Page 713 - NXP Products | Heisener Electronics

2N7000,126
NXP

MOSFET N-CH 60V 300MA TO-92

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock4,656
MRF8P26080HSR5
NXP

FET RF 2CH 65V 2.62GHZ NI780S-4

Package: NI-780S-4

Stock3,536
MRFE6VP6300GSR5
NXP

FET RF 50V 600MHZ NI780-4

Package: NI-780GS-4

Stock4,208
BAP55L,315
NXP

DIODE PIN 50V 100MA SOD-882

Package: SOD-882

Stock6,272
MC40XS6500EK
NXP

IC SWITCH HIGH SIDE 32SOIC

Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock6,368
PCF1179CT,112
NXP

IC LCD CAR CLOCK 4DIGIT 28SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock6,128
MM9Z1I638BM2EP
NXP

IC MCU LIN BATT MONITOR 48QFN

Package: 48-VFQFN Exposed Pad

Stock7,568
SSTL16877DGG,518
NXP

IC REG DRIVER 14BIT 48TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

Stock3,920
NVT2002GF,115
NXP

IC TRANSLATOR BIDIR VOLT 8XSON

Package: 8-XFDFN

Stock2,224
74LV153D,118
NXP

IC DUAL 4-IN MUX 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock5,456
74HC125N,652
NXP

IC BUFFER DVR TRI-ST QD 14DIP

Package: 14-DIP (0.300", 7.62mm)

Stock4,912
SCC2681AC1A44,512
NXP

IC UART 44-PLCC

Package: 44-LCC (J-Lead)

Stock7,984
MPC8543VTANGB
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock6,128
MPC8313CZQADD
NXP

IC MPU MPC83XX 267MHZ 516BGA

Package: 516-BBGA Exposed Pad

Stock6,848
MCIMX31LVMN5CR2
NXP

IC MPU I.MX31 532MHZ 473MAPBGA

Package: 473-LFBGA

Stock7,616
MPC8272CZQTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

Package: 516-BBGA

Stock3,712
LPC3230FET296/01,5
NXP

IC MCU 32BIT ROMLESS 296TFBGA

Package: 296-TFBGA

Stock6,064
MCF51JM64EVLD
NXP

IC MCU 32BIT 64KB FLASH 44LQFP

Package: 44-LQFP

Stock3,296
P89LPC922A1FDH,112
NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock7,824
MCHC908GR8AMFAE
NXP

