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NXP |
FET RF 65V 2.17GHZ NI-780S
- Transistor Type: LDMOS
- Frequency: 2.17GHz
- Gain: 18dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 800mA
- Power - Output: 22W
- Voltage - Rated: 65V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S
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Package: NI-780S |
Stock3,344 |
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NXP |
DIODE ZENER 5.6V 220MW SMT3
- Voltage - Zener (Nom) (Vz): 5.6V
- Tolerance: ±2%
- Power - Max: 220mW
- Impedance (Max) (Zzt): 40 Ohms
- Current - Reverse Leakage @ Vr: 2µA @ 2.5V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,928 |
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NXP |
IC REG LINEAR 2.1V 200MA 6-XSON
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.1V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.13V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: 6-XFDFN |
Stock4,720 |
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NXP |
TOPFET PWR SWITCH D2PAK
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 5.5 V ~ 35 V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 20A
- Rds On (Typ): 28 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -
- Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
- Supplier Device Package: SOT-426
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Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB |
Stock5,664 |
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NXP |
IC MOTOR DRIVER SPI 24SOIC
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: -
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: SPI
- Technology: -
- Step Resolution: -
- Applications: Automotive
- Current - Output: 40mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Voltage - Load: 6.5 V ~ 26 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SOIC
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock6,048 |
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NXP |
IC MOTOR DRIVER PAR 20HSOP
- Output Configuration: Half Bridge (2)
- Applications: DC Motors, General Purpose, Solenoids
- Interface: Logic
- Load Type: Inductive
- Technology: Bi-CMOS
- Rds On (Typ): 150 mOhm
- Current - Output / Channel: 5A
- Current - Peak Output: -
- Voltage - Supply: 5 V ~ 28 V
- Voltage - Load: 5 V ~ 28 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Features: Status Flag
- Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 20-HSOP
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Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock3,248 |
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NXP |
IC EEPROM 2KBIT 100KHZ 8DIP
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 2Kb (256 x 8)
- Memory Interface: I2C
- Clock Frequency: 100kHz
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: 2.5 V ~ 6.0 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-DIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock2,640 |
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NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 77MHz
- Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 16mA, 16mA
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Iq): 160µA
- Input Capacitance: 3.5pF
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock4,304 |
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NXP |
IC COUNTER UP/DOWN SYNC 16-DIP
- Logic Type: Binary Counter
- Direction: Up, Down
- Number of Elements: 1
- Number of Bits per Element: 4
- Reset: -
- Timing: Synchronous
- Count Rate: 39MHz
- Trigger Type: Positive Edge
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock2,304 |
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NXP |
IC AMP PUSH-PULL SOT115J
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 235mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115J
- Supplier Device Package: SOT115J
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Package: SOT-115J |
Stock5,184 |
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NXP |
IC I/O EXPANDER I2C 8B 20SSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock7,904 |
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NXP |
IC MPU MPC83XX 800MHZ 689TEBGA
- Core Processor: PowerPC e300c4s
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 3.0
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock7,200 |
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NXP |
IC MPU M683XX 16MHZ 144CQFP
- Core Processor: CPU32
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 16MHz
- Co-Processors/DSP: -
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 144-BCQFP
- Supplier Device Package: 144-CQFP (26.77x26.77)
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Package: 144-BCQFP |
Stock6,496 |
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NXP |
IC MPU MPC85XX 833MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 833MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 784-BBGA, FCBGA |
Stock2,624 |
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NXP |
IC MPU MPC82XX 300MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock2,192 |
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NXP |
IC MPU MPC83XX 266MHZ 668BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 668-BBGA Exposed Pad
- Supplier Device Package: 668-PBGA-PGE (29x29)
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Package: 668-BBGA Exposed Pad |
Stock4,592 |
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NXP |
IC MCU 32BIT ROMLESS 208LQFP
- Core Processor: ARM9?
- Core Size: 16/32-Bit
- Speed: 125MHz
- Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 152
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 56K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP |
Stock6,960 |
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NXP |
IC MCU 32BIT ROMLESS 256MAPBGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, WDT
- Number of I/O: 97
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPBGA
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Package: 256-LBGA |
Stock5,040 |
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NXP |
IC MCU 32BIT 4MB FLASH 208MAPBGA
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 120
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 208-BGA
- Supplier Device Package: 208-MAPBGA (17x17)
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Package: 208-BGA |
Stock5,776 |
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NXP |
IC MCU 32BIT 32KB FLASH 32QFN
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 20
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 6x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN Exposed Pad (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock6,704 |
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NXP |
SENS PRESSURE 29 PSI MAX MPAK
- Pressure Type: Vented Gauge
- Operating Pressure: 29.01 PSI (200 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -
- Voltage - Supply: 10 V ~ 16 V
- Port Size: Male - 0.12" (2.97mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 5-SMD Module
- Supplier Device Package: 5-MPAK
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Package: 5-SMD Module |
Stock29,208 |
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NXP |
KIT DEV MC13237CHT BDM
- Type: Transceiver; 802.15.4 (ZigBee?)
- Frequency: 2.4GHz
- For Use With/Related Products: MC1323x
- Supplied Contents: Board
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Package: - |
Stock6,678 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 29x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock4,272 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 108
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 40K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 30x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,904 |
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NXP |
IC
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 128KB FLASH 48LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
RF MOSFET GAN HEMT 48V NI400
- Transistor Type: GaN HEMT
- Frequency: 3.4GHz ~ 3.6GHz
- Gain: 16.1dB
- Voltage - Test: 48 V
- Current Rating: -
- Noise Figure: -
- Current - Test: 291 mA
- Power - Output: 180W
- Voltage - Rated: 125 V
- Package / Case: NI-400S-2S
- Supplier Device Package: NI-400S-2S
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Package: - |
Stock231 |
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NXP |
4 X 44 AUTOMOTIVE LCD DRIVER
- Display Type: LCD
- Configuration: 176 Segment
- Interface: I2C
- Digits or Characters: 11 Characters, 22 Characters, 176 Elements
- Current - Supply: 30 µA
- Voltage - Supply: 1.8V ~ 5.5V
- Operating Temperature: -40°C ~ 95°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: - |
Request a Quote |
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