Page 694 - NXP Products | Heisener Electronics

PHU101NQ03LT,127
NXP

MOSFET N-CH 30V 75A SOT533

Package: TO-251-3 Short Leads, IPak, TO-251AA

Stock6,752
BUK652R3-40C,127
NXP

MOSFET N-CH 40V 120A TO220AB

Package: TO-220-3

Stock7,184
MRFG35005NR5
NXP

FET RF 15V 3.55GHZ PLD-1.5

Package: PLD-1.5

Stock4,192
BF904R,215
NXP

MOSFET N-CH 7V 30MA SOT143

Package: SOT-143R

Stock4,048
BFR520T,115
NXP

TRANS NPN 15V 9GHZ SOT-416

Package: SC-75, SOT-416

Stock4,320
PZM7.5NB3,115
NXP

DIODE ZENER 7.5V 300MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock3,152
MCZ33291EG
NXP

IC SWITCH 8X LOSIDE W/SPI 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock14,280
74HC574N,652
NXP

IC D-TYPE POS TRG SNGL 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock2,768
PCA9518AD,112
NXP

IC I2C BUS HUB 5-CH 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock5,040
P82B96DP,118
NXP

IC REDRIVER I2C 2CH 8TSSOP

Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Stock41,964
MPC8533VTAQGA
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock5,904
MPC8544EAVTANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock5,712
MPC8544EVTARJ
NXP

IC MPU MPC85XX 1.067GHZ 783BGA

Package: 783-BBGA, FCBGA

Stock5,136
MPC8245TVV350D
NXP

IC MPU MPC82XX 350MHZ 352TBGA

Package: 352-LBGA

Stock5,360
MCIMX6G3DVM05AB
NXP

IC MPU I.MC6UL 528MHZ 289BGA

Package: -

Stock2,416
P2010NSN2MHC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock4,416
MCF51AG96CLK
NXP

IC MCU 32BIT 96KB FLASH 80LQFP

Package: 80-LQFP

Stock5,968
MC9S08GT32CFBER
NXP

IC MCU 8BIT 32KB FLASH 44QFP

Package: 44-QFP

Stock5,104
MC908AZ60AVFUR2
NXP

IC MCU 8BIT 60KB FLASH 64QFP

Package: 64-QFP

Stock4,560
MC68HC908GR8CFA
NXP

IC MCU 8BIT 7.5KB FLASH 32LQFP

Package: 32-LQFP

Stock3,824

Part Number	Manufacturer	Description	Package	Stock
PHU101NQ03LT,127	NXP	MOSFET N-CH 30V 75A SOT533 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.5V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 23nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 2180pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 166W (Tc) Rds On (Max) @ Id, Vgs: 5.5 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I-Pak Package / Case: TO-251-3 Short Leads, IPak, TO-251AA	Package: TO-251-3 Short Leads, IPak, TO-251AA	Stock6,752
BUK652R3-40C,127	NXP	MOSFET N-CH 40V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 260nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 15100pF @ 25V Vgs (Max): ±16V FET Feature: - Power Dissipation (Max): 306W (Tc) Rds On (Max) @ Id, Vgs: 2.3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock7,184
MRFG35005NR5	NXP	FET RF 15V 3.55GHZ PLD-1.5 Transistor Type: pHEMT FET Frequency: 3.55GHz Gain: 11dB Voltage - Test: 12V Current Rating: - Noise Figure: - Current - Test: 80mA Power - Output: 4.5W Voltage - Rated: 15V Package / Case: PLD-1.5 Supplier Device Package: PLD-1.5	Package: PLD-1.5	Stock4,192
BF904R,215	NXP	MOSFET N-CH 7V 30MA SOT143 Transistor Type: N-Channel Dual Gate Frequency: 200MHz Gain: - Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1dB Current - Test: 10mA Power - Output: - Voltage - Rated: 7V Package / Case: SOT-143R Supplier Device Package: SOT-143R	Package: SOT-143R	Stock4,048
BFR520T,115	NXP	TRANS NPN 15V 9GHZ SOT-416 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Gain: - Power - Max: 150mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Current - Collector (Ic) (Max): 70mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	Package: SC-75, SOT-416	Stock4,320
PZM7.5NB3,115	NXP	DIODE ZENER 7.5V 300MW SMT3 Voltage - Zener (Nom) (Vz): 7.5V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 1µA @ 4V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock3,152
MCZ33291EG	NXP	IC SWITCH 8X LOSIDE W/SPI 24SOIC Switch Type: General Purpose Number of Outputs: 8 Ratio - Input:Output: 1:8 Output Configuration: Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 9 V ~ 26.5 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 500mA Rds On (Typ): 550 mOhm Input Type: - Features: - Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SOIC	Package: 24-SOIC (0.295", 7.50mm Width)	Stock14,280
74HC574N,652	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 133MHz Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Iq): 8µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	Package: 20-DIP (0.300", 7.62mm)	Stock2,768
PCA9518AD,112	NXP	IC I2C BUS HUB 5-CH 20SOIC Applications: Buffer Interface: I2C, SMBus Voltage - Supply: 3 V ~ 3.6 V Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO Mounting Type: Surface Mount	Package: 20-SOIC (0.295", 7.50mm Width)	Stock5,040
P82B96DP,118	NXP	IC REDRIVER I2C 2CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 2 Delay Time: - Signal Conditioning: - Capacitance - Input: 7pF Voltage - Supply: 2 V ~ 15 V Current - Supply: 900µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	Stock41,964
MPC8533VTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,904
MPC8544EAVTANG	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,712
MPC8544EVTARJ	NXP	IC MPU MPC85XX 1.067GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,136
MPC8245TVV350D	NXP	IC MPU MPC82XX 350MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	Package: 352-LBGA	Stock5,360
MCIMX6G3DVM05AB	NXP	IC MPU I.MC6UL 528MHZ 289BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: - Supplier Device Package: -	Package: -	Stock2,416
P2010NSN2MHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock4,416
MCF51AG96CLK	NXP	IC MCU 32BIT 96KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: DMA, LVD, PWM, WDT Number of I/O: 69 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	Package: 80-LQFP	Stock5,968
MC9S08GT32CFBER	NXP	IC MCU 8BIT 32KB FLASH 44QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	Package: 44-QFP	Stock5,104
MC908AZ60AVFUR2	NXP	IC MCU 8BIT 60KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8.4MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 52 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock4,560
MC68HC908GR8CFA	NXP	IC MCU 8BIT 7.5KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 7.5KB (7.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock3,824
MC908AZ32AVFUE	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock16,260
S9S12G48F1MLC	NXP	IC MCU 16BIT 48KB FLASH 32LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock7,200
MPX2050D	NXP	SENSOR TEMP Pressure Type: Differential Operating Pressure: 7.25 PSI (50 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	Package: 4-SIP Module	Stock6,534
MC33696MOD434EV	NXP	KIT RF MODULE 434MHZ MC33696 Type: Transceiver, ISM Frequency: 433.92MHz For Use With/Related Products: MC33696 434MHz RF Module Supplied Contents: Board	Package: -	Stock3,402
MMG3009NT1	NXP	IC AMP RF GP 6000MHZ 5V SOT-89 Frequency: 0Hz ~ 6GHz P1dB: 18dBm (63.1mW) Gain: 15dB Noise Figure: 4.2dB RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Current - Supply: 70mA Test Frequency: 900MHz Package / Case: TO-243AA Supplier Device Package: SOT-89-4	Package: TO-243AA	Stock25,248
SPC5645BCF0VLU1	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 160K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock6,880
S912XET256BCAAR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock6,048
SAF7751HN-N207WMP	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote