NXP Products

FET RF 100V 1.03GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.03GHz
• Gain: 20.3dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 275W
• Voltage - Rated: 100V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

TRANSISTOR NPN SOT343F

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 5.5V
• Frequency - Transition: 21GHz
• Noise Figure (dB Typ @ f): 0.6dB ~ 1.2dB @ 1.5GHz ~ 5.8GHz
• Gain: 12dB ~ 21dB
• Power - Max: 225mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 10mA, 2V
• Current - Collector (Ic) (Max): 60mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343F
• Supplier Device Package: 4-DFP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

IC REG DRIVER 14BIT 48TSSOP

• Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
• Supply Voltage: 2.3 V ~ 2.7 V
• Number of Bits: 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

IC FLIP FLOP OCT D POS 14SOIC

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 250MHz
• Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 10µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

IC UART DUAL W/FIFO 44QFP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Supplier Device Package: 44-PQFP (10x10)

IC TXRX CAN 14SO

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

IC CAN/LIN I/O SLAVE 16SOIC

• Protocol: LIN
• Function: I/O Slave
• Interface: LIN
• Standards: LIN 2.0
• Voltage - Supply: 6.5 V ~ 27 V
• Current - Supply: 45µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

IC VGA SWITCH 32HWQFN

• Applications: Video
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 2
• On-State Resistance (Max): 4 Ohm (Typ)
• Voltage - Supply, Single (V+): 2 V ~ 5.5 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 600MHz
• Features: Buffers, RGB
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 32-WFQFN Exposed Pad
• Supplier Device Package: 32-HWQFN (3x6)

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

IC MPU MPC83XX 667MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

IC MPU SOC 32BIT 1.5GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

IC MPU MPC83XX 133MHZ 369BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 369-LFBGA
• Supplier Device Package: 369-PBGA (19x19)

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

IC MCU 8BIT ROMLESS 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

IC MCU 32BIT 64KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

IC MCU 8BIT 8KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 5
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC CLK BUFFER 1:5 3GHZ 32LQFP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 2
• Ratio - Input:Output: 1:5
• Differential - Input:Output: Yes/Yes
• Input: ECL, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

IC U-CODE G2XL UNCASED WAFER

• Type: RFID Transponder
• Frequency: 840MHz ~ 960MHz
• Standards: ISO 15693, ISO 18000-6
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Die

KIT EVAL 1322X BEESTACK/IAR 256K

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC1322x
• Supplied Contents: 8 Boards

QORIQ QONVERGE SOC 800MHZ STARC

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

16-BIT MCU S12 CORE 32KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

NEVIS3A_WCT,100LQFP

• Applications: Wireless Power Transmitter
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

I.MX 8QUADXPLUS 17X17

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
• Number of Cores/Bus Width: 3 Core, 64-Bit
• Speed: 1.2GHz, 264MHz
• Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: 10/100/1000Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -
• Security Features: -
• Package / Case: 417-BFBGA
• Supplier Device Package: 417-FBGA (17x17)

IC LED DRVR PS I2C 25MA 10TSSOP

• Type: Power Switch
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 4
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 5.5V
• Current - Output / Channel: 25mA
• Frequency: 100kHz ~ 1MHz
• Dimming: I2C
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

NXP 32-BIT MCU, POWER ARCH CORE,

• Core Processor: e200z7
• Core Size: 32-Bit Dual-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: 32
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
• Data Converters: A/D 64x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 516-BBGA
• Supplier Device Package: 516-PBGA (27x27)

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)