Page 8 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

97-AQ132D
Aries Electronics

SOCKET ADAPTER PQFP TO 132PGA

Package: -

Stock4,194
97-AQ132D-P
Aries Electronics

SCKT ADPT PQFP-132PGA PANELIZED

Package: -

Stock6,696
24-651000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.6

Package: -

Stock7,110
228-1277-29-0602J
3M

RECEPTACLE DIP SOCKET 28POS .6"

Package: -

Stock6,696
28-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

Package: -

Stock2,556
32-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Package: -

Stock7,200
20-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 20SOIC

Package: -

Stock3,150
32-650000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 32DIP 0.6

Package: -

Stock4,914
20-354W00-10
Aries Electronics

CONN ADAPTER 20PIN DIP TO SOWIC

Package: -

Stock3,294
20-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 20DIP 0.3

Package: -

Stock8,118
14-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 14DIP 0.3

Package: -

Stock6,102
18-665000-00
Aries Electronics

SCK ADAPT 18P SOIC-W TO SOIC 0.6

Package: -

Stock4,374
24-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 24SOWIC

Package: -

Stock4,968
16-35W000-11-RC-P (220 UP)
Aries Electronics

SOCKET ADAPT SOIC-W TO 16DIP 0.3

Package: -

Stock7,722
24-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

Package: -

Stock2,268
20-350001-10
Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

Package: -

Stock7,920
LCQT-QFP0.5-52
Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

Package: -

Stock2,268
16-350000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

Package: -

Stock8,010
264-4493-09-0602J
3M

SOCKET ADAPTER 64DIP TO 64DIP

Package: -

Stock5,004
248-1282-39-0602J
3M

RECEPTACLE DIP SOCKET 48POS .6"

Package: -

Stock4,032

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
97-AQ132D	Aries Electronics	SOCKET ADAPTER PQFP TO 132PGA Convert From (Adapter End): PQFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,194	PGA	132	0.025" (0.64mm)	Gold	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
97-AQ132D-P	Aries Electronics	SCKT ADPT PQFP-132PGA PANELIZED Convert From (Adapter End): PQFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,696	PGA	132	0.025" (0.64mm)	Gold	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
24-651000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,110	DIP, 0.6" (15.24mm) Row Spacing	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
228-1277-29-0602J	3M	RECEPTACLE DIP SOCKET 28POS .6" Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock6,696	DIP, 0.6" (15.24mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
28-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 28SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock2,556	SOIC	28	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
32-652000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,200	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-354000-20	Aries Electronics	SOCKET ADAPTER DIP TO 20SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,150	SOIC	20	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
32-650000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 32DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,914	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-354W00-10	Aries Electronics	CONN ADAPTER 20PIN DIP TO SOWIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,294	SOWIC	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 20DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,118	DIP, 0.3" (7.62mm) Row Spacing	20	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
14-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 14DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,102	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
18-665000-00	Aries Electronics	SCK ADAPT 18P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,374	SOIC	18	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
24-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 24SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,968	SOWIC	24	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP)	Aries Electronics	SOCKET ADAPT SOIC-W TO 16DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,722	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock2,268	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
20-350001-10	Aries Electronics	SOCKET ADAPTER SOJ TO 20DIP 0.3 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,920	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
LCQT-QFP0.5-52	Aries Electronics	SOCKET ADAPTER MULT PKG TO 52QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 52 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock2,268	QFP	52	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
16-350000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock8,010	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
264-4493-09-0602J	3M	SOCKET ADAPTER 64DIP TO 64DIP Convert From (Adapter End): DIP, 0.9" (22.86mm) Row Spacing Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing Number of Pins: 64 Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock5,004	DIP, 0.9" (22.86mm) Row Spacing	64	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
248-1282-39-0602J	3M	RECEPTACLE DIP SOCKET 48POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,032	-	-	-	-	-	-	-	-	-	-
PA-SSD6SM18-32	Logical Systems Inc.	ADAPTER 32TSSOP TO 32DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 32 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,542	DIP	32	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-SSOP20	Aries Electronics	SOCKET ADAPTER SSOP TO 20DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock8,226	DIP, 0.6" (15.24mm) Row Spacing	20	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
28-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,560	DIP, 0.3" (7.62mm) Row Spacing	28	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
PA-SOD3SM18-24	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 24DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock6,444	DIP	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-TSSOP20	Aries Electronics	SOCKET ADAPTER TSSOP TO 20DIP Convert From (Adapter End): TSSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock7,764	DIP, 0.6" (15.24mm) Row Spacing	20	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
28-650000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock18,396	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-650000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock20,064	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD3SM18-08	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 8DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock14,232	DIP	8	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-