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NXP |
MOSFET 2P-CH 20V 3.5A SOT1118
- FET Type: 2 P-Channel (Dual)
- FET Feature: Logic Level Gate
- Drain to Source Voltage (Vdss): 20V
- Current - Continuous Drain (Id) @ 25°C: 3.5A
- Rds On (Max) @ Id, Vgs: 70 mOhm @ 1A, 4.5V
- Vgs(th) (Max) @ Id: 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
- Power - Max: 520mW
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 6-UDFN Exposed Pad
- Supplier Device Package: DFN2020-6
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Package: 6-UDFN Exposed Pad |
Stock162,000 |
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NXP |
TRANS PNP 40V 1A SOT-666
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 1A
- Voltage - Collector Emitter Breakdown (Max): 40V
- Vce Saturation (Max) @ Ib, Ic: 310mV @ 100mA, 1A
- Current - Collector Cutoff (Max): 100nA
- DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100mA, 5V
- Power - Max: 500mW
- Frequency - Transition: 150MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SOT-563, SOT-666
- Supplier Device Package: SOT-666
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Package: SOT-563, SOT-666 |
Stock2,752 |
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NXP |
IC SWITCH LO SIDE 6OUT 32-QFN
- Switch Type: General Purpose
- Number of Outputs: 6
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: SPI, Parallel
- Voltage - Load: 8 V ~ 25 V
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Current - Output (Max): -
- Rds On (Typ): 400 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 32-VQFN Exposed Pad
- Supplier Device Package: 32-QFN-EP (7x7)
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Package: 32-VQFN Exposed Pad |
Stock4,528 |
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NXP |
IC BUFFER 1.8V 25BIT SOT536-1
- Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
- Supply Voltage: 1.7 V ~ 1.9 V
- Number of Bits: 25, 14
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock3,712 |
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NXP |
IC DUAL 4BIT SHIFT REGIST 16SSOP
- Logic Type: Shift Register
- Output Type: Push-Pull
- Number of Elements: 2
- Number of Bits per Element: 4
- Function: Serial to Parallel
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.209", 5.30mm Width) |
Stock3,072 |
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NXP |
IC SHIFT REGISTER 8BIT 14SOIC
- Logic Type: Shift Register
- Output Type: Push-Pull
- Number of Elements: 1
- Number of Bits per Element: 8
- Function: Serial to Parallel
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock5,040 |
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NXP |
IC TRANSCVR 8BIT N-INV 24TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock7,584 |
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NXP |
IC AMP AUDIO PWR 6W STER 18HDIP
- Type: Class B
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 18-HDIP
- Package / Case: 18-DIP (0.300", 7.62mm) Exposed Pad
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Package: 18-DIP (0.300", 7.62mm) Exposed Pad |
Stock4,640 |
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NXP |
IC I/O EXPANDER I2C 8B 16TSSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock12,228 |
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NXP |
IC MPU MPC83XX 400MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock2,320 |
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NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock3,184 |
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NXP |
IC MPU MPC82XX 300MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM, Security; SEC
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock3,072 |
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NXP |
IC MPU E600 DUAL CORE 1023FCCBGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BCBGA, FCCBGA
- Supplier Device Package: 1023-FCCBGA (33x33)
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Package: 1023-BCBGA, FCCBGA |
Stock2,064 |
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NXP |
IC MPU I.MX6S 800MHZ 624MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Package: 624-LFBGA |
Stock5,584 |
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NXP |
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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Package: 432-TFBGA |
Stock14,694 |
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NXP |
IC MCU 8BIT 8KB OTP 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: POR, PWM
- Number of I/O: 32
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock6,944 |
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NXP |
IC MCU 8BIT 8KB FLASH 20SOIC
- Core Processor: RS08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 254 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock5,584 |
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NXP |
IC MCU 8BIT 8KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 13
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,344 |
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NXP |
IC MCU 32BIT 512KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 94
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 41x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock4,000 |
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NXP |
IC CLK BUFFER 1:10 400MHZ 20SSOP
- Type: Fanout Buffer (Distribution)
- Number of Circuits: 1
- Ratio - Input:Output: 1:10
- Differential - Input:Output: No/No
- Input: LVCMOS, LVTTL
- Output: LVTTL
- Frequency - Max: 400MHz
- Voltage - Supply: 2.3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock2,160 |
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NXP |
IC RADIO SIGNAL PROC 44-QFP
- Function: Audio Tone Processor
- Applications: Automotive Audio
- Number of Channels: 6
- Interface: I2C
- Voltage - Supply: 8 V ~ 9 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Specifications: AM, FM
- Package / Case: 44-QFP
- Supplier Device Package: 44-PQFP (10x10)
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Package: 44-QFP |
Stock6,864 |
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NXP |
SENSOR PRESSURE AXIAL SO8 SMD
- Pressure Type: Vented Gauge
- Operating Pressure: 1.45 PSI (10 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 55 mV (3V)
- Accuracy: -
- Voltage - Supply: 3 V ~ 6 V
- Port Size: Male - 0.22" (5.59mm) Tube
- Port Style: Barbless
- Features: -
- Termination Style: PCB
- Maximum Pressure: 10.88 PSI (75 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SMD Module
- Supplier Device Package: -
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Package: 8-SMD Module |
Stock7,812 |
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NXP |
MOD ANGLE SENSOR MAGN 2CH SIL4
- For Measuring: Angle
- Technology: Magnetoresistive
- Rotation Angle - Electrical, Mechanical: 0° ~ 180°
- Linear Range: -
- Output: Analog Voltage
- Output Signal: -
- Actuator Type: External Magnet Not Included
- Linearity: ±1.2°
- Resistance: -
- Resistance Tolerance: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Mounting Type: Through Hole
- Termination Style: PC Pin
- Operating Temperature: -40°C ~ 160°C
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Package: - |
Stock7,416 |
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NXP |
IC READER 32-HVQFN
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443, MIFARE
- Interface: I2C, SPI, UART
- Voltage - Supply: 2.5 V ~ 3.3 V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock5,850 |
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NXP |
TRANSPONDER RFIC HITAG S UNCASED
- Type: RFID Transponder
- Frequency: 100kHz ~ 150kHz
- Standards: -
- Interface: -
- Voltage - Supply: 3.5V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock2,088 |
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NXP |
SMART CHARGING PROTOCOL CONTR US
- Output Isolation: -
- Internal Switch(s): -
- Voltage - Breakdown: -
- Topology: -
- Voltage - Start Up: -
- Voltage - Supply (Vcc/Vdd): -
- Duty Cycle: -
- Frequency - Switching: -
- Power (Watts): -
- Fault Protection: -
- Control Features: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock4,528 |
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NXP |
NXP 32-BIT MCU, TRIPLE CORE, 6MB
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz
- Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, LVD, I2S, POR, WDT
- Number of I/O: 246
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
- Data Converters: A/D 80x10b, 64x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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