Page 6 - 3M Products - Sockets for ICs, Transistors

ICO-486-S8A-T
3M

CONN IC DIP SOCKET 48POS TIN

Package: -

Stock6,696
ICO-426-S8-T
3M

CONN IC DIP SOCKET 42POS TIN

Package: -

Stock2,376
ICO-426-S8A-T
3M

CONN IC DIP SOCKET 42POS TIN

Package: -

Stock8,604
ICO-406-S8-T
3M

CONN IC DIP SOCKET 40POS TIN

Package: -

Stock5,778
ICO-406-S8A-T
3M

CONN IC DIP SOCKET 40POS TIN

Package: -

Stock6,066
ICO-326-S8-T
3M

CONN IC DIP SOCKET 32POS TIN

Package: -

Stock6,048
ICO-326-S8A-T
3M

CONN IC DIP SOCKET 32POS TIN

Package: -

Stock4,212
ICO-286-S8-T
3M

CONN IC DIP SOCKET 28POS TIN

Package: -

Stock3,654
ICO-286-S8A-T
3M

CONN IC DIP SOCKET 28POS TIN

Package: -

Stock4,968
ICO-246-S8-T
3M

CONN IC DIP SOCKET 24POS TIN

Package: -

Stock3,708
ICO-243-S8A-T
3M

CONN IC DIP SOCKET 24POS TIN

Package: -

Stock5,508
ICO-203-S8-T
3M

CONN IC DIP SOCKET 20POS TIN

Package: -

Stock2,970
ICO-203-S8A-T
3M

CONN IC DIP SOCKET 20POS TIN

Package: -

Stock6,948
ICO-183-S8A-T
3M

CONN IC DIP SOCKET 18POS TIN

Package: -

Stock7,848
ICO-163-S8A-T
3M

CONN IC DIP SOCKET 16POS TIN

Package: -

Stock7,506
ICO-143-S8-T
3M

CONN IC DIP SOCKET 14POS TIN

Package: -

Stock7,596
ICO-143-S8A-T
3M

CONN IC DIP SOCKET 14POS TIN

Package: -

Stock4,860
ICO-083-S8-T
3M

CONN IC DIP SOCKET 8POS TIN

Package: -

Stock7,722
ICO-083-S8A-T
3M

CONN IC DIP SOCKET 8POS TIN

Package: -

Stock4,140
268-5401-52-1102JH
3M

CONN SOCKET CLCC 68POS GOLD

Package: -

Stock5,364

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
ICO-486-S8A-T	3M	CONN IC DIP SOCKET 48POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock6,696	48 (2 x 24)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-426-S8-T	3M	CONN IC DIP SOCKET 42POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock2,376	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-426-S8A-T	3M	CONN IC DIP SOCKET 42POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock8,604	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-406-S8-T	3M	CONN IC DIP SOCKET 40POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock5,778	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-406-S8A-T	3M	CONN IC DIP SOCKET 40POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock6,066	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-326-S8-T	3M	CONN IC DIP SOCKET 32POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock6,048	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-326-S8A-T	3M	CONN IC DIP SOCKET 32POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock4,212	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-286-S8-T	3M	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock3,654	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-286-S8A-T	3M	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock4,968	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-246-S8-T	3M	CONN IC DIP SOCKET 24POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock3,708	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-243-S8A-T	3M	CONN IC DIP SOCKET 24POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock5,508	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-203-S8-T	3M	CONN IC DIP SOCKET 20POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock2,970	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-203-S8A-T	3M	CONN IC DIP SOCKET 20POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock6,948	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-183-S8A-T	3M	CONN IC DIP SOCKET 18POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock7,848	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-163-S8A-T	3M	CONN IC DIP SOCKET 16POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock7,506	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-143-S8-T	3M	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock7,596	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-143-S8A-T	3M	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock4,860	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-083-S8-T	3M	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock7,722	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-083-S8A-T	3M	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyester, Glass Filled Operating Temperature: -65°C ~ 105°C	Package: -	Stock4,140	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
268-5401-52-1102JH	3M	CONN SOCKET CLCC 68POS GOLD Type: CLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,364	68 (4 x 17)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
268-5401-50-1102JH	3M	CONN SOCKET CLCC 68POS GOLD Type: CLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,830	68 (4 x 17)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
268-5401-11-1102JH	3M	CONN SOCKET CLCC 68POS GOLD Type: CLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,200	68 (4 x 17)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
2100-7243-00-1807	3M	CONN SOCKET PQFP 100POS TIN-LEAD Type: QFP Number of Positions or Pins (Grid): 100 (4 x 25) Pitch - Mating: - Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyethersulfone (PES), Glass Filled Operating Temperature: 0°C ~ 105°C	Package: -	Stock6,462	100 (4 x 25)	-	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	-	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	0°C ~ 105°C
240-4846-00-3303	3M	CONN IC DIP SOCKET ZIF 40POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 250µin (6.35µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 250µin (6.35µm) Contact Material - Post: Beryllium Copper Housing Material: Polyether Imide (PEI), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,192	40 (2 x 20)	0.100" (2.54mm)	Gold	250µin (6.35µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	250µin (6.35µm)	Beryllium Copper	Polyether Imide (PEI), Glass Filled	-55°C ~ 105°C
220-4842-00-3303	3M	CONN IC DIP SOCKET ZIF 20POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 250µin (6.35µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 250µin (6.35µm) Contact Material - Post: Beryllium Copper Housing Material: Polyether Imide (PEI), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock2,520	20 (2 x 10)	0.100" (2.54mm)	Gold	250µin (6.35µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	250µin (6.35µm)	Beryllium Copper	Polyether Imide (PEI), Glass Filled	-55°C ~ 105°C
260-5204-01	3M	CONN SOCKET QFN 60POS GOLD Type: QFN Number of Positions or Pins (Grid): 60 (4 x 15) Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.020" (0.50mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polyethersulfone (PES) Operating Temperature: -	Package: -	Stock3,276	60 (4 x 15)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020" (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
251-5949-51-0602	3M	CONN ZIG-ZAG ZIF 51POS GOLD Type: Zig-Zag, ZIF (ZIP) Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polysulfone (PSU), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,022	51 (1 x 25, 1 x 26)	0.050" (1.27mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
251-5949-52-0602	3M	CONN ZIG-ZAG ZIF 51POS GOLD Type: Zig-Zag, ZIF (ZIP) Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polysulfone (PSU), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,904	51 (1 x 25, 1 x 26)	0.050" (1.27mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C