Page 8 - 3M Products - Sockets for ICs, Transistors

100-048-050
3M

CONN IC DIP SOCKET 48POS GOLD

Package: -

Stock5,670
100-042-050
3M

CONN IC DIP SOCKET 42POS GOLD

Package: -

Stock2,178
100-040-051
3M

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock6,354
100-040-050
3M

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock5,454
100-032-051
3M

CONN IC DIP SOCKET 32POS GOLD

Package: -

Stock4,842
100-032-050
3M

CONN IC DIP SOCKET 32POS GOLD

Package: -

Stock2,214
100-028-051
3M

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock2,394
100-028-050
3M

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock3,726
100-024-051
3M

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock6,750
100-022-050
3M

CONN IC DIP SOCKET 22POS GOLD

Package: -

Stock2,178
100-020-051
3M

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock5,778
100-020-050
3M

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock3,690
100-018-051
3M

CONN IC DIP SOCKET 18POS GOLD

Package: -

Stock5,832
100-018-050
3M

CONN IC DIP SOCKET 18POS GOLD

Package: -

Stock8,280
100-016-051
3M

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock7,236
100-016-050
3M

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock3,474
100-014-051
3M

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock6,804
100-014-050
3M

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock2,106
100-010-050
3M

CONN IC DIP SOCKET 10POS GOLD

Package: -

Stock3,598
100-008-051
3M

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock4,158

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
100-048-050	3M	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock5,670	48 (2 x 24)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-042-050	3M	CONN IC DIP SOCKET 42POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock2,178	42 (2 x 21)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-040-051	3M	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock6,354	40 (2 x 20)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-040-050	3M	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock5,454	40 (2 x 20)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-032-051	3M	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock4,842	32 (2 x 16)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-032-050	3M	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock2,214	32 (2 x 16)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-028-051	3M	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock2,394	28 (2 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-028-050	3M	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,726	28 (2 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-024-051	3M	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock6,750	24 (2 x 12)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-022-050	3M	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock2,178	22 (2 x 11)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-020-051	3M	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock5,778	20 (2 x 10)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-020-050	3M	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,690	20 (2 x 10)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-018-051	3M	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock5,832	18 (2 x 9)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-018-050	3M	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock8,280	18 (2 x 9)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-016-051	3M	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock7,236	16 (2 x 8)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-016-050	3M	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,474	16 (2 x 8)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-014-051	3M	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock6,804	14 (2 x 7)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-014-050	3M	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock2,106	14 (2 x 7)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-010-050	3M	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,598	10 (2 x 5)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-008-051	3M	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock4,158	8 (2 x 4)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-008-050	3M	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,490	8 (2 x 4)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
100-006-050	3M	CONN IC DIP SOCKET 6POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock8,100	6 (2 x 3)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
500-032-000	3M	CONN SOCKET SIP 32POS GOLD Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,748	32 (1 x 32)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-040-000	3M	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock4,968	40 (2 x 20)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-032-000	3M	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,452	32 (2 x 16)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-028-000	3M	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,226	28 (2 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
300-032-000	3M	CONN SOCKET SIP 32POS GOLD Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,340	32 (1 x 32)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
300-014-000	3M	CONN SOCKET SIP 14POS GOLD Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,732	14 (1 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-