Page 582 - NXP Products | Heisener Electronics

BC369,112
NXP

TRANS PNP 20V 1A TO-92

Package: TO-226-3, TO-92-3 (TO-226AA)

Stock5,088
BAP51-04W,115
NXP

DIODE PIN GP 50V 50MA SOT323

Package: SC-70, SOT-323

Stock4,240
N74F153D,623
NXP

IC MULTIPLEXER DUAL 4IN 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock3,648
74HCT2G126DC,125
NXP

IC BUFF DVR TRI-ST DL 8VSSOP

Package: 8-VFSOP (0.091", 2.30mm Width)

Stock5,040
SC16C850IBS/Q900,5
NXP

IC UART SGL UNIV ASYNC 32HVQFN

Package: 32-VFQFN Exposed Pad

Stock3,840
MC33978AEK
NXP

IC INTERFACE SW DETECT 32-SOIC

Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock15,096
PCA9516AD,112
NXP

IC REDRIVER I2C 5CH 400KHZ 16SO

Package: 16-SOIC (0.154", 3.90mm Width)

Stock18,504
SC18IS600IBS,151
NXP

IC SPI TO I2C BUS 24-HVQFN

Package: 24-VFQFN Exposed Pad

Stock18,102
MPC563CVR40
NXP

IC MCU 32BIT 512KB FLASH 388BGA

Package: 388-BBGA

Stock2,672
MC9S08PT60AVLF
NXP

IC MCU 8BIT 60KB FLASH 48LQFP

Package: 48-LQFP

Stock3,856
MC9S08AW32CFGER
NXP

IC MCU 8BIT 32KB FLASH 44LQFP

Package: 44-LQFP

Stock4,736
LPC1102UK,118
NXP

IC MCU 32BIT 32KB FLASH 16WLCSP

Package: 16-UFBGA, WLCSP

Stock6,912
ADC1004S040TS/C1:1
NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

Package: 28-SSOP (0.209", 5.30mm Width)

Stock5,520
BZA868AL,115
NXP

TVS DIODE 6.8VWM 5TSSOP

Package: 5-TSSOP, SC-70-5, SOT-353

Stock3,472
MPXHZ6116A6T1
NXP

IC SENSOR IPS ABSOLUTE 8SSOP

Package: 8-SOIC (0.295", 7.50mm Width)

Stock8,874
MMA1211EG
NXP

ACCELEROMETER 169G ANALOG 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock3,456
MPXV8500DK016T1
NXP

IC PRESSURE SENSOR

Package: 32-QFN Exposed Pad

Stock6,354
MCIMX6U1AVM08AD
NXP

I.MX6 DL ROM PERF ENHAN

Package: 624-LFBGA

Stock6,384
SPC5673FK0MVY2R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock4,560
SP5745BBK1AMMH2R
NXP

