Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

96-080M80
Aries Electronics

SOCKET ADAPTER QFP TO 80PGA

Package: -

Stock3,490
290-1294-09-0602J
3M

RECEPTACLE DIP SOCKET 90POS .9"

Package: -

Stock3,454
97-56001-P
Aries Electronics

SOCKET ADAPTER QFP TO 169PGA

Package: -

Stock3,744
84-505-110
Aries Electronics

SOCKET ADAPTER PLCC TO 84PGA

Package: -

Stock7,398
28-555000-00
Aries Electronics

SOCKET ADAPTER SSOP TO 28SOWIC

Package: -

Stock6,858
16-354000-21-RC
Aries Electronics

SOCKET ADAPTER DIP TO 16SOIC

Package: -

Stock7,524
24-354W00-20
Aries Electronics

DIP-TO-SOWIC ADAPTER

Package: -

Stock8,946
24-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Package: -

Stock3,654
16-307349-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 16DIP 0.3

Package: -

Stock7,596
1107254-36
Aries Electronics

SOCKET ADAPTER DIP TO 36DIP 0.3

Package: -

Stock8,442
26-665000-00
Aries Electronics

SCK ADAPT 26P SOIC-W TO SOIC 0.6

Package: -

Stock4,158
24-665000-00
Aries Electronics

SCK ADAPT 24P SOIC-W TO SOIC 0.6

Package: -

Stock3,204
7131-108-18
Aries Electronics

SOCKET ADAPT HB2E RELAY TO 8DIP

Package: -

Stock7,398
14-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 14SOWIC

Package: -

Stock6,822
28-505-111P
Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

Package: -

Stock7,902
232-1285-09-0602J
3M

RECEPTACLE DIP SOCKET 32POS .6"

Package: -

Stock4,014
PA-SSD3SM18-24
Logical Systems Inc.

SOCKET ADAPTER SSOP TO 24DIP

Package: -

Stock4,338
LCQT-QFP0.8-64
Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Package: -

Stock4,374
224-5248-19-0602J
3M

RECEPTACLE DIP SOCKET 24POS .3"

Package: -

Stock7,092
216-3340-19-0602J
3M

RECEPTACLE DIP SOCKET 16POS .3"

Package: -

Stock5,040

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
96-080M80	Aries Electronics	SOCKET ADAPTER QFP TO 80PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 80 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,490	PGA	80	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
290-1294-09-0602J	3M	RECEPTACLE DIP SOCKET 90POS .9" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock3,454	-	-	-	-	-	-	-	-	-	-
97-56001-P	Aries Electronics	SOCKET ADAPTER QFP TO 169PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 169 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,744	PGA	169	0.025" (0.64mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
84-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 84PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,398	PGA	84	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-555000-00	Aries Electronics	SOCKET ADAPTER SSOP TO 28SOWIC Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,858	SOWIC	28	0.026" (0.65mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
16-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 16SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock7,524	SOIC	16	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-354W00-20	Aries Electronics	DIP-TO-SOWIC ADAPTER Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock8,946	SOWIC	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 24DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,654	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
16-307349-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 16DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,596	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
1107254-36	Aries Electronics	SOCKET ADAPTER DIP TO 36DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 36 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock8,442	DIP, 0.3" (7.62mm) Row Spacing	36	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
26-665000-00	Aries Electronics	SCK ADAPT 26P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 26 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,158	SOIC	26	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
24-665000-00	Aries Electronics	SCK ADAPT 24P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,204	SOIC	24	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
7131-108-18	Aries Electronics	SOCKET ADAPT HB2E RELAY TO 8DIP Convert From (Adapter End): HB2E Relay Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,398	DIP, 0.3" (7.62mm) Row Spacing	8	-	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
14-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 14SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,822	SOWIC	14	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-505-111P	Aries Electronics	SOCKET ADAPTER PLCC TO 28PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,902	PGA	28	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
232-1285-09-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,014	-	-	-	-	-	-	-	-	-	-
PA-SSD3SM18-24	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 24DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,338	DIP	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-QFP0.8-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock4,374	QFP	64	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
224-5248-19-0602J	3M	RECEPTACLE DIP SOCKET 24POS .3" Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock7,092	DIP, 0.3" (7.62mm) Row Spacing	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
216-3340-19-0602J	3M	RECEPTACLE DIP SOCKET 16POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock5,040	-	-	-	-	-	-	-	-	-	-
PA44QL8-1D	Logical Systems Inc.	ADAPTER 44QFP TO 44DIP Convert From (Adapter End): QFP Convert To (Adapter End): DIP Number of Pins: 44 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,542	DIP	44	-	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
220-3342-09-0602J	3M	SOCKET ADAPTER 20DIP TO 20DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock6,048	DIP, 0.3" (7.62mm) Row Spacing	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
1110748	Aries Electronics	SOCKET ADAPTER SOT25 TO 6DIP 0.3 Convert From (Adapter End): SOT-25 Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,680	DIP, 0.3" (7.62mm) Row Spacing	6	0.037" (0.95mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
LCQT-SOIC20W	Aries Electronics	SOCKET ADAPTER SOIC-W TO 20DIP Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock5,760	DIP, 0.6" (15.24mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
14-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock13,884	DIP, 0.3" (7.62mm) Row Spacing	14	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
LCQT-SOIC28	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock21,228	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
PA-MSD3SM18-08	Logical Systems Inc.	SOCKET ADAPTER MSOP TO 8DIP Convert From (Adapter End): MSOP Convert To (Adapter End): DIP Number of Pins: 8 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock6,288	DIP	8	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-SOT23-6	Aries Electronics	SOCKET ADAPTER SOT-23 TO 6DIP Convert From (Adapter End): SOT-23 Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock16,086	DIP, 0.6" (15.24mm) Row Spacing	6	0.037" (0.95mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass