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NXP |
FET RF 65V 2.11GHZ NI780S-6
- Transistor Type: LDMOS
- Frequency: 2.11GHz
- Gain: 16.7dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.5A
- Power - Output: 50W
- Voltage - Rated: 65V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S-6
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Package: NI-780S |
Stock3,568 |
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NXP |
TRANS PREBIAS PNP 250MW SMT3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 4.7k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 250mW
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock5,360 |
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NXP |
IC LCD DRIVER UNIV UNCASED
- Display Type: LCD
- Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
- Interface: I2C
- Digits or Characters: 20 Characters, 35 Characters, 320 Elements
- Current - Supply: 3µA
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock3,984 |
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NXP |
IC XLATR PECL-LVDS LOGIC 8-SOIC
- Translator Type: Mixed Signal
- Channel Type: Unidirectional
- Number of Circuits: 1
- Channels per Circuit: 1
- Voltage - VCCA: -
- Voltage - VCCB: -
- Input Signal: PECL
- Output Signal: LVDS
- Output Type: Differential
- Data Rate: 800Mbps
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,224 |
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NXP |
IC GATE NAND 4CH 2-INP 14-TSSOP
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: Open Drain
- Voltage - Supply: 1.2 V ~ 5.5 V
- Current - Quiescent (Max): 40µA
- Current - Output High, Low: -, 32mA
- Logic Level - Low: 0.7 V ~ 0.8 V
- Logic Level - High: 1.7 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock6,640 |
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NXP |
IC COMPARATOR LOW VOLTAGE 6XSON
- Type: General Purpose
- Number of Elements: 1
- Output Type: Rail-to-Rail
- Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
- Voltage - Input Offset (Max): 30mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 6µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 800ns
- Hysteresis: 20mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 6-XFDFN
- Mounting Type: Surface Mount
- Supplier Device Package: 6-XSON, SOT891 (1x1)
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Package: 6-XFDFN |
Stock2,464 |
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NXP |
IC ANALOG SWITCH SPST XSON8U
- Switch Circuit: SPST - NC
- Multiplexer/Demultiplexer Circuit: 1:1
- Number of Circuits: 2
- On-State Resistance (Max): 750 mOhm
- Channel-to-Channel Matching (ΔRon): 20 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 24ns, 7ns
- -3db Bandwidth: 60MHz
- Charge Injection: 6pC
- Channel Capacitance (CS(off), CD(off)): 35pF
- Current - Leakage (IS(off)) (Max): 10nA
- Crosstalk: -90dB @ 100kHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 8-XFDFN
- Supplier Device Package: 8-XSON, SOT996-2 (2x3)
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Package: 8-XFDFN |
Stock3,680 |
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NXP |
IC MCU 32BIT 128KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 64
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 24x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock5,280 |
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NXP |
IC MCU 16BIT 128KB FLASH 48QFN
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock4,608 |
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NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 50
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 104K x 8
- Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock9,660 |
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NXP |
TVS DIODE 5.6VWM SOT353
- Type: Zener
- Unidirectional Channels: 4
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 5.6V
- Voltage - Breakdown (Min): -
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: 24W
- Power Line Protection: No
- Applications: General Purpose
- Capacitance @ Frequency: 240pF @ 1MHz
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Supplier Device Package: SOT-353
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Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock5,562 |
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NXP |
ACCELEROMETER 10BIT SPI 16QFN
- Type: Digital
- Axis: X, Y
- Acceleration Range: ±120g
- Sensitivity (LSB/g): 4.096
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: SPI
- Voltage - Supply: 3.135 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN Exposed Pad |
Stock8,946 |
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NXP |
IC I-CODE ILT UNCASED WAFER
- Type: RFID Transponder
- Frequency: 13.56MHz
- Standards: ISO 15693, ISO 18000-3
- Interface: -
- Voltage - Supply: 1.5 V ~ 1.7 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Die
- Supplier Device Package: Wafer
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Package: Die |
Stock2,376 |
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NXP |
EVAL BOARD FOR BGA2003
- Type: Amplifier
- Frequency: 1.8GHz
- For Use With/Related Products: BGA2003
- Supplied Contents: Board
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Package: - |
Stock8,208 |
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NXP |
FS4500
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock4,128 |
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NXP |
POWER MANAGEMENT IC I.MX7 PRE-
- Applications: i.MX Processors
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,108 |
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NXP |
S32K144 32-BIT MCU, ARM
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock7,608 |
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NXP |
150MHZ ARM CORTEX 1.3
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit
- Speed: 150MHz
- Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
- Peripherals: DMA, I²S, PWM, WDT
- Number of I/O: 120
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1M x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b
- Oscillator Type: Internal/External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 169-LFBGA
- Supplier Device Package: 169-MAPBGA (9x9)
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Package: 169-LFBGA |
Stock5,456 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 33x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock4,880 |
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NXP |
KINETIS KL16: 48MHZ CORTEX-M0+ U
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, LINbus, SPI, TSI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D - 16bit, D/A - 12bit
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LFBGA
- Supplier Device Package: 64-MAPBGA (5x5)
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Package: 64-LFBGA |
Stock2,800 |
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NXP |
S12 CORE64K FLASHAU
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,512 |
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NXP |
IC MPU QORIQ 2.1GHZ 1292FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 8 Core, 64-Bit
- Speed: 2.1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 10GbE (8), 2.5GbE (16)
- SATA: SATA (2)
- USB: USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1292-BBGA, FCBGA
- Supplier Device Package: 1292-FCPBGA (37.5x37.5)
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Package: - |
Request a Quote |
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NXP |
IC MPU QORIQ T4 1.3GHZ 1932BGA
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 16 Core, 64-Bit
- Speed: 1.3GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1Gbps (13), 10Gbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FCPBGA (45x45)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 3MB FLASH 100MAPBGA
- Core Processor: e200z4
- Core Size: 32-Bit Single-Core
- Speed: 160MHz
- Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 65
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 384K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LFBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Package: - |
Request a Quote |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC OP AMP CLASS D 100LQFP
- Type: -
- Output Type: -
- Max Output Power x Channels @ Load: -
- Voltage - Supply: -
- Features: -
- Mounting Type: -
- Operating Temperature: -
- Supplier Device Package: -
- Package / Case: -
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Package: - |
Request a Quote |
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NXP |
S32K142 ARM CORTEX-M4F, 80 MHZ,
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SAFETY SYSTEM BASIS CHIP FOR DOM
- Applications: Camera
- Current - Supply: -
- Voltage - Supply: 36V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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