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NXP |
MOSFET P-CH 12V 0.75A SOT-23
- FET Type: P-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 12V
- Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
- Vgs(th) (Max) @ Id: 680mV @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 3.8nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 200pF @ 9.6V
- Vgs (Max): ±8V
- FET Feature: -
- Power Dissipation (Max): 417mW (Ta)
- Rds On (Max) @ Id, Vgs: 400 mOhm @ 430mA, 4.5V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: TO-236AB (SOT23)
- Package / Case: TO-236-3, SC-59, SOT-23-3
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,032 |
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NXP |
MOSFET N-CH 7V 30MA SOT143
- Transistor Type: N-Channel Dual Gate
- Frequency: 200MHz
- Gain: -
- Voltage - Test: 4V
- Current Rating: 30mA
- Noise Figure: 1dB
- Current - Test: 10mA
- Power - Output: -
- Voltage - Rated: 7V
- Package / Case: SOT-143R
- Supplier Device Package: SOT-143R
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Package: SOT-143R |
Stock6,416 |
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NXP |
TRANS NPN 4.5V 21GHZ SOT343R
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 4.5V
- Frequency - Transition: 21GHz
- Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
- Gain: 16dB
- Power - Max: 360mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
- Current - Collector (Ic) (Max): 250mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-82A, SOT-343
- Supplier Device Package: CMPAK-4
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Package: SC-82A, SOT-343 |
Stock2,720 |
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NXP |
IC SBC CAN/LIN 48LQFP
- Applications: Power Supply, Automotive Applications
- Voltage - Input: -1 V ~ 40 V
- Number of Outputs: 6
- Voltage - Output: Multiple
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock3,136 |
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NXP |
IC 4BIT 1OF2 MUX/DEMUX 16QSOP
- Type: Multiplexer/Demultiplexer
- Circuit: 4 x 2:1
- Independent Circuits: 1
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.154", 3.90mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.154", 3.90mm Width) |
Stock4,528 |
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NXP |
IC GATE NOR 3CH 3-INP 14-DIP
- Logic Type: NOR Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 3 V ~ 15 V
- Current - Quiescent (Max): 4µA
- Current - Output High, Low: 3mA, 3mA
- Logic Level - Low: 1.5 V ~ 4 V
- Logic Level - High: 3.5 V ~ 11 V
- Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,960 |
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NXP |
IC 16BIT BUFF/LINE DRIVER 52QFP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 52-QFP
- Supplier Device Package: 52-QFP (10x10)
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Package: 52-QFP |
Stock6,496 |
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NXP |
IC AMP MODULE 750MHZ SOT115J
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 425mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115J
- Supplier Device Package: SOT115J
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Package: SOT-115J |
Stock6,752 |
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NXP |
IC AMP AUDIO .08W STER AB 8SOIC
- Type: Class AB
- Output Type: Headphones, 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
- Voltage - Supply: 3 V ~ 7 V, ±1.5 V ~ 3.5 V
- Features: Depop, Short-Circuit Protection
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 8-SO
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,760 |
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NXP |
IC REDRIVER I2C 1CH 8TSSOP
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 1
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: -
- Voltage - Supply: 2.5 V ~ 5.5 V
- Current - Supply: 9mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package: 8-TSSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,032 |
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NXP |
IC I/O EXPANDER I2C 8B 16TSSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: No
- Features: EEPROM, POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.5 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,000 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,624 |
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NXP |
IC MPU MPC83XX 400MHZ 672TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 672-LBGA
- Supplier Device Package: 672-TBGA (35x35)
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Package: 672-LBGA |
Stock3,600 |
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NXP |
IC MPU Q OR IQ 800MHZ 520FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SC3850
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 520-FBGA, FCBGA
- Supplier Device Package: 520-FCBGA (21x21)
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Package: 520-FBGA, FCBGA |
Stock4,000 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 125MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 177
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 20x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock2,384 |
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NXP |
IC MCU 8BIT 4KB FLASH 20SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 15
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
- Data Converters: A/D 12x8b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock5,904 |
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NXP |
IC MCU 8BIT 32KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock4,272 |
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NXP |
IC MCU 32BIT 1MB FLASH 100TFBGA
- Core Processor: ARM? Cortex?-M4/M0
- Core Size: 32-Bit Dual-Core
- Speed: 204MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
- Number of I/O: 49
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 136K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 4x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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Package: 100-TFBGA |
Stock5,744 |
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NXP |
IC MCU 32BIT 128KB FLASH 35WLCSP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 9x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 35-UFBGA, WLCSP
- Supplier Device Package: 35-WLCSP (2.53x2.98)
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Package: 35-UFBGA, WLCSP |
Stock6,160 |
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NXP |
IC MCU 8BIT 8KB FLASH 20SOIC
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 17
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock6,976 |
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NXP |
ACCELEROMETER 125G PCM/SPI 16QFN
- Type: Digital
- Axis: X
- Acceleration Range: ±125g
- Sensitivity (LSB/g): 4.096
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: PCM, SPI
- Voltage - Supply: 4 V ~ 20 V
- Features: Selectable Low Pass Filter
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-QFN
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN |
Stock2,898 |
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NXP |
TYPE-C USB-PD PHY WITH TCPC FOR
- Applications: USB
- Interface: I²C
- Voltage - Supply: 2.7 V ~ 5.5 V
- Package / Case: 16-XFQFN Exposed Pad
- Supplier Device Package: 16-HX2QFN (2.6x2.6)
- Mounting Type: Surface Mount
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Package: 16-XFQFN Exposed Pad |
Stock2,784 |
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NXP |
I.MX 6SL ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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Package: 432-TFBGA |
Stock6,612 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 28x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,400 |
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NXP |
KINETIS KE02: 40MHZ CORTEX-M0+ 5
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I²C, SPI, UART/USART
- Peripherals: LVD, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 2x6b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock6,976 |
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NXP |
S12Z, 64LQFP-EP, 192K FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 1.5MB FLASH 100LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I2C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 50x10/12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: - |
Request a Quote |
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NXP |
IC
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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