|
|
|
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock3,276 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock5,778 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock4,680 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock5,004 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 34 (2 x 17)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock2,898 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 34 (1 x 34)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,228 |
|
34 (1 x 34) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 34 (2 x 17)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,254 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
- Type: Zig-Zag, ZIF (ZIP)
- Number of Positions or Pins (Grid): 34 (2 x 17)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock2,988 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
SOCKET ZIP IN-LINE 36POS
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock5,778 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
CONN ZIG-ZAG 39POS GOLD
- Type: Zig-Zag
- Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock3,472 |
|
39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
IN-LINE ZIP STRIP POCKETS 32 CON
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock4,680 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
CONN ZIG-ZAG 39POS GOLD
- Type: Zig-Zag
- Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 150°C
|
Package: - |
Stock3,960 |
|
39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
|
|
|
3M |
CONN SOCKET 39POS ZIP STRIP
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock3,526 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
STAGGERED ZIP STRIP POCKETS 32 C
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock3,042 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
STAGGERED ZIP STRIP POCKETS 32 C
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock4,230 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
CONN SOCKET PGA ZIF 32POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock3,472 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET PGA ZIF 32POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,046 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET 39POS ZIP STRIP
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock6,876 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
CONN SOCKET PLCC 84POS GOLD
- Type: PLCC
- Number of Positions or Pins (Grid): 84 (4 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,406 |
|
84 (4 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
|
|
|
3M |
CONN IC DIP SOCKET ZIF 32POS GLD
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 250µin (6.35µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 250µin (6.35µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyether Imide (PEI), Glass Filled
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock5,580 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
|
|
|
3M |
OEM LCC SOCKETS 32 POS SOLID LID
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock6,264 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
3M |
CONN SOCKET PLCC 68POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 68 (4 x 17)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock8,244 |
|
68 (4 x 17) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
|
3M |
CONN SOCKET PLCC 84POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 84 (4 x 21)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock6,912 |
|
84 (4 x 21) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
|
3M |
CONN SOCKET PLCC 52POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock4,644 |
|
52 (4 x 13) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
|
3M |
CONN SOCKET PLCC 20POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 20 (4 x 5)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock3,384 |
|
20 (4 x 5) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
|
3M |
CONN SOCKET PLCC 28POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 28 (4 x 7)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
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Package: - |
Stock4,158 |
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28 (4 x 7) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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|
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3M |
CONN SOCKET PLCC 20POS TIN
- Type: PLCC
- Number of Positions or Pins (Grid): 20 (4 x 5)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 160µin (4.06µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 160µin (4.06µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -40°C ~ 105°C
|
Package: - |
Stock8,514 |
|
20 (4 x 5) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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|
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3M |
CONN IC DIP SOCKET 42POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 135µin (3.43µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 135µin (3.43µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -25°C ~ 85°C
|
Package: - |
Stock4,122 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 135µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 135µin (3.43µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
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