Page 11 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

96-208M50
Aries Electronics

SOCKET ADAPTER QFP TO 208PGA

Package: -

Stock3,258
84-652000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

Package: -

Stock4,392
248-1282-19-0602J
3M

RECEPTACLE DIP SOCKET 48POS .6"

Package: -

Stock2,484
264-1300-09-0602J
3M

RECEPTACLE DIP SOCKET 64POS .8"

Package: -

Stock8,694
32-655000-10-P
Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP 0.6

Package: -

Stock3,526
28-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

Package: -

Stock3,348
28-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

Package: -

Stock6,678
242-1281-19-0602J
3M

RECEPTACLE DIP SOCKET 42POS .6"

Package: -

Stock7,182
20-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 20SOIC

Package: -

Stock6,480
242-1281-29-0602J
3M

RECEPTACLE DIP SOCKET 42POS .6"

Package: -

Stock8,064
242-1281-09-0602J
3M

RECEPTACLE DIP SOCKET 42POS .6"

Package: -

Stock8,604
16-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 16SOIC

Package: -

Stock3,526
14-354000-21-RC
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

Package: -

Stock4,590
228-1290-29-0602J
3M

RECEPTACLE DIP SOCKET 28POS .4"

Package: -

Stock5,976
20-665000-00
Aries Electronics

SCK ADAPT 20P SOIC-W TO SOIC 0.6

Package: -

Stock8,208
24-35W000-10
Aries Electronics

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Package: -

Stock4,392
14-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

Package: -

Stock3,924
1106396-32
Aries Electronics

SOCKET ADAPTER DIP TO 32DIP 0.6

Package: -

Stock2,664
14-35W000-10
Aries Electronics

SOCKET ADAPT SOIC-W TO 14DIP 0.3

Package: -

Stock8,334
1107254-20
Aries Electronics

SOCKET ADAPTER DIP TO 20DIP 0.3

Package: -

Stock8,316

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
96-208M50	Aries Electronics	SOCKET ADAPTER QFP TO 208PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 208 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,258	PGA	208	0.020" (0.50mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
84-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 84DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,392	DIP, 0.6" (15.24mm) Row Spacing	84	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
248-1282-19-0602J	3M	RECEPTACLE DIP SOCKET 48POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock2,484	-	-	-	-	-	-	-	-	-	-
264-1300-09-0602J	3M	RECEPTACLE DIP SOCKET 64POS .8" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,694	-	-	-	-	-	-	-	-	-	-
32-655000-10-P	Aries Electronics	SOCKET ADAPTER TSOP TO 32DIP 0.6 Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Silver Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,526	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	Silver	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-652000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,348	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-354000-20	Aries Electronics	SOCKET ADAPTER DIP TO 28SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock6,678	SOIC	28	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
242-1281-19-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,182	-	-	-	-	-	-	-	-	-	-
20-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 20SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock6,480	SOIC	20	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
242-1281-29-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,064	-	-	-	-	-	-	-	-	-	-
242-1281-09-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,604	-	-	-	-	-	-	-	-	-	-
16-354000-20	Aries Electronics	SOCKET ADAPTER DIP TO 16SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,526	SOIC	16	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 14SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock4,590	SOIC	14	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
228-1290-29-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock5,976	DIP, 0.4" (10.16mm) Row Spacing	28	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
20-665000-00	Aries Electronics	SCK ADAPT 20P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,208	SOIC	20	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
24-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 24DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,392	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
14-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock3,924	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
1106396-32	Aries Electronics	SOCKET ADAPTER DIP TO 32DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock2,664	DIP, 0.6" (15.24mm) Row Spacing	32	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 14DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,334	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1107254-20	Aries Electronics	SOCKET ADAPTER DIP TO 20DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock8,316	DIP, 0.3" (7.62mm) Row Spacing	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
1107254-18	Aries Electronics	SOCKET ADAPTER DIP TO 18DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock6,426	DIP, 0.3" (7.62mm) Row Spacing	18	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
LCQT-QFP0.65-80	Aries Electronics	SOCKET ADAPTER MULT PKG TO 80QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 80 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock3,528	QFP	80	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
1106396-16	Aries Electronics	SOCKET ADAPTER DIP TO 16DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock5,976	DIP, 0.6" (15.24mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 20DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock2,574	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
18-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock8,190	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
PA-SSD6SM18-28	Logical Systems Inc.	ADAPTER 28TSSOP TO 28DIP(600MIL) Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,290	DIP	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-QSD3SM18-20	Logical Systems Inc.	ADAPTER 20QSOP TO 20DIP Convert From (Adapter End): QSOP Convert To (Adapter End): DIP Number of Pins: 20 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock6,336	DIP	20	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
1107254-28	Aries Electronics	SOCKET ADAPTER DIP TO 28DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock23,976	DIP, 0.3" (7.62mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-