IC MCU 8BIT 7.5KB FLASH 32LQFP

Package: 32-LQFP

Stock8,640

Part Number	Manufacturer	Description	Package	Stock
2N7000,126	NXP	MOSFET N-CH 60V 300MA TO-92 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 300mA (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 40pF @ 10V Vgs (Max): ±30V FET Feature: - Power Dissipation (Max): 830mW (Ta) Rds On (Max) @ Id, Vgs: 5 Ohm @ 500mA, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-92-3 Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock4,656
MRF8P26080HSR5	NXP	FET RF 2CH 65V 2.62GHZ NI780S-4 Transistor Type: LDMOS (Dual) Frequency: 2.62GHz Gain: 15dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 14W Voltage - Rated: 65V Package / Case: NI-780S-4 Supplier Device Package: NI-780S-4	Package: NI-780S-4	Stock3,536
MRFE6VP6300GSR5	NXP	FET RF 50V 600MHZ NI780-4 Transistor Type: LDMOS Frequency: 600MHz Gain: 25dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 300W Voltage - Rated: 50V Package / Case: NI-780GS-4 Supplier Device Package: NI-780GS-4	Package: NI-780GS-4	Stock4,208
BAP55L,315	NXP	DIODE PIN 50V 100MA SOD-882 Diode Type: PIN - Single Voltage - Peak Reverse (Max): 50V Current - Max: 100mA Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz Resistance @ If, F: 700 mOhm @ 100mA, 100MHz Power Dissipation (Max): 500mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SOD-882 Supplier Device Package: DFN1006-2	Package: SOD-882	Stock6,272
MC40XS6500EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 5 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 3.2A Rds On (Typ): 40 mOhm Input Type: - Features: Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock6,368
PCF1179CT,112	NXP	IC LCD CAR CLOCK 4DIGIT 28SOIC Display Type: LCD Configuration: 7 Segment Interface: - Digits or Characters: 4 Digits Current - Supply: 950µA Voltage - Supply: 3 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SO	Package: 28-SOIC (0.295", 7.50mm Width)	Stock6,128
MM9Z1I638BM2EP	NXP	IC MCU LIN BATT MONITOR 48QFN Function: Battery Monitor Battery Chemistry: Multi-Chemistry Number of Cells: - Fault Protection: - Interface: CAN Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock7,568
SSTL16877DGG,518	NXP	IC REG DRIVER 14BIT 48TSSOP Logic Type: SSTL_2 Registered Driver with Differential Clock Inputs Number of Circuits: 14 Current - Output High, Low: 20mA, 20mA Voltage - Supply: 2.3 V ~ 2.7 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	Package: 48-TFSOP (0.240", 6.10mm Width)	Stock3,920
NVT2002GF,115	NXP	IC TRANSLATOR BIDIR VOLT 8XSON Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-XFDFN Supplier Device Package: 8-XSON, SOT1089 (1.35x1)	Package: 8-XFDFN	Stock2,224
74LV153D,118	NXP	IC DUAL 4-IN MUX 16SOIC Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock5,456
74HC125N,652	NXP	IC BUFFER DVR TRI-ST QD 14DIP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	Package: 14-DIP (0.300", 7.62mm)	Stock4,912
SCC2681AC1A44,512	NXP	IC UART 44-PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: - Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: - Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock7,984
MPC8543VTANGB	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock6,128
MPC8313CZQADD	NXP	IC MPU MPC83XX 267MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	Package: 516-BBGA Exposed Pad	Stock6,848
MCIMX31LVMN5CR2	NXP	IC MPU I.MX31 532MHZ 473MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Ethernet: - SATA: - USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Package / Case: 473-LFBGA Supplier Device Package: -	Package: 473-LFBGA	Stock7,616
MPC8272CZQTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,712
LPC3230FET296/01,5	NXP	IC MCU 32BIT ROMLESS 296TFBGA Core Processor: ARM9? Core Size: 16/32-Bit Speed: 266MHz Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Number of I/O: 51 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.9 V ~ 3.6 V Data Converters: A/D 3x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 296-TFBGA Supplier Device Package: 296-TFBGA (15x15)	Package: 296-TFBGA	Stock6,064
MCF51JM64EVLD	NXP	IC MCU 32BIT 64KB FLASH 44LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 33 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	Package: 44-LQFP	Stock3,296
P89LPC922A1FDH,112	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock7,824
MCHC908GR8AMFAE	NXP	IC MCU 8BIT 7.5KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 7.5KB (7.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock8,640
MC68376BACAB20	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 7.5K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	Package: 160-BQFP	Stock2,128
MPC9456FA	NXP	IC CLK BUFFER 1:10 250MHZ 32LQFP Type: Fanout Buffer (Distribution), Divider, Multiplexer Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: Yes/No Input: LVPECL Output: LVCMOS Frequency - Max: 250MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock5,376
MPL015A1T1	NXP	IC BAROMETER SPI DGTL MINI 8-LGA Pressure Type: Absolute Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa) Output Type: SPI Output: 10 b Accuracy: ±0.145 PSI (±1 kPa) Voltage - Supply: 2.375 V ~ 5.5 V Port Size: - Port Style: No Port Features: Shutdown Mode Termination Style: PCB Maximum Pressure: 145.04 PSI (1000 kPa) Operating Temperature: -40°C ~ 105°C Package / Case: 8-TLGA Supplier Device Package: 8-LGA	Package: 8-TLGA	Stock5,850
ASC3101HVY	NXP	IC RF TXRX+MCU AISG 144-LQFP Type: TxRx + MCU RF Family/Standard: AISG Protocol: - Modulation: OOK Frequency: 2.176GHz, 4.352GHz, 6.528GHz Data Rate (Max): 38.4kbps Power - Output: 10dBm Sensitivity: - Memory Size: 128kB Flash, 16kB SRAM Serial Interfaces: I2C, SPI, UART GPIO: 44 Voltage - Supply: 1.8 V ~ 3.3 V Current - Receiving: - Current - Transmitting: - Operating Temperature: - Package / Case: 144-LQFP Exposed Pad	Package: 144-LQFP Exposed Pad	Stock2,664
FS32V234BJN1VUB	NXP	ISP NO GPU NO CSE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,960
LS1023ASE8PQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,864
SPC5746CK1MKU6	NXP	32 BIT DUAL CORE 3M FLASH 384 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock5,072
SPC5643LK0MLL6	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 64MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock3,440