Page 31 - TE Connectivity AMP Connectors Products - Sockets for ICs, Transistors

4-1814655-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 64POS GOLD

Package: -

Stock3,708
2-1814655-6
TE Connectivity AMP Connectors

CONN SOCKET SIP 32POS TIN

Package: -

Stock5,922
1-1814655-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS GOLD

Package: -

Stock8,550
1814655-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 4POS GOLD

Package: -

Stock5,688
3-1674770-2
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 478POS GOLD

Package: -

Stock6,192
1-1571995-0
TE Connectivity AMP Connectors

CONN SOCKET SIP 10POS TIN

Package: -

Stock6,552
510-AG90D-20
TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS GOLD

Package: -

Stock5,022
2-822064-4
TE Connectivity AMP Connectors

CONN SOCKET PQFP 100POS TIN-LEAD

Package: -

Stock4,518
643649-8
TE Connectivity AMP Connectors

CONN SOCKET SIP 17POS TIN

Package: -

Stock8,910
643645-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 13POS TIN

Package: -

Stock5,922
643644-6
TE Connectivity AMP Connectors

CONN SOCKET SIP 12POS TIN

Package: -

Stock5,688
643640-8
TE Connectivity AMP Connectors

CONN SOCKET SIP 8POS TIN

Package: -

Stock6,012
382441-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 7POS TIN

Package: -

Stock8,604
1825412-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock5,580
1825374-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock8,028
1825373-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock2,448
1825109-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock3,400
1-1825108-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock7,488
1-1825108-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock2,448
1-1825094-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock3,834

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
4-1814655-1	TE Connectivity AMP Connectors	CONN SOCKET SIP 64POS GOLD Type: SIP Number of Positions or Pins (Grid): 64 (1 x 64) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,708	64 (1 x 64)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
2-1814655-6	TE Connectivity AMP Connectors	CONN SOCKET SIP 32POS TIN Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 196.8µin (5.00µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.8µin (5.00µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,922	32 (1 x 32)	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
1-1814655-3	TE Connectivity AMP Connectors	CONN SOCKET SIP 20POS GOLD Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,550	20 (1 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
1814655-1	TE Connectivity AMP Connectors	CONN SOCKET SIP 4POS GOLD Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,688	4 (1 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
3-1674770-2	TE Connectivity AMP Connectors	CONN SOCKET PGA ZIF 478POS GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): 478 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock6,192	478 (26 x 26)	0.050" (1.27mm)	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	30µin (0.76µm)	Copper Alloy	Thermoplastic	-
1-1571995-0	TE Connectivity AMP Connectors	CONN SOCKET SIP 10POS TIN Type: SIP Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Thermoplastic, Polyester Operating Temperature: -	Package: -	Stock6,552	10 (2 x 5)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	20µin (0.51µm)	Copper	Thermoplastic, Polyester	-
510-AG90D-20	TE Connectivity AMP Connectors	CONN SOCKET SIP 20POS GOLD Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock5,022	20 (1 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Thermoplastic	-
2-822064-4	TE Connectivity AMP Connectors	CONN SOCKET PQFP 100POS TIN-LEAD Type: QFP Number of Positions or Pins (Grid): 100 (4 x 25) Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.025" (0.64mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock4,518	100 (4 x 25)	0.025" (0.64mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.025" (0.64mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
643649-8	TE Connectivity AMP Connectors	CONN SOCKET SIP 17POS TIN Type: SIP Number of Positions or Pins (Grid): 17 (1 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,910	17 (1 x 17)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
643645-3	TE Connectivity AMP Connectors	CONN SOCKET SIP 13POS TIN Type: SIP Number of Positions or Pins (Grid): 13 (1 x 13) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,922	13 (1 x 13)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
643644-6	TE Connectivity AMP Connectors	CONN SOCKET SIP 12POS TIN Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,688	12 (1 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
643640-8	TE Connectivity AMP Connectors	CONN SOCKET SIP 8POS TIN Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,012	8 (1 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
382441-3	TE Connectivity AMP Connectors	CONN SOCKET SIP 7POS TIN Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,604	7 (1 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
1825412-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -	Package: -	Stock5,580	8 (2 x 4)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Brass	Thermoplastic, Polyester	-
1825374-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,028	20 (2 x 10)	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
1825373-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,448	20 (2 x 10)	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
1825109-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,400	24 (2 x 12)	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
1-1825108-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,488	40 (2 x 20)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
1-1825108-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,448	24 (2 x 12)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
1-1825094-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,834	20 (2 x 10)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
1825088-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Thermoplastic Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,672	20 (2 x 10)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	Thermoplastic	-55°C ~ 125°C
3-1825046-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Package: -	Stock7,074	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
2-1825046-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Package: -	Stock7,434	14 (2 x 7)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
1825046-9	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Package: -	Stock5,796	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
1825046-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Package: -	Stock2,142	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
1825046-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Package: -	Stock7,974	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
2-1814642-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,974	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
1-1814642-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,722	18 (2 x 9)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C