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NXP |
IC PWR AMP RF 900MHZ TO-270-16
- Frequency: 728MHz ~ 768MHz, 920MHz ~ 960MHz
- P1dB: 44.9dBm (31W)
- Gain: 36.8dB
- Noise Figure: -
- RF Type: W-CDMA
- Voltage - Supply: 32V
- Current - Supply: 340mA
- Test Frequency: 940MHz
- Package / Case: TO-270-16 Variant, Flat Leads
- Supplier Device Package: TO-270 WBL-16
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Package: TO-270-16 Variant, Flat Leads |
Stock34,212 |
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NXP |
LS2048A ST WE 1800 R1.1
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,512 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 28K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock3,328 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 64
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 10x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,848 |
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NXP |
IC MEDIA PROCESSOR
- Applications: Multimedia
- Core Processor: TriMedia™
- Program Memory Type: -
- Controller Series: Nexperia
- RAM Size: -
- Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
- Number of I/O: 8
- Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 456-BGA
- Supplier Device Package: 456-PBGA (27x27)
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Package: 456-BGA |
Stock7,200 |
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NXP |
IC MCU 8-BIT 5V TSI 44-LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: LINbus, SCI, UART/USART
- Peripherals: LVD, POR, PWM
- Number of I/O: 42
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock6,036 |
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NXP |
IC MCU 32BIT 256KB FLASH 48LQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit Single-Core
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 43
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 23x12b SAR; D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: - |
Stock750 |
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NXP |
SAF7770EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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