32 BIT SINGLE CORE 2M FLASH 1

Package: 100-LBGA

Stock4,432

Part Number	Manufacturer	Description	Package	Stock
BC369,112	NXP	TRANS PNP 20V 1A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V Power - Max: 830mW Frequency - Transition: 140MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA)	Stock5,088
BAP51-04W,115	NXP	DIODE PIN GP 50V 50MA SOT323 Diode Type: PIN - 1 Pair Series Connection Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 240mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	Package: SC-70, SOT-323	Stock4,240
N74F153D,623	NXP	IC MULTIPLEXER DUAL 4IN 16SOIC Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock3,648
74HCT2G126DC,125	NXP	IC BUFF DVR TRI-ST DL 8VSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-VFSOP (0.091", 2.30mm Width) Supplier Device Package: 8-VSSOP, US8	Package: 8-VFSOP (0.091", 2.30mm Width)	Stock5,040
SC16C850IBS/Q900,5	NXP	IC UART SGL UNIV ASYNC 32HVQFN Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 2.5 V ~ 3.3 V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock3,840
MC33978AEK	NXP	IC INTERFACE SW DETECT 32-SOIC Applications: Multiple Switch Detection Interface: SPI Voltage - Supply: 3 V ~ 5.25 V Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock15,096
PCA9516AD,112	NXP	IC REDRIVER I2C 5CH 400KHZ 16SO Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 5 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock18,504
SC18IS600IBS,151	NXP	IC SPI TO I2C BUS 24-HVQFN Protocol: I2C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock18,102
MPC563CVR40	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock2,672
MC9S08PT60AVLF	NXP	IC MCU 8BIT 60KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock3,856
MC9S08AW32CFGER	NXP	IC MCU 8BIT 32KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	Package: 44-LQFP	Stock4,736
LPC1102UK,118	NXP	IC MCU 32BIT 32KB FLASH 16WLCSP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 11 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 5x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-UFBGA, WLCSP Supplier Device Package: -	Package: 16-UFBGA, WLCSP	Stock6,912
ADC1004S040TS/C1:1	NXP	IC ADC 10BIT PAR 40MHZ 28-SSOP Number of Bits: 10 Sampling Rate (Per Second): 40M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: - Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	Package: 28-SSOP (0.209", 5.30mm Width)	Stock5,520
BZA868AL,115	NXP	TVS DIODE 6.8VWM 5TSSOP Type: Zener Unidirectional Channels: 4 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 6.8V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 14W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 180pF @ 1MHz Operating Temperature: - Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	Package: 5-TSSOP, SC-70-5, SOT-353	Stock3,472
MPXHZ6116A6T1	NXP	IC SENSOR IPS ABSOLUTE 8SSOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.399 V ~ 4.645 V Accuracy: ±1.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SSOP	Package: 8-SOIC (0.295", 7.50mm Width)	Stock8,874
MMA1211EG	NXP	ACCELEROMETER 169G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±169g Sensitivity (LSB/g): - Sensitivity (mV/g): 13.33 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock3,456
MPXV8500DK016T1	NXP	IC PRESSURE SENSOR Frequency: 315MHz, 434MHz Applications: TPM (Tire Pressure Monitor) Modulation or Protocol: FSK, OOK Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 8kB Flash, 512B SRAM Features: - Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 32-QFN Exposed Pad	Package: 32-QFN Exposed Pad	Stock6,354
MCIMX6U1AVM08AD	NXP	I.MX6 DL ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock6,384
SPC5673FK0MVY2R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,560
SP5745BBK1AMMH2R	NXP	32 BIT SINGLE CORE 2M FLASH 1 Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	Package: 100-LBGA	Stock4,432
MC56F8023VLCR	NXP	16-BIT DSC 56800E CORE 32KB FL Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (16K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock6,944
S9S08DV96F2CLFR	NXP	8-BIT MCU S08 CORE 96KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock2,928
MC9S08SE4MWL	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Number of I/O: 24 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	Package: 28-SOIC (0.295", 7.50mm Width)	Stock6,096
K32L3A60VPJ1AT	NXP	IC MCU 32B 1.25MB FLASH 176VFBGA Core Processor: ARM® Cortex®-M4/M0+ Core Size: 32-Bit Dual-Core Speed: 72MHz Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH EEPROM Size: 48K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-VFBGA Supplier Device Package: 176-VFBGA (9x9)	Package: -	Request a Quote
MC33FS8510A3ESR2	NXP	SYSTEM BASIS CHIP FS8510 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MC33771CTP2AE	NXP	BATTERY CELL CONTROLLER, PREMIUM Function: Battery Cell Controller Battery Chemistry: Lithium Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
SPC5746BSK1AVKU2	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: -	Request a Quote
MIMX8ML8DVNLZCB	NXP	IC Architecture: DSP, MCU, MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP Flash Size: - RAM Size: 868KB Peripherals: DMA, PWM, WDT Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART Speed: 1.8GHz, 800MHz Primary Attributes: - Operating Temperature: 0°C ~ 95°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote