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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,248 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15µin (0.38µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 15µin (0.38µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock3,798 |
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16 (2 x 8) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 16POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 16 (1 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,356 |
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16 (1 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 20µin (0.51µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 20µin (0.51µm)
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,766 |
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18 (2 x 9) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock2,898 |
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24 (2 x 12) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: -
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock6,390 |
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14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: -
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock2,682 |
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18 (2 x 9) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Closed Frame | - | 0.100" (2.54mm) | - | - | - | - | - |
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TE Connectivity AMP Connectors |
CONN SOCKET PLCC 28POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 28 (4 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock6,066 |
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28 (4 x 7) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,496 |
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40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN SOCKET PLCC 32POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
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Package: - |
Stock7,992 |
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32 (2 x 7, 2 x 9) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 604POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 604 (25 x 31)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: -
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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Package: - |
Stock9,888 |
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604 (25 x 31) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | - | Surface Mount | Open Frame | - | - | - | - | - | - | - |
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TE Connectivity AMP Connectors |
CONN SOCKET PLCC 52POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
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Package: - |
Stock4,374 |
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52 (4 x 13) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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TE Connectivity AMP Connectors |
CONN SOCKET PLCC 84POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 84 (4 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
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Package: - |
Stock7,542 |
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84 (4 x 21) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Nickel
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock5,742 |
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8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,014 |
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20 (2 x 10) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 5µin (0.127µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,500 |
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24 (2 x 12) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 80µin (2.03µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock2,430 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 80µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,758 |
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24 (2 x 12) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 30POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 30 (1 x 30)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,370 |
|
30 (1 x 30) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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|
TE Connectivity AMP Connectors |
CONN SOCKET SIP 21POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 21 (1 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock6,660 |
|
21 (1 x 21) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: -
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,498 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | - | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS TIN
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,010 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PLCC 84POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 84 (4 x 21)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 100µin (2.54µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic
- Operating Temperature: -
|
Package: - |
Stock7,704 |
|
84 (4 x 21) | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PLCC 52POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100µin (2.54µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 100µin (2.54µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Thermoplastic
- Operating Temperature: -
|
Package: - |
Stock6,336 |
|
52 (4 x 13) | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PLCC 68POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 68 (4 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
|
Package: - |
Stock4,734 |
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68 (4 x 17) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 20µin (0.51µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 20µin (0.51µm)
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock6,408 |
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20 (2 x 10) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN SOCKET PLCC 44POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 44 (4 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 180µin (4.57µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 180µin (4.57µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
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Package: - |
Stock5,760 |
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44 (4 x 11) | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 370POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 370 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
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Package: - |
Stock5,202 |
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370 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Liquid Crystal Polymer (LCP) | - |