Page 13 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

96-128M80
Aries Electronics

QFP TO PGA 128 PIN

Package: -

Stock6,624
68-652000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Package: -

Stock8,802
32-650000-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.6

Package: -

Stock3,204
32-450001-10-P
Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.4

Package: -

Stock7,488
28-653000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

Package: -

Stock3,060
32-655000-10
Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP 0.6

Package: -

Stock4,932
18-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Package: -

Stock5,562
44-305263-20
Aries Electronics

SOCKET ADAPTER QFP TO 44PLCC

Package: -

Stock4,914
218-3341-09-0602J
3M

SOCKET ADAPTER 18DIP TO 18DIP

Package: -

Stock3,690
08-305479-10
Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

Package: -

Stock4,032
08-350000-11-RC-P
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Package: -

Stock4,050
PA-SOD6SM18-32
Logical Systems Inc.

ADAPTER 32SOIC TO 32DIP

Package: -

Stock7,776
16-351000-11-RC
Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.3

Package: -

Stock4,086
14-351000-11-RC
Aries Electronics

SOCKET ADAPTER SSOP TO 14DIP 0.3

Package: -

Stock6,012
20-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

Package: -

Stock8,802
16-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 16SOWIC

Package: -

Stock7,488
PA-SSD3SM18-20
Logical Systems Inc.

SOCKET ADAPTER SSOP TO 20DIP

Package: -

Stock8,568

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
96-128M80	Aries Electronics	QFP TO PGA 128 PIN Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 128 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,624	PGA	128	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
68-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,802	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
32-650000-11-RC	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.6 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,204	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
32-450001-10-P	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.4 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,488	DIP, 0.4" (10.16mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	FR4 Epoxy Glass
28-653000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,060	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
32-655000-10	Aries Electronics	SOCKET ADAPTER TSOP TO 32DIP 0.6 Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Silver Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,932	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	Silver	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-354000-10	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock5,562	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
44-305263-20	Aries Electronics	SOCKET ADAPTER QFP TO 44PLCC Convert From (Adapter End): QFP Convert To (Adapter End): PLCC Number of Pins: 44 Pitch - Mating: 0.024" (0.60mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,914	PLCC	44	0.024" (0.60mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
218-3341-09-0602J	3M	SOCKET ADAPTER 18DIP TO 18DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock3,690	DIP, 0.3" (7.62mm) Row Spacing	18	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
08-305479-10	Aries Electronics	SOCKET ADAPTER SOIC TO TO-8 Convert From (Adapter End): SOIC Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,032	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
08-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock4,050	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
PA-SOD6SM18-32	Logical Systems Inc.	ADAPTER 32SOIC TO 32DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,776	-	-	-	-	-	-	-	-	-	-
16-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 16DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,086	DIP, 0.3" (7.62mm) Row Spacing	16	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
14-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 14DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,012	DIP, 0.3" (7.62mm) Row Spacing	14	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
20-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 20DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock8,802	DIP, 0.3" (7.62mm) Row Spacing	20	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
16-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 16SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,488	SOWIC	16	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SSD3SM18-20	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 20DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,568	DIP	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-