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NXP |
FET RF 15V 3.55GHZ 1.5-PLD
- Transistor Type: pHEMT FET
- Frequency: 3.55GHz
- Gain: 11.5dB
- Voltage - Test: 12V
- Current Rating: -
- Noise Figure: -
- Current - Test: 55mA
- Power - Output: 3W
- Voltage - Rated: 15V
- Package / Case: PLD-1.5
- Supplier Device Package: PLD-1.5
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Package: PLD-1.5 |
Stock4,592 |
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NXP |
TRANS PNP 50V 0.15A SC-75
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 150mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 270 @ 1mA, 6V
- Power - Max: 150mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-75, SOT-416
- Supplier Device Package: SC-75
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Package: SC-75, SOT-416 |
Stock4,976 |
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NXP |
DIODE ZENER 4.7V 400MW SOD2
- Voltage - Zener (Nom) (Vz): 4.7V
- Tolerance: ±2%
- Power - Max: 400mW
- Impedance (Max) (Zzt): 80 Ohms
- Current - Reverse Leakage @ Vr: 3µA @ 2V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: SOD-110
- Supplier Device Package: SOD110
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Package: SOD-110 |
Stock5,792 |
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NXP |
IC LED DRIVER OFFLINE DIM 8SO
- Type: AC DC Offline Switcher
- Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
- Internal Switch(s): No
- Number of Outputs: 1
- Voltage - Supply (Min): 8.8V
- Voltage - Supply (Max): 32V
- Voltage - Output: -
- Current - Output / Channel: -
- Frequency: -
- Dimming: Analog
- Applications: Lighting
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,948 |
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NXP |
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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Package: 432-TFBGA |
Stock6,112 |
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NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock7,504 |
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NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
- Core Processor: PowerPC e300c4s
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock3,968 |
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NXP |
IC MPU 266MHZ 840FCCBGA
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: -
- Package / Case: 840-BCBGA Exposed Pad, FCCBGA
- Supplier Device Package: 840-FCCBGA (31x31)
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Package: 840-BCBGA Exposed Pad, FCCBGA |
Stock7,440 |
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NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,400 |
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NXP |
IC MPU MPC83XX 266MHZ 516BGA
- Core Processor: PowerPC e300c2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock6,544 |
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NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock3,872 |
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NXP |
IC MPU M683XX 33MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 33MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock8,712 |
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NXP |
IC MCU 8BIT 8KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: CAN, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 21
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock6,560 |
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NXP |
IC MCU 16BIT 32KB FLASH 80QFP
- Core Processor: CPU12
- Core Size: 16-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 63
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 768 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock3,984 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock6,752 |
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NXP |
IC MCU 32BIT 128KB FLASH 80LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 20x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock5,920 |
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NXP |
IC MCU 8BIT 8KB FLASH 20SOIC
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 17
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock8,184 |
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NXP |
IC MCU 32BIT 32KB FLASH 25WLCSP
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 21
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 25-UFBGA, WLCSP
- Supplier Device Package: -
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Package: 25-UFBGA, WLCSP |
Stock4,768 |
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NXP |
IC MCU 32BIT 1.5MB FLASH 144LQFP
- Core Processor: e200z3
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, LIN, SCI, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 80
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 94K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 32x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,912 |
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NXP |
TVS DIODE 6.8VWM SOT353
- Type: Zener
- Unidirectional Channels: 4
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 6.8V
- Voltage - Breakdown (Min): -
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: 24W
- Power Line Protection: No
- Applications: General Purpose
- Capacitance @ Frequency: 180pF @ 1MHz
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Supplier Device Package: 5-TSSOP
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Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock8,370 |
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NXP |
ACCELEROMETER 10BIT SPI 16QFN
- Type: Digital
- Axis: X, Y
- Acceleration Range: ±60g
- Sensitivity (LSB/g): 8.192
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: SPI
- Voltage - Supply: 3.135 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN Exposed Pad |
Stock6,354 |
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NXP |
IC INTEGRATED CAR RADIO 80-QFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: 102mA
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 8 V ~ 9 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 80-BQFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-BQFP |
Stock4,986 |
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NXP |
KIT DESIGN-IN N5125S01
- Type: -
- Frequency: -
- For Use With/Related Products: -
- Supplied Contents: -
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Package: - |
Stock5,616 |
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NXP |
MI-RADIO TRANSCEIVER WITH FLASH
- Logic Type: -
- Number of Elements: -
- Number of Bits per Element: -
- Input Type: -
- Output Type: -
- Current - Output High, Low: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC DSC 128KB/20KB LQFP64
- Type: -
- Interface: I2C, SCI, SPI
- Clock Rate: 100MHz
- Non-Volatile Memory: FLASH (128kB)
- On-Chip RAM: 20kB
- Voltage - I/O: 3.30V
- Voltage - Core: 2.7V, 3.6V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Stock480 |
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NXP |
S12Z CPU, 96K FLASH
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
- Data Converters: A/D 6x10b, 6x12b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 80QFP
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SAF7770EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Package: - |
Request a Quote |
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